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Spartan-3E FPGA Family: Complete Data Sheet
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DS312 November 9, 2006
Product Specification
Module 1: Introduction and Ordering Information
DS312-1 (v3.4) November 9, 2006 * * * * * Introduction Features Architectural Overview Package Marking Ordering Information
Module 3: DC and Switching Characteristics
DS312-3 (v3.4) November 9, 2006 * DC Electrical Characteristics - Absolute Maximum Ratings - Supply Voltage Specifications - Recommended Operating Conditions - DC Characteristics Switching Characteristics - I/O Timing - SLICE Timing - DCM Timing - Block RAM Timing - Multiplier Timing - Configuration and JTAG Timing
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Module 2: Functional Description
DS312-2 (v3.4) November 9, 2006 * Input/Output Blocks (IOBs) - Overview - SelectIOTM Signal Standards Configurable Logic Block (CLB) Block RAM Dedicated Multipliers Digital Clock Manager (DCM) Clock Network Configuration Powering Spartan-3E FPGAs Production Stepping
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Module 4: Pinout Descriptions
DS312-4 (v3.4) November 9, 2006 * * * * Pin Descriptions Package Overview Pinout Tables Footprint Diagrams
(c) 2005-2006 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners.
DS312 November 9, 2006
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Complete Data Sheet
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DS312 November 9, 2006 Product Specification
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Spartan-3E FPGA Family: Introduction and Ordering Information
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DS312-1 (v3.4) November 9, 2006
Product Specification
Introduction
The SpartanTM-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The five-member family offers densities ranging from 100,000 to 1.6 million system gates, as shown in Table 1. The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. These Spartan-3E enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry. Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment. The Spartan-3E family is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs. True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O - Enhanced Double Data Rate (DDR) support - DDR SDRAM support up to 333 Mb/s Abundant, flexible logic resources - Densities up to 33,192 logic cells, including optional shift register or distributed RAM support - Efficient wide multiplexers, wide logic - Fast look-ahead carry logic - Enhanced 18 x 18 multipliers with optional pipeline - IEEE 1149.1/1532 JTAG programming/debug port Hierarchical SelectRAMTM memory architecture - Up to 648 Kbits of fast block RAM - Up to 231 Kbits of efficient distributed RAM Up to eight Digital Clock Managers (DCMs) - Clock skew elimination (delay locked loop) - Frequency synthesis, multiplication, division - High-resolution phase shifting - Wide frequency range (5 MHz to over 300 MHz) Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing Configuration interface to industry-standard PROMs - Low-cost, space-saving SPI serial Flash PROM - x8 or x8/x16 parallel NOR Flash PROM - Low-cost Xilinx Platform Flash with JTAG Complete Xilinx ISETM and WebPACKTM development system support MicroBlazeTM and PicoBlazeTM embedded processor cores Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices) Low-cost QFP and BGA packaging options - Common footprints support easy density migration - Pb-free packaging options -
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Features
* Very low cost, high-performance logic solution for high-volume, consumer-oriented applications * Proven advanced 90-nanometer process technology * Multi-voltage, multi-standard SelectIOTM interface pins - Up to 376 I/O pins or 156 differential signal pairs - LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards - 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling - 622+ Mb/s data transfer rate per I/O Table 1: Summary of Spartan-3E FPGA Attributes
CLB Array (One CLB = Four Slices) Equivalent Total Total Logic System Rows Columns CLBs Slices Cells Gates 100K 250K 500K 1200K 2,160 5,508 10,476 19,512 22 34 46 60 16 26 34 46 240 612 1,164 2,168 3,688 960 2,448 4,656 8,672 14,752
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Device XC3S100E XC3S250E XC3S500E XC3S1200E
Distributed RAM bits(1) 15K 38K 73K 136K 231K
Block RAM bits(1) 72K 216K 360K 504K 648K
Dedicated Multipliers DCMs 4 12 20 28 36 2 4 4 8 8
Maximum Maximum Differential I/O Pairs User I/O 108 172 232 304 376 40 68 92 124 156
XC3S1600E 1600K 33,192 76 58 Notes: 1. By convention, one Kb is equivalent to 1,024 bits.
(c) 2005-2006 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners.
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Introduction and Ordering Information
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Architectural Overview
The Spartan-3E family architecture consists of five fundamental programmable functional elements: * Configurable Logic Blocks (CLBs) contain flexible Look-Up Tables (LUTs) that implement logic plus storage elements used as flip-flops or latches. CLBs perform a wide variety of logical functions as well as store data. Input/Output Blocks (IOBs) control the flow of data between the I/O pins and the internal logic of the device. Each IOB supports bidirectional data flow plus 3-state operation. Supports a variety of signal standards, including four high-performance differential standards. Double Data-Rate (DDR) registers are included. Block RAM provides data storage in the form of 18-Kbit dual-port blocks. Multiplier Blocks accept two 18-bit binary numbers as inputs and calculate the product. * Digital Clock Manager (DCM) Blocks provide self-calibrating, fully digital solutions for distributing, delaying, multiplying, dividing, and phase-shifting clock signals.
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These elements are organized as shown in Figure 1. A ring of IOBs surrounds a regular array of CLBs. Each device has two columns of block RAM except for the XC3S100E, which has one column. Each RAM column consists of several 18-Kbit RAM blocks. Each block RAM is associated with a dedicated multiplier. The DCMs are positioned in the center with two at the top and two at the bottom of the device. The XC3S100E has only one DCM at the top and bottom, while the XC3S1200E and XC3S1600E add two DCMs in the middle of the left and right sides. The Spartan-3E family features a rich network of traces that interconnect all five functional elements, transmitting signals among them. Each functional element has an associated switch matrix that permits multiple connections to the routing.
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Notes:
1. The XC3S1200E and XC3S1600E have two additional DCMs on both the left and right sides as indicated by the dashed lines. The XC3S100E has only one DCM at the top and one at the bottom.
Figure 1: Spartan-3E Family Architecture
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Introduction and Ordering Information
Configuration
Spartan-3E FPGAs are programmed by loading configuration data into robust, reprogrammable, static CMOS configuration latches (CCLs) that collectively control all functional elements and routing resources. The FPGA's configuration data is stored externally in a PROM or some other non-volatile medium, either on or off the board. After applying power, the configuration data is written to the FPGA using any of seven different modes: * * * * * * Master Serial from a Xilinx Platform Flash PROM Serial Peripheral Interface (SPI) from an industry-standard SPI serial Flash Byte Peripheral Interface (BPI) Up or Down from an industry-standard x8 or x8/x16 parallel NOR Flash Slave Serial, typically downloaded from a processor Slave Parallel, typically downloaded from a processor Boundary Scan (JTAG), typically downloaded from a processor or system tester.
I/O Capabilities
The Spartan-3E FPGA SelectIO interface supports many popular single-ended and differential standards. Table 2 shows the number of user I/Os as well as the number of differential I/O pairs available for each device/package combination. Spartan-3E FPGAs support the following single-ended standards: * * * * * 3.3V low-voltage TTL (LVTTL) Low-voltage CMOS (LVCMOS) at 3.3V, 2.5V, 1.8V, 1.5V, or 1.2V 3V PCI at 33 MHz, and in some devices, 66 MHz HSTL I and III at 1.8V, commonly used in memory applications SSTL I at 1.8V and 2.5V, commonly used for memory applications
Spartan-3E FPGAs support the following differential standards: * * * * * * * LVDS Bus LVDS mini-LVDS RSDS Differential HSTL (1.8V, Types I and III) Differential SSTL (2.5V and 1.8V, Type I) 2.5V LVPECL inputs
Table 2: Available User I/Os and Differential (Diff) I/O Pairs
VQ100 VQG100 Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Notes:
1. 2. All Spartan-3E devices provided in the same package are pin-compatible as further described in Module 4: Pinout Descriptions. The number shown in bold indicates the maximum number of I/O and input-only pins. The number shown in (italics) indicates the number of input-only pins.
CP132 CPG132 User 83 (11) 92 (7) 92 (7) Diff 35 (2) 41 (2) 41 (2) -
TQ144 TQG144 User 108 (28) 108 (28) Diff 40 (4) 40 (4) -
PQ208 PQG208 User 158 (32) 158 (32) Diff 65 (5) 65 (5) -
FT256 FTG256 User 172 (40) 190 (41) 190 (40) Diff 68 (8) 77 (8) 77 (8) -
FG320 FGG320 User 232 (56) 250 (56) 250 (56) Diff 92 (12) 99 (12) 99 (12)
FG400 FGG400 User 304 (72) 304 (72) Diff 124 (20) 124 (20)
FG484 FGG484 User 376 (82) Diff 156 (21)
User 66 (7) 66 (7) -
Diff 30 (2) 30 (2) -
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Introduction and Ordering Information
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Package Marking
Figure 2 provides a top marking example for Spartan-3E FPGAs in the quad-flat packages. Figure 3 shows the top marking for Spartan-3E FPGAs in BGA packages except the 132-ball chip-scale package (CP132 and CPG132). The markings for the BGA packages are nearly identical to those for the quad-flat packages, except that the marking is rotated with respect to the ball A1 indicator. Figure 4 shows the top marking for Spartan-3E FPGAs in the CP132 and CPG132 packages. Use the seven digits of the Lot Code to access additional information for a specific device using the Xilinx web-based Genealogy Viewer. On the QFP and BGA packages, the optional numerical Stepping Code follows the Lot Code. If no Stepping Code appears, then the device is Stepping 0. The "5C" and "4I" part combinations may be dual marked as "5C/4I". All "5C" and "4I" part combinations use the Stepping 1 production silicon and have a `1' Stepping Code mark.
Mask Revision Code Fabrication Code
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SPARTAN
Device Type Package Speed Grade Temperature Range
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Process Technology Date Code Stepping Code (optional) Lot Code
XC3S250E TM PQ208AGQ0525 D1234567A 4C
Pin P1
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Figure 2: Spartan-3E QFP Package Marking Example
Mask Revision Code
BGA Ball A1 Device Type Package
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SPARTAN
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Fabrication Code Process Code
XC3S250ETM FT256AGQ0525 D1234567A 4C
Date Code
Stepping Code (optional)
Lot Code
Speed Grade Temperature Range
DS312-1_02_090105
Figure 3: Spartan-3E BGA Package Marking Example
Ball A1 Lot Code
3S250E F1234567-0525 PHILIPPINES
Device Type Date Code Temperature Range
Package C5 = CP132 C6 = CPG132
C5AGQ
4C
Speed Grade Process Code Fabrication Code
DS312-1_05_032105
Mask Revision Code
Figure 4: Spartan-3E CP132 and CPG132 Package Marking Example
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Introduction and Ordering Information ture ranges. Both the standard -4 and faster -5 speed grades are available for the Commercial temperature range. However, only the -4 speed grade is available for the Industrial temperature range. See Table 2 for valid device/package combinations.
Ordering Information
Spartan-3E FPGAs are available in both standard and Pb-free packaging options for all device/package combinations. All devices are available in Pb-free packages, which adds a `G' character to the ordering code. All devices are available in either Commercial (C) or Industrial (I) temperaStandard Packaging
Example:
Device Type Speed Grade Package Type
XC3S250E -4 FT 256 C S1 (additional code to specify Stepping 1)
Temperature Range: C = Commercial (TJ = 0oC to 85oC) I = Industrial (TJ = -40oC to 100oC) Number of Pins
DS312_03_111805
Pb-Free Packaging
Example:
Device Type Speed Grade Package Type
XC3S250E -4 FT G 256 C S1 (additional code to specify Stepping 1)
Temperature Range: C = Commercial (TJ = 0oC to 85oC) I = Industrial (TJ = -40oC to 100oC) Number of Pins Pb-free DS312_04_111805
Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
Speed Grade -4 Standard Performance -5 High Performance
Package Type / Number of Pins VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP) CP(G)132 132-ball Chip-Scale Package (CSP) TQ(G)144 144-pin Thin Quad Flat Pack (TQFP) PQ(G)208 208-pin Plastic Quad Flat Pack (PQFP) FT(G)256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) FG(G)320 320-ball Fine-Pitch Ball Grid Array (FBGA) FG(G)400 400-ball Fine-Pitch Ball Grid Array (FBGA) FG(G)484 484-ball Fine-Pitch Ball Grid Array (FBGA)
Temperature Range (TJ ) C Commercial (0C to 85C) I Industrial (-40C to 100C)
Notes:
1. The -5 speed grade is exclusively available in the Commercial temperature range.
Production Stepping
The Spartan-3E FPGA family uses production stepping to indicate improved capabilities or enhanced features. All devices ordered using the standard part number support Stepping 0 functionality and performance. Later steppings are, by definition, a functional superset of any previous stepping. Furthermore, configuration bitstreams generated for any stepping are forward compatible. See Table 71 for additional details. Xilinx ships both Stepping 0 and Stepping 1. Designs operating on the Stepping 0 devices perform similarly on a Stepping 1 device. To specify only the later stepping, append an S# suffix to the standard ordering code, where # is the stepping number, as indicated in Table 3. Table 3: Spartan-3E Stepping Levels Stepping Number 0 1 Suffix Code None or S0 S1 Status Production Production
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Introduction and Ordering Information Beginning with Stepping 1 and later, the stepping level is marked on the device using a single number character, as
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shown in Figure 2, Figure 3, and Figure 4. Stepping 0 devices are represented with either a `0' mark or no mark.
Revision History
The following table shows the revision history for this document. Date 03/01/05 03/21/05 Version 1.0 1.1 Initial Xilinx release. Added XC3S250E in CP132 package to Table 2. Corrected number of differential I/O pairs for CP132 package. Added package markings for QFP packages (Figure 2) and CP132/CPG132 packages (Figure 4). Added differential HSTL and SSTL I/O standards. Updated Table 2 to indicate number of input-only pins. Added Production Stepping information, including example top marking diagrams. Upgraded data sheet status to Preliminary. Added XC3S100E in CP132 package and updated I/O counts for the XC3S1600E in FG320 package (Table 2). Added information about dual markings for -5C and -4I product combinations to Package Marking. Added 66 MHz PCI support and links to the Xilinx PCI LogiCORE data sheet. Indicated that Stepping 1 parts are Production status. Promoted Module 1 to Production status. Synchronized all modules to v3.4. Revision
11/23/05
2.0
03/22/06
3.0
11/09/06
3.4
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Spartan-3E FPGA Family: Functional Description
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DS312-2 (v3.4) November 9, 2006
Product Specification programmable delay element directly to the I line. After the delay element, there are alternate routes through a pair of storage elements to the IQ1 and IQ2 lines. The IOB outputs I, IQ1, and IQ2 lead to the FPGA's internal logic. The delay element can be set to ensure a hold time of zero (see Input Delay Functions). The output path, starting with the O1 and O2 lines, carries data from the FPGA's internal logic through a multiplexer and then a three-state driver to the IOB pad. In addition to this direct path, the multiplexer provides the option to insert a pair of storage elements. The 3-state path determines when the output driver is high impedance. The T1 and T2 lines carry data from the FPGA's internal logic through a multiplexer to the output driver. In addition to this direct path, the multiplexer provides the option to insert a pair of storage elements. All signal paths entering the IOB, including those associated with the storage elements, have an inverter option. Any inverter placed on these paths is automatically absorbed into the IOB.
Introduction
As described in Architectural Overview, the SpartanTM-3E FPGA architecture consists of five fundamental functional elements: * * * * * Input/Output Blocks (IOBs) Configurable Logic Block (CLB) and Slice Resources Block RAM Dedicated Multipliers Digital Clock Managers (DCMs) *
The following sections provide detailed information on each of these functions. In addition, this section also describes the following functions: * * * * Clocking Infrastructure Interconnect Configuration Powering Spartan-3E FPGAs
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Input/Output Blocks (IOBs)
IOB Overview
The Input/Output Block (IOB) provides a programmable, unidirectional or bidirectional interface between a package pin and the FPGA's internal logic. The IOB is similar to that of the Spartan-3 family with the following differences: * * * Input-only blocks are added Programmable input delays are added to all blocks DDR flip-flops can be shared between adjacent IOBs
The unidirectional input-only block has a subset of the full IOB capabilities. Thus there are no connections or logic for an output path. The following paragraphs assume that any reference to output functionality does not apply to the input-only blocks. The number of input-only blocks varies with device size, but is never more than 25% of the total IOB count. Figure 5, page 10 is a simplified diagram of the IOB's internal structure. There are three main signal paths within the IOB: the output path, input path, and 3-state path. Each path has its own pair of storage elements that can act as either registers or latches. For more information, see Storage Element Functions. The three main signal paths are as follows: * The input path carries data from the pad, which is bonded to a package pin, through an optional
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
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T T1
D CE CK SR
Q
TFF1
REV DDR MUX
TCE T2
D CE CK SR
Q TFF2
REV
Three-state Path VCCO
O1 OTCLK1
D CE CK SR
Q
OFF1
Pull-Up REV
DDR MUX
ESD
I/O Pin
OCE O2 OTCLK2 D CE CK SR Q OFF2
Programmable Output Driver
PullDown
ESD
REV
Keeper Latch
Output Path Programmable Delay Programmable Delay D CE CK SR REV Q IFF1
I IQ1 IDDRIN1 IDDRIN2 ICLK1 ICE IQ2 D CE ICLK2 SR REV CK SR REV Q IFF2
LVCMOS, LVTTL, PCI
Single-ended Standards using VREF VREF Pin Differential Standards I/O Pin from Adjacent IOB
Input Path
DS312-2_19_110606
Notes:
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All IOB control and output path signals have an inverting polarity option wihtin the IOB. IDDRIN1/IDDRIN2 signals shown with dashed lines connect to the adjacent IOB in a differential pair only, not to the FPGA fabric.
Figure 5: Simplified IOB Diagram
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Functional Description The delay values are set up in the silicon once at configuration time--they are non-modifiable in device operation. The primary use for the input delay element is to adjust the input delay path to ensure that there is no hold time requirement when using the input flip-flop(s) with a global clock. The default value is chosen automatically by the Xilinx software tools as the value depends on device size and the specific device edge where the flip-flop resides. The value set by the Xilinx ISE software and the resulting effects on input timing are reported using the Timing Analyzer tool. If the design uses a DCM in the clock path, then the delay element can be safely set to zero because the Delay-Locked Loop (DLL) compensation automatically ensures that there is still no input hold time requirement. Both asynchronous and synchronous values can be modified, which is useful where extra delay is required on clock or data inputs, for example, in interfaces to various types of RAM.
IFD_DELAY_VALUE Synchronous input (IQ1) DQ Synchronous input (IQ2) DQ
Input Delay Functions
Each IOB has a programmable delay block that optionally delays the input signal from 0 to approximately 5.8 ns. In Figure 6, the signal is first delayed by an initial delay of either 0 or approximately 1 to 3 ns. The range depends on the specific Spartan-3E FPGA array used. The initial delay then feeds a 7-tap delay line. This delay line has an approximate value of 250 ps per tap, again somewhat architecture dependent. All seven taps are available via a multiplexer for use as an asynchronous input directly into the FPGA fabric. In this way, the delay is programmable from 0 to ~5.8 ns in ~250 ps steps. Three of the seven taps are also available via a multiplexer to the D inputs of the synchronous storage elements. The delay inserted in the path to the storage element can be varied from 0 to ~5.8 ns in ~500 ps steps. The first, coarse delay element is common to both asynchronous and synchronous paths, and must be either used or not used for both paths.
Initial Delay
PAD
Asynchronous input (I) IBUF_DELAY_VALUE
DS312-2_18_102306
Figure 6: Programmable Fixed Input Delay Elements
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Functional Description
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Storage Element Functions
There are three pairs of storage elements in each IOB, one pair for each of the three paths. It is possible to configure each of these storage elements as an edge-triggered D-type flip-flop (FD) or a level-sensitive latch (LD). The storage-element pair on either the Output path or the Three-State path can be used together with a special multiplexer to produce Double-Data-Rate (DDR) transmission. Table 4: Storage Element Signal Description Storage Element Signal D Q CK CE SR
This is accomplished by taking data synchronized to the clock signal's rising edge and converting it to bits synchronized on both the rising and the falling edge. The combination of two registers and a multiplexer is referred to as a Double-Data-Rate D-type flip-flop (ODDR2). Table 4 describes the signal paths associated with the storage element.
Description Data input Data output Clock input Clock Enable input Set/Reset input
Function Data at this input is stored on the active edge of CK and enabled by CE. For latch operation when the input is enabled, data passes directly to the output Q. The data on this output reflects the state of the storage element. For operation as a latch in transparent mode, Q mirrors the data at D. Data is loaded into the storage element on this input's active edge with CE asserted. When asserted, this input enables CK. If not connected, CE defaults to the asserted state. This input forces the storage element into the state specified by the SRHIGH/SRLOW attributes. The SYNC/ASYNC attribute setting determines if the SR input is synchronized to the clock or not. If both SR and REV are active at the same time, the storage element gets a value of 0. This input is used together with SR. It forces the storage element into the state opposite from what SR does. The SYNC/ASYNC attribute setting determines whether the REV input is synchronized to the clock or not. If both SR and REV are active at the same time, the storage element gets a value of 0. trols the CE inputs for the register pair on the three-state path and ICE does the same for the register pair on the input path. The Set/Reset (SR) line entering the IOB controls all six registers, as is the Reverse (REV) line. In addition to the signal polarity controls described in IOB Overview, each storage element additionally supports the controls described in Table 5.
REV
Reverse input
As shown in Figure 5, the upper registers in both the output and three-state paths share a common clock. The OTCLK1 clock signal drives the CK clock inputs of the upper registers on the output and three-state paths. Similarly, OTCLK2 drives the CK inputs for the lower registers on the output and three-state paths. The upper and lower registers on the input path have independent clock lines: ICLK1 and ICLK2. The OCE enable line controls the CE inputs of the upper and lower registers on the output path. Similarly, TCE conTable 5: Storage Element Options Option Switch FF/Latch SYNC/ASYNC Function
Specificity Independent for each storage element Independent for each storage element
Chooses between an edge-triggered flip-flop or a level-sensitive latch Determines whether the SR set/reset control is synchronous or asynchronous
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Functional Description
Table 5: Storage Element Options (Continued) Option Switch SRHIGH/SRLOW Function Determines whether SR acts as a Set, which forces the storage element to a logic "1" (SRHIGH) or a Reset, which forces a logic "0" (SRLOW) When Global Set/Reset (GSR) is asserted or after configuration this option specifies the initial state of the storage element, either set (INIT1) or reset (INIT0). By default, choosing SRLOW also selects INIT0; choosing SRHIGH also selects INIT1. Specificity Independent for each storage element, except when using ODDR2. In the latter case, the selection for the upper element will apply to both elements. Independent for each storage element, except when using ODDR2, which uses two IOBs. In the ODDR2 case, selecting INIT0 for one IOBs applies to both elements within the IOB, although INIT1 could be selected for the elements in the other IOB.
INIT1/INIT0
Double-Data-Rate Transmission
Double-Data-Rate (DDR) transmission describes the technique of synchronizing signals to both the rising and falling edges of the clock signal. Spartan-3E devices use register pairs in all three IOB paths to perform DDR operations. The pair of storage elements on the IOB's Output path (OFF1 and OFF2), used as registers, combine with a special multiplexer to form a DDR D-type flip-flop (ODDR2). This primitive permits DDR transmission where output data bits are synchronized to both the rising and falling edges of a clock. DDR operation requires two clock signals (usually 50% duty cycle), one the inverted form of the other. These signals trigger the two registers in alternating fashion, as shown in Figure 7. The Digital Clock Manager (DCM) generates the two clock signals by mirroring an incoming signal, and then shifting it 180 degrees. This approach ensures minimal skew between the two signals. Alternatively, the inverter inside the IOB can be used to invert the clock signal, thus only using one clock line and both rising and falling edges of that clock line as the two clocks for the DDR flip-flops.
DCM 180 0 FDDR D1 Q1 CLK1 DDR MUX D2 Q2 CLK2
Q
The storage-element pair on the Three-State path (TFF1 and TFF2) also can be combined with a local multiplexer to form a DDR primitive. This permits synchronizing the output enable to both the rising and falling edges of a clock. This DDR operation is realized in the same way as for the output path. The storage-element pair on the input path (IFF1 and IFF2) allows an I/O to receive a DDR signal. An incoming DDR clock signal triggers one register, and the inverted clock signal triggers the other register. The registers take turns capturing bits of the incoming DDR data signal. The primitive to allow this functionality is called IDDR2. Aside from high bandwidth data transfers, DDR outputs also can be used to reproduce, or mirror, a clock signal on the output. This approach is used to transmit clock and data signals together (source synchronously). A similar approach is used to reproduce a clock signal at multiple outputs. The advantage for both approaches is that skew across the outputs is minimal.
DCM 0 FDDR D1 Q1 CLK1 DDR MUX D2 Q2 CLK2
Q
DS312-2_20_021105
Figure 7: Two Methods for Clocking the DDR Register
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Functional Description
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Register Cascade Feature
In the Spartan-3E family, one of the IOBs in a differential pair can cascade its input storage elements with those in the other IOB as part of a differential pair. This is intended to make DDR operation at high speed much simpler to implement. The new DDR connections that are available are shown in Figure 5 (dashed lines), and are only available for routing between IOBs and are not accessible to the FPGA fabric. Note that this feature is only available when using differential I/O.
fabric where it is now already in the same time domain as D1. Here, the FPGA fabric uses only the clock ICLK1 to process the received data. See Figure 9 for a graphical illustration of this function.
D PAD To Fabric Q IQ2 IDDRIN2 D Q D2 Q D1
IDDR2
As a DDR input pair, the master IOB registers incoming data on the rising edge of ICLK1 (= D1) and the rising edge of ICLK2 (= D2), which is typically the same as the falling edge of ICLK1. This data is then transferred into the FPGA fabric. At some point, both signals must be brought into the same clock domain, typically ICLK1. This can be difficult at high frequencies because the available time is only one half of a clock cycle assuming a 50% duty cycle. See Figure 8 for a graphical illustration of this function.
D PAD Q Q D1 To Fabric D D2
D
ICLK1 ICLK2
ICLK1 ICLK2 PAD D1 D2 d d+1 d d-1 d+2 d+3 d+2 d+1 d+4 d+5 d+4 d+3 d+6 d+7 d+6 d+5 d+8 d+8 d+7
DS312-2_22_030105
Figure 9: Input DDR Using Spartan-3E Cascade Feature
ODDR2
As a DDR output pair, the master IOB registers data coming from the FPGA fabric on the rising edge of OCLK1 (= D1) and the rising edge of OCLK2 (= D2), which is typically the same as the falling edge of OCLK1. These two bits of data are multiplexed by the DDR mux and forwarded to the output pin. The D2 data signal must be re-synchronized from the OCLK1 clock domain to the OCLK2 domain using FPGA slice flip-flops. Placement is critical at high frequencies, because the time available is only one half a clock cycle. See Figure 10 for a graphical illustration of this function. Caution! The C0 or C1 alignment feature of the ODDR2
flip-flop, originally introduced in the Spartan-3E FPGA family, is not recommended or supported in the ISE development software. The ODDR2 flip-flop without the alignment feature remains fully supported. Without the alignment feature, the ODDR2 feature behaves equivalent to the ODDR flip-flop on previous Xilinx FPGA families.
ICLK2 ICLK1 ICLK1 ICLK2 PAD D1 D2 d-1 d d+1 d+2 d+3 d+4 d+5 d d+1 d+2 d+3 d+4 d+5 d+6 d+7 d+8 d+6 d+8 d+7
DS312-2_21_021105
Figure 8: Input DDR (without Cascade Feature) In the Spartan-3E device, the signal D2 can be cascaded into the storage element of the adjacent slave IOB. There it is re-registered to ICLK1, and only then fed to the FPGA
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
D1 From Fabric D2
D
Q PAD
SelectIO Signal Standards
The Spartan-3E I/Os feature inputs and outputs that support a wide range of I/O signaling standards (Table 6 and Table 7). The majority of the I/Os also can be used to form differential pairs to support any of the differential signaling standards (Table 7). To define the I/O signaling standard in a design, set the IOSTANDARD attribute to the appropriate setting. Xilinx provides a variety of different methods for applying the IOSTANDARD for maximum flexibility. For a full description of different methods of applying attributes to control IOSTANDARD, refer to "Entry Strategies for Xilinx Constraints" in the Xilinx Software Manuals and Help.
D
Q
OCLK1 OCLK2
OCLK1 OCLK2 D1 D2 PAD d d+1 d d+2 d+3 d+1 d+2 d+4 d+5 d+3 d+4 d+6 d+7 d+5 d+6 d+8 d+10 d+9 d+7 d+8
DS312-2_23_030105
Spartan-3E FPGAs provide additional input flexibility by allowing I/O standards to be mixed in different banks. For a particular VCCO voltage, Table 6 and Table 7 list all of the IOSTANDARDs that can be combined and if the IOSTANDARD is supported as an input only or can be used for both inputs and outputs.
Figure 10: Output DDR Table 6: Single-Ended IOSTANDARD Bank Compatibility VCCO Supply/Compatibility Single-Ended IOSTANDARD LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12 PCI33_3 PCI66_3 PCIX HSTL_I_18 Input/ Output Input Input Requirements Board Termination Voltage (VTT) N/R N/R N/R N/R N/R N/R N/R N/R N/R 0.9
1.2V Input/ Output -
1.5V Input/ Output Input -
1.8V Input/ Output Input Input -
2.5V Input/ Output Input Input Input -
3.3V Input/ Output Input/ Output Input Input Input Input Input/ Output Input/ Output Input/ Output Input
VREF N/R(1) N/R N/R N/R N/R N/R(1) N/R N/R N/R 0.9
DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description Table 6: Single-Ended IOSTANDARD Bank Compatibility (Continued) VCCO Supply/Compatibility Single-Ended IOSTANDARD HSTL_III_18 SSTL18_I SSTL2_I
Notes:
1. N/R - Not required for input operation.
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Input Requirements Board Termination Voltage (VTT) 1.8 0.9 1.25
1.2V -
1.5V -
1.8V Input/ Output Input/ Output -
2.5V Input Input Input/ Output
3.3V Input Input Input
VREF 1.1 0.9 1.25
Table 7: Differential IOSTANDARD Bank Compatibility
Differential IOSTANDARD VCCO Supply 1.8V 2.5V 3.3V Input Requirements: VREF Differential Bank Restriction(1)
LVDS_25
Input
Input, On-chip Differential Termination, Output Input, On-chip Differential Termination, Output Input, On-chip Differential Termination, Output Input Input, Output Input Input Input Input, Output
Input
Applies to Outputs Only Applies to Outputs Only Applies to Outputs Only VREF is not used for these I/O standards No Differential Bank Restriction (other I/O bank restrictions might apply)
RSDS_25
Input
Input
MINI_LVDS_25 LVPECL_25 BLVDS_25 DIFF_HSTL_I_18 DIFF_HSTL_III_18 DIFF_SSTL18_I DIFF_SSTL2_I
Notes:
1.
Input Input Input Input, Output Input, Output Input, Output Input
Input Input Input Input Input Input Input
Each bank can support any two of the following: LVDS_25 outputs, MINI_LVDS_25 outputs, RSDS_25 outputs.
HSTL and SSTL inputs use the Reference Voltage (VREF) to bias the input-switching threshold. Once a configuration data file is loaded into the FPGA that calls for the I/Os of a given bank to use HSTL/SSTL, a few specifically reserved I/O pins on the same bank automatically convert to VREF inputs. For banks that do not contain HSTL or SSTL, VREF pins remain available for user I/Os or input pins.
Differential standards employ a pair of signals, one the opposite polarity of the other. The noise canceling properties (for example, Common-Mode Rejection) of these standards permit exceptionally high data transfer rates. This subsection introduces the differential signaling capabilities of Spartan-3E devices. Each device-package combination designates specific I/O pairs specially optimized to support differential standards.
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description Pull-up and pull-down resistors are commonly applied to unused I/Os, inputs, and three-state outputs, but can be used on any I/O or Input-only pin. The pull-up resistor connects an IOB to VCCO through a resistor. The resistance value depends on the VCCO voltage (see DC and Switching Characteristics in Module 3 for the specifications). The pull-down resistor similarly connects an IOB to ground with a resistor. The PULLUP and PULLDOWN attributes and library primitives turn on these optional resistors. By default, PULLDOWN resistors terminate all unused I/O and Input-only pins. Unused I/O and Input-only pins can alternatively be set to PULLUP or FLOAT. To change the unused I/O Pad setting, set the Bitstream Generator (BitGen) option UnusedPin to PULLUP, PULLDOWN, or FLOAT. The UnusedPin option is accessed through the Properties for Generate Programming File in ISE. See Bitstream Generator (BitGen) Options. During configuration a Low logic level on the HSWAP pin activates pull-up resistors on all I/O and Input-only pins not actively used in the selected configuration mode.
Differential pairs can be shown in the Pin and Area Constraints Editor (PACE) with the "Show Differential Pairs" option. A unique L-number, part of the pin name, identifies the line-pairs associated with each bank (see Pinout Descriptions in Module 4). For each pair, the letters P and N designate the true and inverted lines, respectively. For example, the pin names IO_L43P_3 and IO_L43N_3 indicate the true and inverted lines comprising the line pair L43 on Bank 3. VCCO provides current to the outputs and additionally powers the On-Chip Differential Termination. VCCO must be 2.5V when using the On-Chip Differential Termination. The VREF lines are not required for differential operation. To further understand how to combine multiple IOSTANDARDs within a bank, refer to IOBs Organized into Banks, page 18.
On-Chip Differential Termination
Spartan-3E devices provide an on-chip ~120 differential termination across the input differential receiver terminals. The on-chip input differential termination in Spartan-3E devices potentially eliminates the external 100 termination resistor commonly found in differential receiver circuits. Differential termination is used for LVDS, mini-LVDS, and RSDS as applications permit. On-chip Differential Termination is available in banks with VCCO = 2.5V and is not supported on dedicated input pins. Set the DIFF_TERM attribute to TRUE to enable Differential Termination on a differential I/O pin pair. The DIFF_TERM attribute uses the following syntax in the UCF file:
INST DIFF_TERM = "";
Keeper Circuit
Each I/O has an optional keeper circuit (see Figure 12) that keeps bus lines from floating when not being actively driven. The KEEPER circuit retains the last logic level on a line after all drivers have been turned off. Apply the KEEPER attribute or use the KEEPER library primitive to use the KEEPER circuitry. Pull-up and pull-down resistors override the KEEPER settings.
Weak Pull-up
Output Path Input Path Spartan-3E Differential Output Z0 = 50 100 Spartan-3E Differential Input Keeper Weak Pull-down
DS312-2_25_022805
Z0 = 50 Spartan-3E Differential Input with On-Chip Differential Terminator
Figure 12: Keeper Circuit
Slew Rate Control and Drive Strength
Each IOB has a slew-rate control that sets the output switching edge-rate for LVCMOS and LVTTL outputs. The SLEW attribute controls the slew rate and can either be set to SLOW (default) or FAST. Each LVCMOS and LVTTL output additionally supports up to six different drive current strengths as shown in Table 8. To adjust the drive strength for each output, the DRIVE attribute is set to the desired drive strength: 2, 4, 6, 8, 12, and 16. Unless otherwise specified in the FPGA application, the software default IOSTANDARD is LVCMOS25, SLOW slew rate, and 12 mA output drive.
Z0 = 50
DS312-2_24_082605
Figure 11: Differential Inputs and Outputs
Pull-Up and Pull-Down Resistors
Pull-up and pull-down resistors inside each IOB optionally force a floating I/O or Input-only pin to a determined state.
DS312-2 (v3.4) November 9, 2006 Product Specification
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Spartan-3E Differential Output
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Functional Description
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Table 8: Programmable Output Drive Current Output Drive Current (mA)
IOSTANDARD
Bank 0
2
4
6
8
12
16
Bank 3 Bank 1 Bank 2
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LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12 -
Figure 13: Spartan-3E I/O Banks (top view)
I/O Banking Rules
High output current drive strength and FAST output slew rates generally result in fastest I/O performance. However, these same settings generally also result in transmission line effects on the printed circuit board (PCB) for all but the shortest board traces. Each IOB has independent slew rate and drive strength controls. Use the slowest slew rate and lowest output drive current that meets the performance requirements for the end application. Likewise, due to lead inductance, a given package supports a limited number of simultaneous switching outputs (SSOs) when using fast, high-drive outputs. Only use fast, high-drive outputs when required by the application. When assigning I/Os to banks, these VCCO rules must be followed: 1. All VCCO pins on the FPGA must be connected even if a bank is unused. 2. All VCCO lines associated within a bank must be set to the same voltage level. 3. The VCCO levels used by all standards assigned to the I/Os of any given bank must agree. The Xilinx development software checks for this. Table 6 and Table 7 describe how different standards use the VCCO supply. 4. If a bank does not have any VCCO requirements, connect VCCO to an available voltage, such as 2.5V or 3.3V. Some configuration modes might place additional VCCO requirements. Refer to Configuration for more information. If any of the standards assigned to the Inputs of the bank use VREF, then the following additional rules must be observed: 1. All VREF pins must be connected within a bank. 2. All VREF lines associated with the bank must be set to the same voltage level. 3. The VREF levels used by all standards assigned to the Inputs of the bank must agree. The Xilinx development software checks for this. Table 6 describes how different standards use the VREF supply. If VREF is not required to bias the input switching thresholds, all associated VREF pins within the bank can be used as user I/Os or input pins.
IOBs Organized into Banks
The Spartan-3E architecture organizes IOBs into four I/O banks as shown in Figure 13. Each bank maintains separate VCCO and VREF supplies. The separate supplies allow each bank to independently set VCCO. Similarly, the VREF supplies may be set for each bank. Refer to Table 6 and Table 7 for VCCO and VREF requirements. When working with Spartan-3E devices, most of the differential I/O standards are compatible and can be combined within any given bank. Each bank can support any two of the following differential standards: LVDS_25 outputs, MINI_LVDS_25 outputs, and RSDS_25 outputs. As an example, LVDS_25 outputs, RSDS_25 outputs, and any other differential inputs while using on-chip differential termination are a valid combination. A combination not allowed is a single bank with LVDS_25 outputs, RSDS_25 outputs, and MINI_LVDS_25 outputs.
Package Footprint Compatibility
Sometimes, applications outgrow the logic capacity of a specific Spartan-3E FPGA. Fortunately, the Spartan-3E family is designed so that multiple part types are available in pin-compatible package footprints, as described in Pinout Descriptions in Module 4. In some cases, there are subtle differences between devices available in the same footprint.
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Functional Description
These differences are outlined for each package, such as pins that are unconnected on one device but connected on another in the same package or pins that are dedicated inputs on one package but full I/O on another. When designing the printed circuit board (PCB), plan for potential future upgrades and package migration. The Spartan-3E family is not pin-compatible with any previous Xilinx FPGA family.
Supply Voltages for the IOBs
The IOBs are powered by three supplies: 1. The VCCO supplies, one for each of the FPGA's I/O banks, power the output drivers. The voltage on the VCCO pins determines the voltage swing of the output signal. 2. VCCINT is the main power supply for the FPGA's internal logic. 3. VCCAUX is an auxiliary source of power, primarily to optimize the performance of various FPGA functions such as I/O switching.
Dedicated Inputs
Dedicated Inputs are IOBs used only as inputs. Pin names designate a Dedicated Input if the name starts with IP, for example, IP or IP_Lxxx_x. Dedicated inputs retain the full functionality of the IOB for input functions with a single exception for differential inputs (IP_Lxxx_x). For the differential Dedicated Inputs, the on-chip differential termination is not available. To replace the on-chip differential termination, choose a differential pair that supports outputs (IO_Lxxx_x) or use an external 100 termination resistor on the board.
I/O and Input-Only Pin Behavior During Power-On, Configuration, and User Mode
In this section, all behavior described for I/O pins also applies to input-only pins and dual-purpose I/O pins that are not actively involved in the currently-selected configuration mode. All I/O pins have ESD clamp diodes to their respective VCCO supply and from GND, as shown in Figure 5. The VCCINT (1.2V), VCCAUX (2.5V), and VCCO supplies can be applied in any order. Before the FPGA can start its configuration process, VCCINT, VCCO Bank 2, and VCCAUX must have reached their respective minimum recommended operating levels indicated in Table 73. At this time, all output drivers are in a high-impedance state. VCCO Bank 2, VCCINT, and VCCAUX serve as inputs to the internal Power-On Reset circuit (POR). A Low level applied to the HSWAP input enables pull-up resistors on user-I/O and input-only pins from power-on throughout configuration. A High level on HSWAP disables the pull-up resistors, allowing the I/Os to float. HSWAP contains a weak pull-up and defaults to High if left floating. As soon as power is applied, the FPGA begins initializing its configuration memory. At the same time, the FPGA internally asserts the Global Set-Reset (GSR), which asynchronously resets all IOB storage elements to a default Low state. Also see Pin Behavior During Configuration. Upon the completion of initialization and the beginning of configuration, INIT_B goes High, sampling the M0, M1, and M2 inputs to determine the configuration mode. Configuration data is then loaded into the FPGA. The I/O drivers remain in a high-impedance state (with or without pull-up resistors, as determined by the HSWAP input) throughout configuration. At the end of configuration, the GSR net is released, placing the IOB registers in a Low state by default, unless the loaded design reverses the polarity of their respective SR inputs. The Global Three State (GTS) net is released during Start-Up, marking the end of configuration and the beginning of design operation in the User mode. After the GTS net is released, all user I/Os go active while all unused I/Os
ESD Protection
Clamp diodes protect all device pads against damage from Electro-Static Discharge (ESD) as well as excessive voltage transients. Each I/O has two clamp diodes: one diode extends P-to-N from the pad to VCCO and a second diode extends N-to-P from the pad to GND. During operation, these diodes are normally biased in the off state. These clamp diodes are always connected to the pad, regardless of the signal standard selected. The presence of diodes limits the ability of Spartan-3E I/Os to tolerate high signal voltages. The VIN absolute maximum rating in Table 72 of DC and Switching Characteristics (Module 3) specifies the voltage range that I/Os can tolerate.
DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description are weakly pulled down (PULLDOWN). The designer can control how the unused I/Os are terminated after GTS is released by setting the Bitstream Generator (BitGen) option UnusedPin to PULLUP, PULLDOWN, or FLOAT. One clock cycle later (default), the Global Write Enable (GWE) net is released allowing the RAM and registers to change states. Once in User mode, any pull-up resistors enabled by HSWAP revert to the user settings and HSWAP is available as a general-purpose I/O. For more information on PULLUP and PULLDOWN, see Pull-Up and Pull-Down Resistors.
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Behavior of Unused I/O Pins After Configuration
By default, the Xilinx ISE development software automatically configures all unused I/O pins as input pins with individual internal pull-down resistors to GND. This default behavior is controlled by the UnusedPin bitstream generator (BitGen) option, as described in Table 68.
JTAG Boundary-Scan Capability
All Spartan-3E IOBs support boundary-scan testing compatible with IEEE 1149.1/1532 standards. See JTAG Mode for more information on programming via JTAG.
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Functional Description and additional multiplexers and carry logic simplify wide logic and arithmetic functions. Most general-purpose logic in a design is automatically mapped to the slice resources in the CLBs. Each CLB is identical, and the Spartan-3E family CLB structure is identical to that for the Spartan-3 family.
Configurable Logic Block (CLB) and Slice Resources
CLB Overview
The Configurable Logic Blocks (CLBs) constitute the main logic resource for implementing synchronous as well as combinatorial circuits. Each CLB contains four slices, and each slice contains two Look-Up Tables (LUTs) to implement logic and two dedicated storage elements that can be used as flip-flops or latches. The LUTs can be used as a 16x1 memory (RAM16) or as a 16-bit shift register (SRL16),
CLB Array
The CLBs are arranged in a regular array of rows and columns as shown in Figure 14. Each density varies by the number of rows and columns of CLBs (see Table 9).
X0Y3 X0Y2
X1Y3 X1Y2
X2Y3 X2Y2
X3Y3 X3Y2
Spartan-3E FPGA
X0Y1 X0Y0
X1Y1 X1Y0
X2Y1 X2Y0 IOBs
X3Y1 X3Y0
CLB
Slice
DS312-2_31_021205
Figure 14: CLB Locations
Table 9: Spartan-3E CLB Resources Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
Notes:
1. The number of CLBs is less than the multiple of the rows and columns because the block RAM/multiplier blocks and the DCMs are embedded in the array (see Figure 1 in Module 1).
CLB Rows 22 34 46 60 76
CLB Columns 16 26 34 46 58
CLB Total(1) 240 612 1,164 2,168 3,688
Slices 960 2,448 4,656 8,672 14,752
LUTs / Flip-Flops 1,920 4,896 9,312 17,344 29,504
Equivalent Logic Cells 2,160 5,508 10,476 19,512 33,192
RAM16 / SRL16 960 2,448 4,656 8,672 14,752
Distributed RAM Bits 15,360 39,168 74,496 138,752 236,032
Slices
Each CLB comprises four interconnected slices, as shown in Figure 16. These slices are grouped in pairs. Each pair is organized as a column with an independent carry chain. The left pair supports both logic and memory functions and its slices are called SLICEM. The right pair supports logic only and its slices are called SLICEL. Therefore half the
LUTs support both logic and memory (including both RAM16 and SRL16 shift registers) while half support logic only, and the two types alternate throughout the array columns. The SLICEL reduces the size of the CLB and lowers the cost of the device, and can also provide a performance advantage over the SLICEM.
DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
.
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WF[4:1]
DS312-2_32_021205
Notes:
1. 2. Options to invert signal polarity as well as other options that enable lines for various functions are not shown. The index i can be 6, 7, or 8, depending on the slice. The upper SLICEL has an F8MUX, and the upper SLICEM has an F7MUX. The lower SLICEL and SLICEM both have an F6MUX.
Figure 15: Simplified Diagram of the Left-Hand SLICEM
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Functional Description
Left-Hand SLICEM (Logic or Distributed RAM or Shift Register)
Right-Hand SLICEL (Logic Only) COUT
CLB SLICE X1Y1
SLICE X1Y0 Switch Matrix COUT CIN SLICE X0Y1 SHIFTOUT SHIFTIN SLICE X0Y0 Interconnect to Neighbors
CIN
DS099-2_05_082104
Figure 16: Arrangement of Slices within the CLB
Slice Location Designations
The Xilinx development software designates the location of a slice according to its X and Y coordinates, starting in the bottom left corner, as shown in Figure 14. The letter `X' followed by a number identifies columns of slices, incrementing from the left side of the die to the right. The letter `Y' followed by a number identifies the position of each slice in a pair as well as indicating the CLB row, incrementing from the bottom of the die. Figure 16 shows the CLB located in the lower left-hand corner of the die. The SLICEM always has an even `X' number, and the SLICEL always has an odd `X' number.
Slice Overview
A slice includes two LUT function generators and two storage elements, along with additional logic, as shown in Figure 17. Both SLICEM and SLICEL have the following elements in common to provide logic, arithmetic, and ROM functions: * * * * Two 4-input LUT function generators, F and G Two storage elements Two wide-function multiplexers, F5MUX and FiMUX Carry and arithmetic logic
SRL16 RAM16 LUT4 (G)
FiMUX Carry Register
LUT4 (G)
FiMUX Carry Register
F5MUX
SRL16 RAM16 LUT4 (F)
F5MUX Register
LUT4 (F)
Carry
Carry
Register
Arithmetic Logic
Arithmetic Logic
SLICEM
Figure 17: Resources in a Slice
SLICEL
DS312-2_13_020905
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Functional Description The SLICEM pair supports two additional functions: * * Two 16x1 distributed RAM blocks, RAM16 Two 16-bit shift registers, SRL16
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Enable (CE), Slice Write Enable (SLICEWE1), and Reset/Set (RS) are shared in common between the two halves. The LUTs located in the top and bottom portions of the slice are referred to as "G" and "F", respectively, or the "G-LUT" and the "F-LUT". The storage elements in the top and bottom portions of the slice are called FFY and FFX, respectively. Each slice has two multiplexers with F5MUX in the bottom portion of the slice and FiMUX in the top portion. Depending on the slice, the FiMUX takes on the name F6MUX, F7MUX, or F8MUX, according to its position in the multiplexer chain. The lower SLICEL and SLICEM both have an F6MUX. The upper SLICEM has an F7MUX, and the upper SLICEL has an F8MUX. The carry chain enters the bottom of the slice as CIN and exits at the top as COUT. Five multiplexers control the chain: CYINIT, CY0F, and CYMUXF in the bottom portion and CY0G and CYMUXG in the top portion. The dedicated arithmetic logic includes the exclusive-OR gates XORF and XORG (bottom and top portions of the slice, respectively) as well as the AND gates FAND and GAND (bottom and top portions, respectively). See Table 10 for a description of all the slice input and output signals.
Each of these elements is described in more detail in the following sections.
Logic Cells
The combination of a LUT and a storage element is known as a "Logic Cell". The additional features in a slice, such as the wide multiplexers, carry logic, and arithmetic gates, add to the capacity of a slice, implementing logic that would otherwise require additional LUTs. Benchmarks have shown that the overall slice is equivalent to 2.25 simple logic cells. This calculation provides the equivalent logic cell count shown in Table 9.
Slice Details
Figure 15 is a detailed diagram of the SLICEM. It represents a superset of the elements and connections to be found in all slices. The dashed and gray lines (blue when viewed in color) indicate the resources found only in the SLICEM and not in the SLICEL. Each slice has two halves, which are differentiated as top and bottom to keep them distinct from the upper and lower slices in a CLB. The control inputs for the clock (CLK), Clock Table 10: Slice Inputs and Outputs Name F[4:1] G[4:1] BX BY BXOUT BYOUT ALTDIG DIG SLICEWE1 F5 FXINA FXINB Fi CE SR Location SLICEL/M Bottom SLICEL/M Top SLICEL/M Bottom SLICEL/M Top SLICEM Bottom SLICEM Top SLICEM Top SLICEM Top SLICEM Common SLICEL/M Bottom SLICEL/M Top SLICEL/M Top SLICEL/M Top SLICEL/M Common SLICEL/M Common Direction Input Input Input Input Output Output Input Output Input Output Input Input Output Input Input
Description F-LUT and FAND inputs G-LUT and GAND inputs or Write Address (SLICEM) Bypass to or output (SLICEM) or storage element, or control input to F5MUX, input to carry logic, or data input to RAM (SLICEM) Bypass to or output (SLICEM) or storage element, or control input to FiMUX, input to carry logic, or data input to RAM (SLICEM) BX bypass output BY bypass output Alternate data input to RAM ALTDIG or SHIFTIN bypass output RAM Write Enable Output from F5MUX; direct feedback to FiMUX Input to FiMUX; direct feedback from F5MUX or another FiMUX Input to FiMUX; direct feedback from F5MUX or another FiMUX Output from FiMUX; direct feedback to another FiMUX FFX/Y Clock Enable FFX/Y Set or Reset or RAM Write Enable (SLICEM)
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Functional Description
Table 10: Slice Inputs and Outputs (Continued) Name CLK SHIFTIN SHIFTOUT CIN COUT X Y XB YB XQ YQ Location SLICEL/M Common SLICEM Top SLICEM Bottom SLICEL/M Bottom SLICEL/M Top SLICEL/M Bottom SLICEL/M Top SLICEL/M Bottom SLICEL/M Top SLICEL/M Bottom SLICEL/M Top Direction Input Input Output Input Output Output Output Output Output Output Output Description FFX/Y Clock or RAM Clock (SLICEM) Data input to G-LUT RAM Shift data output from F-LUT RAM Carry chain input Carry chain output Combinatorial output Combinatorial output Combinatorial output from carry or F-LUT SRL16 (SLICEM) Combinatorial output from carry or G-LUT SRL16 (SLICEM) FFX output FFY output BY in the top half) can take any of several possible branches: 1. Bypass both the LUT and the storage element, and then exit the slice as BXOUT (or BYOUT) and return to interconnect. 2. Bypass the LUT, and then pass through a storage element via the D input before exiting as XQ (or YQ). 3. Control the wide function multiplexer F5MUX (or FiMUX). 4. Via multiplexers, serve as an input to the carry chain. 5. Drive the DI input of the LUT. 6. BY can control the REV inputs of both the FFY and FFX storage elements. See Storage Element Functions. 7. Finally, the DIG_MUX multiplexer can switch BY onto the DIG line, which exits the slice. The control inputs CLK, CE, SR, BX and BY have programmable polarity. The LUT inputs do not need programmable polarity because their function can be inverted inside the LUT. The sections that follow provide more detail on individual functions of the slice.
Main Logic Paths
Central to the operation of each slice are two nearly identical data paths at the top and bottom of the slice. The description that follows uses names associated with the bottom path. (The top path names appear in parentheses.) The basic path originates at an interconnect switch matrix outside the CLB. See Interconnect for more information on the switch matrix and the routing connections. Four lines, F1 through F4 (or G1 through G4 on the upper path), enter the slice and connect directly to the LUT. Once inside the slice, the lower 4-bit path passes through a LUT `F' (or `G') that performs logic operations. The LUT Data output, `D', offers five possible paths: 1. Exit the slice via line "X" (or "Y") and return to interconnect. 2. Inside the slice, "X" (or "Y") serves as an input to the DXMUX (or DYMUX) which feeds the data input, "D", of the FFX (or FFY) storage element. The "Q" output of the storage element drives the line XQ (or YQ) which exits the slice. 3. Control the CYMUXF (or CYMUXG) multiplexer on the carry chain. 4. With the carry chain, serve as an input to the XORF (or XORG) exclusive-OR gate that performs arithmetic operations, producing a result on "X" (or "Y"). 5. Drive the multiplexer F5MUX to implement logic functions wider than four bits. The "D" outputs of both the F-LUT and G-LUT serve as data inputs to this multiplexer. In addition to the main logic paths described above, there are two bypass paths that enter the slice as BX and BY. Once inside the FPGA, BX in the bottom half of the slice (or
Look-Up Tables
The Look-Up Table or LUT is a RAM-based function generator and is the main resource for implementing logic functions. Furthermore, the LUTs in each SLICEM pair can be configured as Distributed RAM or a 16-bit shift register, as described later. Each of the two LUTs (F and G) in a slice have four logic inputs (A1-A4) and a single output (D). Any four-variable Boolean logic operation can be implemented in one LUT. Functions with more inputs can be implemented by cascad25
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Functional Description ing LUTs or by using the wide function multiplexers that are described later. The output of the LUT can connect to the wide multiplexer logic, the carry and arithmetic logic, or directly to a CLB output or to the CLB storage element. See Figure 18.
Y 4 G[4:1] A[4:1] G-LUT D FFY YQ
R
Wide Multiplexers
Wide-function multiplexers effectively combine LUTs in order to permit more complex logic operations. Each slice has two of these multiplexers with F5MUX in the bottom portion of the slice and FiMUX in the top portion. The F5MUX multiplexes the two LUTs in a slice. The FiMUX multiplexes two CLB inputs which connect directly to the F5MUX and FiMUX results from the same slice or from other slices. See Figure 19.
X F[4:1] 4 A[4:1] F-LUT D FFX XQ
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Figure 18: LUT Resources in a Slice
FiMUX FXINA FXINB BY DQ F5MUX F[4:1] G[4:1] BX DQ LUT LUT 1 F5 (Local Feedback to FXIN) 0 X (General Interconnect) XQ 1 FX (Local Feedback to FXIN) 0 Y (General Interconnect) YQ
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Figure 19: Dedicated Multiplexers in Spartan-3E CLB Depending on the slice, FiMUX takes on the name F6MUX, F7MUX, or F8MUX. The designation indicates the number of inputs possible without restriction on the function. For example, an F7MUX can generate any function of seven inputs. Figure 20 shows the names of the multiplexers in each position in the Spartan-3E CLB. The figure also includes the direct connections within the CLB, along with the F7MUX connection to the CLB below. Each mux can create logic functions of more inputs than indicated by its name. The F5MUX, for example, can generate any function of five inputs, with four inputs duplicated to two LUTs and the fifth input controlling the mux. Because each LUT can implement independent 2:1 muxes, the F5MUX can combine them to create a 4:1 mux, which is a six-input function. If the two LUTs have completely independent sets of inputs, some functions of all nine inputs can be implemented. Table 11 shows the connections for each multiplexer and the number of inputs possible for different types of functions.
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Functional Description
FXINB F8 FXINA X
F5
F5
FXINB F6 FXINA
FX
F5
F5
FXINB FXINA F7
FX
F5
F5
FXINB FXINA F6 FX
F5
F5
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Figure 20: Muxes and Dedicated Feedback in Spartan-3E CLB
Table 11: Mux Capabilities Total Number of Inputs per Function Mux F5MUX FiMUX Usage F5MUX F6MUX F7MUX F8MUX Input Source LUTs F5MUX F6MUX F7MUX For Any Function 5 6 7 8 For Mux 6 (4:1 mux) 11 (8:1 mux) 20 (16:1 mux) 37 (32:1 mux) For Limited Functions 9 19 39 79
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Functional Description The wide multiplexers can be used by the automatic tools or instantiated in a design using a component such as the F5MUX. The symbol, signals, and function are described below. The description is similar for the F6MUX, F7MUX, and F8MUX. Each has versions with a general output, local output, or both.
I0 I1 S
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Table 13: F5MUX Function Inputs S 0 0 I0 1 0 X X I1 X X 1 0 O 1 0 1 0 Outputs LO 1 0 1 0
0 1
LO O
1 1
Figure 21: F5MUX with Local and General Outputs Table 12: F5MUX Inputs and Outputs Signal I0 I1 S LO Function Input selected when S is Low Input selected when S is High Select input Local Output that connects to the F5 or FX CLB pins, which use local feedback to the FXIN inputs to the FiMUX for cascading General Output that connects to the general-purpose combinatorial or registered outputs of the CLB
For more details on using the multiplexers, see XAPP466: Using Dedicated Multiplexers in Spartan-3 FPGAs.
Carry and Arithmetic Logic
The carry chain, together with various dedicated arithmetic logic gates, support fast and efficient implementations of math operations. The carry logic is automatically used for most arithmetic functions in a design. The gates and multiplexers of the carry and arithmetic logic can also be used for general-purpose logic, including simple wide Boolean functions. The carry chain enters the slice as CIN and exits as COUT, controlled by several multiplexers. The carry chain connects directly from one CLB to the CLB above. The carry chain can be initialized at any point from the BX (or BY) inputs. The dedicated arithmetic logic includes the exclusive-OR gates XORF and XORG (upper and lower portions of the slice, respectively) as well as the AND gates GAND and FAND (upper and lower portions, respectively). These gates work in conjunction with the LUTs to implement efficient arithmetic functions, including counters and multipliers, typically at two bits per slice. See Figure 22 and Table 14.
O
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Functional Description
COUT
YB 1 G[4:1] G1 G2 A[4:1] G-LUT D XORG CY0G FFY YQ CYMUXG CYSELG Y
GAND BY
1 0
XB 1 4 F[4:1] F1 F2 A[4:1] F-LUT D XORF CY0F FFX XQ CYSELF CYMUXF X
FAND BX
1 0
CYINIT
CIN
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Figure 22: Carry Logic Table 14: Carry Logic Functions Function CYINIT Description Initializes carry chain for a slice. Fixed selection of: * CIN carry input from the slice below * BX input Carry generation for bottom half of slice. Fixed selection of: * F1 or F2 inputs to the LUT (both equal 1 when a carry is to be generated) * FAND gate for multiplication * BX input for carry initialization * Fixed "1" or "0" input for use as a simple Boolean function Carry generation for top half of slice. Fixed selection of: * G1 or G2 inputs to the LUT (both equal 1 when a carry is to be generated) * GAND gate for multiplication * BY input for carry initialization * Fixed "1" or "0" input for use as a simple Boolean function Carry generation or propagation mux for bottom half of slice. Dynamic selection via CYSELF of: * CYINIT carry propagation (CYSELF = 1) * CY0F carry generation (CYSELF = 0)
CY0F
CY0G
CYMUXF
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Functional Description Table 14: Carry Logic Functions (Continued) Function CYMUXG Description Carry generation or propagation mux for top half of slice. Dynamic selection via CYSELF of: * CYMUXF carry propagation (CYSELG = 1) * CY0G carry generation (CYSELG = 0) Carry generation or propagation select for bottom half of slice. Fixed selection of: * F-LUT output (typically XOR result) * Fixed "1" to always propagate Carry generation or propagation select for top half of slice. Fixed selection of: * G-LUT output (typically XOR result) * Fixed "1" to always propagate Sum generation for bottom half of slice. Inputs from: * F-LUT * CYINIT carry signal from previous stage Result is sent to either the combinatorial or registered output for the top of the slice. XORG Sum generation for top half of slice. Inputs from: * G-LUT * CYMUXF carry signal from previous stage Result is sent to either the combinatorial or registered output for the top of the slice. FAND Multiplier partial product for bottom half of slice. Inputs: * F-LUT F1 input * F-LUT F2 input Result is sent through CY0F to become the carry generate signal into CYMUXF GAND Multiplier partial product for top half of slice. Inputs: * G-LUT G1 input * G-LUT G2 input Result is sent through CY0G to become the carry generate signal into CYMUXG The basic usage of the carry logic is to generate a half-sum in the LUT via an XOR function, which generates or propagates a carry out COUT via the carry mux CYMUXF (or CYMUXG), and then complete the sum with the dedicated XORF (or XORG) gate and the carry input CIN. This structure allows two bits of an arithmetic function in each slice. The CYMUXF (or CYMUXG) can be instantiated using the MUXCY element, and the XORF (or XORG) can be instantiated using the XORCY element.
LUT B MUXCY Sum XORCY CIN
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CYSELF
CYSELG
XORF
The FAND (or GAND) gate is used for partial product multiplication and can be instantiated using the MULT_AND component. Partial products are generated by two-input AND gates and then added. The carry logic is efficient for the adder, but one of the inputs must be outside the LUT as shown in Figure 23. The FAND (or GAND) gate is used to duplicate one of the partial products, while the LUT generates both partial products and the XOR function, as shown in Figure 24.
LUT Am Bn+1 Am+1 Bn Pm+1 MULT_AND CIN COUT
COUT
A
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Figure 23: Using the MUXCY and XORCY in the Carry Logic
Figure 24: Using the MULT_AND for Multiplication in Carry Logic
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Functional Description tom portions of the slice are called FFY and FFX, respectively. FFY has a fixed multiplexer on the D input selecting either the combinatorial output Y or the bypass signal BY. FFX selects between the combinatorial output X or the bypass signal BX. The functionality of a slice storage element is identical to that described earlier for the I/O storage elements. All signals have programmable polarity; the default active-High function is described.
The MULT_AND is useful for small multipliers. Larger multipliers can be built using the dedicated 18x18 multiplier blocks (see Dedicated Multipliers).
Storage Elements
The storage element, which is programmable as either a D-type flip-flop or a level-sensitive transparent latch, provides a means for synchronizing data to a clock signal, among other uses. The storage elements in the top and botTable 15: Storage Element Signals Signal D
Description Input. For a flip-flop data on the D input is loaded when R and S (or CLR and PRE) are Low and CE is High during the Low-to-High clock transition. For a latch, Q reflects the D input while the gate (G) input and gate enable (GE) are High and R and S (or CLR and PRE) are Low. The data on the D input during the High-to-Low gate transition is stored in the latch. The data on the Q output of the latch remains unchanged as long as G or GE remains Low. Output. Toggles after the Low-to-High clock transition for a flip-flop and immediately for a latch. Clock for edge-triggered flip-flops. Gate for level-sensitive latches. Clock Enable for flip-flops. Gate Enable for latches. Synchronous Set (Q = High). When the S input is High and R is Low, the flip-flop is set, output High, during the Low-to-High clock (C) transition. A latch output is immediately set, output High. Synchronous Reset (Q = Low); has precedence over Set. Asynchronous Preset (Q = High). When the PRE input is High and CLR is Low, the flip-flop is set, output High, during the Low-to-High clock (C) transition. A latch output is immediately set, output High. Asynchronous Clear (Q = Low); has precedence over Preset to reset Q output Low CLB input for R, S, CLR, or PRE CLB input for opposite of SR. Must be asynchronous or synchronous to match SR. Table 16: FD Flip-Flop Functionality with Synchronous Reset, Set, and Clock Enable Inputs
S FDRSE D CE C R
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Q C G CE GE S R PRE CLR SR REV
The control inputs R, S, CE, and C are all shared between the two flip-flops in a slice.
Outputs D X X X 1 0 C X Q 0 1 No Change 1 0
R
Q
S X 1 0 0 0
CE X X 0 1 1
1 0 0 0 0
Figure 25: FD Flip-Flop Component with Synchronous Reset, Set, and Clock Enable
Initialization
The CLB storage elements are initialized at power-up, dur-
ing configuration, by the global GSR signal, and by the individual SR or REV inputs to the CLB. The storage elements can also be re-initialized using the GSR input on the
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Functional Description STARTUP_SPARTAN3E primitive. See Global Controls (STARTUP_SPARTAN3E). Table 17: Slice Storage Element Initialization Signal SR Description Set/Reset input. Forces the storage element into the state specified by the attribute SRHIGH or SRLOW. SRHIGH forces a logic "1" when SR is asserted. SRLOW forces a logic "0". For each slice, set and reset can be set to be synchronous or asynchronous. Reverse of Set/Reset input. A second input (BY) forces the storage element into the opposite state. The reset condition is predominant over the set condition if both are active. Same synchronous/asynchronous setting as for SR. Global Set/Reset. GSR defaults to active High but can be inverted by adding an inverter in front of the GSR input of the STARTUP_SPARTAN3E element. The initial state after configuration or GSR is defined by a separate INIT0 and INIT1 attribute. By default, setting the SRLOW attribute sets INIT0, and setting the SRHIGH attribute sets INIT1.
R
can be combined in various ways to store larger amounts of data, including 16x4, 32x2, or 64x1 configurations in one CLB. The fifth and sixth address lines required for the 32-deep and 64-deep configurations, respectively, are implemented using the BX and BY inputs, which connect to the write enable logic for writing and the F5MUX and F6MUX for reading. Writing to distributed RAM is always synchronous to the SLICEM clock (WCLK for distributed RAM) and enabled by the SLICEM SR input which functions as the active-High Write Enable (WE). The read operation is asynchronous, and, therefore, during a write, the output initially reflects the old data at the address being written. The distributed RAM outputs can be captured using the flip-flops within the SLICEM element. The WE write-enable control for the RAM and the CE clock-enable control for the flip-flop are independent, but the WCLK and CLK clock inputs are shared. Because the RAM read operation is asynchronous, the output data always reflects the currently addressed RAM location. A dual-port option combines two LUTs so that memory access is possible from two independent data lines. The same data is written to both 16x1 memories but they have independent read address lines and outputs. The dual-port function is implemented by cascading the G-LUT address lines, which are used for both read and write, to the F-LUT write address lines (WF[4:1] in Figure 15), and by cascading the G-LUT data input D1 through the DIF_MUX in Figure 15 and to the D1 input on the F-LUT. One CLB provides a 16x1 dual-port memory as shown in Figure 26. Any write operation on the D input and any read operation on the SPO output can occur simultaneously with and independently from a read operation on the second read-only port, DPO.
REV
GSR
Distributed RAM
The LUTs in the SLICEM can be programmed as distributed RAM. This type of memory affords moderate amounts of data buffering anywhere along a data path. One SLICEM LUT stores 16 bits (RAM16). The four LUT inputs F[4:1] or G[4:1] become the address lines labeled A[4:1] in the device model and A[3:0] in the design components, providing a 16x1 configuration in one LUT. Multiple SLICEM LUTs
SLICEM
D A[3:0]
16x1 LUT RAM
(Read/ Write)
SPO
WE WCLK
Optional Register
DPRA[3:0]
16x1 LUT RAM
(Read Only)
DPO
Optional Register
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Figure 26: RAM16X1D Dual-Port Usage
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Functional Description Table 19: Distributed RAM Signals (Continued)
RAM16X1D WE D WCLK A0 A1 A2 A3 DPRA0 DPRA1 DPRA2 DPRA3 SPO DPO
Signal A0, A1, A2, A3 (A4, A5)
Description The address inputs select the memory cells for read or write. The width of the port determines the required address inputs. The data input provides the new data value to be written into the RAM. The data output O on single-port RAM or the SPO and DPO outputs on dual-port RAM reflects the contents of the memory cells referenced by the address inputs. Following an active write clock edge, the data out (O or SPO) reflects the newly written data.
D O, SPO, and DPO
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Figure 27: Dual-Port RAM Component Table 18: Dual-Port RAM Function Inputs WE (mode) 0 (read) 1 (read) 1 (read) 1 (write) 1 (read)
Notes:
1. 2. data_a = word addressed by bits A3-A0. data_d = word addressed by bits DPRA3-DPRA0.
Outputs D X X X D X SPO data_a data_a data_a D data_a DPO data_d data_d data_d data_d data_d
WCLK X 0 1
The INIT attribute can be used to preload the memory with data during FPGA configuration. The default initial contents for RAM is all zeros. If the WE is held Low, the element can be considered a ROM. The ROM function is possible even in the SLICEL. The global write enable signal, GWE, is asserted automatically at the end of device configuration to enable all writable elements. The GWE signal guarantees that the initialized distributed RAM contents are not disturbed during the configuration process. The distributed RAM is useful for smaller amounts of memory. Larger memory requirements can use the dedicated 18Kbit RAM blocks (see Block RAM). For more information on distributed RAM, see XAPP464: Using Look-Up Tables as Distributed RAM in Spartan-3 FPGAs.
Table 19: Distributed RAM Signals Signal WCLK Description The clock is used for synchronous writes. The data and the address input pins have setup times referenced to the WCLK pin. Active on the positive edge by default with built-in programmable polarity. The enable pin affects the write functionality of the port. An inactive Write Enable prevents any writing to memory cells. An active Write Enable causes the clock edge to write the data input signal to the memory location pointed to by the address inputs. Active High by default with built-in programmable polarity.
Shift Registers
It is possible to program each SLICEM LUT as a 16-bit shift register (see Figure 28). Used in this way, each LUT can delay serial data anywhere from 1 to 16 clock cycles without using any of the dedicated flip-flops. The resulting programmable delays can be used to balance the timing of data pipelines. The SLICEM LUTs cascade from the G-LUT to the F-LUT through the DIFMUX (see Figure 15). SHIFTIN and SHIFTOUT lines cascade a SLICEM to the SLICEM below to form larger shift registers. The four SLICEM LUTs of a single CLB can be combined to produce delays up to 64 clock cycles. It is also possible to combine shift registers across more than one CLB.
WE
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Functional Description
I
R
SHIFTIN
SRLC16 D CE CLK A0 A1 A2 A3
SRLC16E Q Q15
SHIFT-REG A[3:0] 4 A[3:0] D MC15 D WS DI (BY) WSG CE (SR) CLK WE CK (optional) DI Q Output Registered Output
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Figure 29: SRL16 Shift Register Component with Cascade and Clock Enable The functionality of the shift register is shown in Table 20. The SRL16 shifts on the rising edge of the clock input when the Clock Enable control is High. This shift register cannot be initialized either during configuration or during operation except by shifting data into it. The clock enable and clock inputs are shared between the two LUTs in a SLICEM. The clock enable input is automatically kept active if unused. Table 20: SRL16 Shift Register Function Inputs Am Am Am
Notes:
1. m = 0, 1, 2, 3.
SHIFTOUT or YB
X465_03_040203
Figure 28: Logic Cell SRL16 Structure Each shift register provides a shift output MC15 for the last bit in each LUT, in addition to providing addressable access to any bit in the shift register through the normal D output. The address inputs A[3:0] are the same as the distributed RAM address lines, which come from the LUT inputs F[4:1] or G[4:1]. At the end of the shift register, the CLB flip-flop can be used to provide one more shift delay for the addressable bit. The shift register element is known as the SRL16 (Shift Register LUT 16-bit), with a `C' added to signify a cascade ability (Q15 output) and `E' to indicate a Clock Enable. See Figure 29 for an example of the SRLC16E component.
Outputs D X D Q Q[Am] Q[Am-1] Q15 Q[15] Q[15]
CLK X
CE 0 1
For more information on the SRL16, refer to XAPP465: Using Look-Up Tables as Shift Registers (SRL16) in Spartan-3 FPGAs.
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Functional Description
Block RAM
Spartan-3E devices incorporate 4 to 36 dedicated block RAMs, which are organized as dual-port configurable 18 Kbit blocks. Functionally, the block RAM is identical to the Spartan-3 architecture block RAM. Block RAM synchronously stores large amounts of data while distributed RAM, previously described, is better suited for buffering small amounts of data anywhere along signal paths. This section describes basic block RAM functions. For detailed implementation information, refer to XAPP463: Using Block RAM in Spartan-3 Series FPGAs. Each block RAM is configurable by setting the content's initial values, default signal value of the output registers, port aspect ratios, and write modes. Block RAM can be used in single-port or dual-port modes.
The Internal Structure of the Block RAM
The block RAM has a dual port structure. The two identical data ports called A and B permit independent access to the common block RAM, which has a maximum capacity of 18,432 bits, or 16,384 bits with no parity bits (see parity bits description in Table 22). Each port has its own dedicated set of data, control, and clock lines for synchronous read and write operations. There are four basic data paths, as shown in Figure 30: 1. Write to and read from Port A 2. Write to and read from Port B 3. Data transfer from Port A to Port B 4. Data transfer from Port B to Port A
Arrangement of RAM Blocks on Die
The block RAMs are located together with the multipliers on the die in one or two columns depending on the size of the device. The XC3S100E has one column of block RAM. The Spartan-3E devices ranging from the XC3S250E to XC3S1600E have two columns of block RAM. Table 21 shows the number of RAM blocks, the data storage capacity, and the number of columns for each device. Row(s) of CLBs are located above and below each block RAM column. Table 21: Number of RAM Blocks by Device Total Number of RAM Blocks 4 12 20 28 36 Total Addressable Locations (bits) 73,728 221,184 368,640 516,096 663,552 Number of Columns 1 2 2 2 2
Write 4 Read
Read 3 Write
Spartan-3E Dual-Port Block RAM
Write 1 Read
Port B
Port A
Write 2 Read
DS312-2_01_020705
Figure 30: Block RAM Data Paths
Number of Ports
A choice among primitives determines whether the block RAM functions as dual- or single-port memory. A name of the form RAMB16_S[wA]_S[wB] calls out the dual-port primitive, where the integers wA and wB specify the total data path width at ports A and B, respectively. Thus, a RAMB16_S9_S18 is a dual-port RAM with a 9-bit Port A and an 18-bit Port B. A name of the form RAMB16_S[w] identifies the single-port primitive, where the integer w specifies the total data path width of the lone port A. A RAMB16_S18 is a single-port RAM with an 18-bit port.
Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
Port Aspect Ratios
Immediately adjacent to each block RAM is an embedded 18x18 hardware multiplier. The upper 16 bits of the block RAM's Port A Data input bus are shared with the upper 16 bits of the A multiplicand input bus of the multiplier. Similarly, the upper 16 bits of Port B's data input bus are shared with the B multiplicand input bus of the multiplier. Each port of the block RAM can be configured independently to select a number of different possible widths for the data input (DI) and data output (DO) signals as shown in Table 22.
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Functional Description
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Table 22: Port Aspect Ratios Total Data Path Width (w bits) 1 2 4 9 18 36
Notes:
1. 2. 3. 4. The width of the total data path (w) is the sum of the DI/DO bus width (w-p) and any parity bits (p). The width selection made for the DI/DO bus determines the number of address lines (r) according to the relationship expressed as: r = 14 - [log(w-p)/log(2)]. The number of address lines delimits the total number (n) of addressable locations or depth according to the following equation: n = 2r. The product of w and n yields the total block RAM capacity.
DI/DO Data Bus Width (w-p bits)1 1 2 4 8 16 32
DIP/DOP Parity Bus Width (p bits) 0 0 0 1 2 4
ADDR Bus Width (r bits)2 14 13 12 11 10 9
DI/DO [w-p-1:0] [0:0] [1:0] [3:0] [7:0] [15:0] [31:0]
DIP/DOP [p-1:0] [0:0] [1:0] [3:0]
ADDR [r-1:0] [13:0] [12:0] [11:0] [10:0] [9:0] [8:0]
No. of Addressable Locations (n)3 16,384 8,192 4,096 2,048 1,024 512
Block RAM Capacity (w*n bits)4 16,384 16,384 16,384 18,432 18,432 18,432
If the data bus width of Port A differs from that of Port B, the block RAM automatically performs a bus-matching function as described in Figure 31. When data is written to a port with a narrow bus and then read from a port with a wide bus, the latter port effectively combines "narrow" words to form "wide" words. Similarly, when data is written into a port with a wide bus and then read from a port with a narrow bus, the latter port divides "wide" words to form "narrow" words. Par-
ity bits are not available if the data port width is configured as x4, x2, or x1. For example, if a x36 data word (32 data, 4 parity) is addressed as two x18 halfwords (16 data, 2 parity), the parity bits associated with each data byte are mapped within the block RAM to the appropriate parity bits. The same effect happens when the x36 data word is mapped as four x9 words.
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Functional Description
Parity
35 34 33 32 31 24 23
Data
16 15 87 0
Address
512x36
P3 P2 P1 P0
Byte 3
Byte 2
17 16 15
Byte 1
87
Byte 0
0
0
1Kx18
Pa r (16 ity O 2K Kbits ption bits a d pa ata, l rity )
P3 P2 P1 P0
Byte 3 Byte 1
8 7
Byte 2 Byte 0
0
1 0
P3
Byte 3 Byte 2 Byte 1 Byte 0
3210
2Kx9
P2 P1 P0
3 2 1 0
7 6 53 4 B y te 3210
7 6
4Kx4
7 6 50 4 yt e 3B2 1 0
10
1 0
7 5 3 1
6 4 2 0
F E D C
No Parity (16Kbits data)
8Kx2
7 5 3 1 6 4 2 0
0
Byte 3 Byte 0
3 2 1 0
7 6 5 4
1F 1E 1D 1C
16Kx1
3 2 1 0
Byte 3
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3 2 1 0
DS312-2_02_102105
Figure 31: Data Organization and Bus-matching Operation with Different Port Widths on Port A and Port B
Byte 0
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Functional Description
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Block RAM Port Signal Definitions
Caution! Representations of the dual-port primitive
RAMB16_S[wA]_S[wB] and the single-port primitive RAMB16_S[w] with their associated signals are shown in Figure 32a and Figure 32b, respectively. These signals are defined in Table 23. The control signals (WE, EN, CLK, and SSR) on the block RAM are active High. However, optional inverters on the control signals change the polarity of the active edge to active Low.
DESIGN NOTE:
!
Whenever a block RAM port is enabled (ENA or ENB = High), all address transitions must meet the data sheet setup and hold times with respect to the port clock (CLKA or CLKB), as shown in Table 102, page 142.This requirement must be met even if the RAM read output is of no interest.
WEA ENA SSRA CLKA ADDRA[rA-1:0] DIA[wA-pA-1:0] DIPA[pA-1:0]
RAMB16_SW _SW
A
B
DOPA[pA-1:0] DOA[wA-pA-1:0]
WEB ENB SSRB CLKB ADDRB[rB-1:0] DIB[wB-pB-1:0] DIPB[pB-1:0]
DOPB[pB-1:0] DOB[wB-pB-1:0]
WE EN SSR CLK ADDR[r-1:0] DI[w-p-1:0] DIP[p-1:0]
RAMB16_Sw
DOP[p-1:0] DO[w-p-1:0]
(a) Dual-Port
Notes:
1. 2. 3. 4.
(b) Single-Port
DS312-2_03_111105
wA and wB are integers representing the total data path width (i.e., data bits plus parity bits) at Ports A and B, respectively. pA and pB are integers that indicate the number of data path lines serving as parity bits. rA and rB are integers representing the address bus width at ports A and B, respectively. The control signals CLK, WE, EN, and SSR on both ports have the option of inverted polarity.
Figure 32: Block RAM Primitives
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Functional Description
Table 23: Block RAM Port Signals
Signal Description Address Bus Port A Signal Name ADDRA Port B Signal Name ADDRB
Direction Input
Function The Address Bus selects a memory location for read or write operations. The width (w) of the port's associated data path determines the number of available address lines (r), as per Table 22. Whenever a port is enabled (ENA or ENB = High), address transitions must meet the data sheet setup and hold times with respect to the port clock (CLKA or CLKB), as shown in Table 102, page 142.This requirement must be met even if the RAM read output is of no interest.
Data Input Bus
DIA
DIB
Input
Data at the DI input bus is written to the RAM location specified by the address input bus (ADDR) during the active edge of the CLK input, when the clock enable (EN) and write enable (WE) inputs are active. It is possible to configure a port's DI input bus width (w-p) based on Table 22. This selection applies to both the DI and DO paths of a given port.
Parity Data Input(s)
DIPA
DIPB
Input
Parity inputs represent additional bits included in the data input path. Although referred to herein as "parity" bits, the parity inputs and outputs have no special functionality for generating or checking parity and can be used as additional data bits. The number of parity bits `p' included in the DI (same as for the DO bus) depends on a port's total data path width (w). See Table 22. Data is written to the DO output bus from the RAM location specified by the address input bus, ADDR. See the DI signal description for DO port width configurations. Basic data access occurs on the active edge of the CLK when WE is inactive and EN is active. The DO outputs mirror the data stored in the address ADDR memory location. Data access with WE active if the WRITE_MODE attribute is set to the value: WRITE_FIRST, which accesses data after the write takes place. READ_FIRST accesses data before the write occurs. A third attribute, NO_CHANGE, latches the DO outputs upon the assertion of WE. See Block RAM Data Operations for details on the WRITE_MODE attribute.
Data Output Bus
DOA
DOB
Output
Parity Data Output(s)
DOPA
DOPB
Output
Parity outputs represent additional bits included in the data input path. The number of parity bits `p' included in the DI bus (same as for the DO bus) depends on a port's total data path width (w). See the DIP signal description for configuration details. When asserted together with EN, this input enables the writing of data to the RAM. When WE is inactive with EN asserted, read operations are still possible. In this case, a latch passes data from the addressed memory location to the DO outputs. When asserted, this input enables the CLK signal to perform read and write operations to the block RAM. When inactive, the block RAM does not perform any read or write operations. When asserted, this pin forces the DO output latch to the value of the SRVAL attribute. It is synchronized to the CLK signal. This input accepts the clock signal to which read and write operations are synchronized. All associated port inputs are required to meet setup times with respect to the clock signal's active edge. The data output bus responds after a clock-to-out delay referenced to the clock signal's active edge.
Write Enable
WEA
WEB
Input
Clock Enable
ENA
ENB
Input
Set/Reset Clock
SSRA CLKA
SSRB CLKB
Input Input
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Functional Description
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Block RAM Attribute Definitions
A block RAM has a number of attributes that control its behavior as shown in Table 24. Table 24: Block RAM Attributes Function Initial Content for Data Memory, Loaded during Configuration Initial Content for Parity Memory, Loaded during Configuration Data Output Latch Initialization Data Output Latch Synchronous Set/Reset Value Data Output Latch Behavior during Write (see Block RAM Data Operations) Attribute INITxx (INIT_00 through INIT3F) Possible Values Each initialization string defines 32 hex values of the 16384-bit data memory of the block RAM.
INITPxx Each initialization string defines 32 hex values of (INITP_00 through INITP0F) the 2048-bit parity data memory of the block RAM. INIT (single-port) INITA, INITB (dual-port) SRVAL (single-port) SRVAL_A, SRVAL_B (dual-port) WRITE_MODE Hex value the width of the chosen port. Hex value the width of the chosen port.
WRITE_FIRST, READ_FIRST, NO_CHANGE
Block RAM Data Operations
Writing data to and accessing data from the block RAM are synchronous operations that take place independently on each of the two ports. Table 25 describes the data operations of each port as a result of the block RAM control signals in their default active-High edges. Table 25: Block RAM Function Table Input Signals GSR EN SSR WE CLK ADDR DIP DI
The waveforms for the write operation are shown in the top half of Figure 33, Figure 34, and Figure 35. When the WE and EN signals enable the active edge of CLK, data at the DI input bus is written to the block RAM location addressed by the ADDR lines.
Output Signals DOP X X X X pdata X X X Data INIT No Chg SRVAL SRVAL DO X INIT No Chg SRVAL SRVAL Immediately After Configuration
RAM Data Parity INITP_xx No Chg No Chg No Chg RAM(addr) pdata No Chg Data INIT_xx No Chg No Chg No Chg RAM(addr) data No Chg
Loaded During Configuration 1 0 0 0 X 0 1 1 X X 1 1 X X 0 1 X X X X X addr
Global Set/Reset Immediately After Configuration RAM Disabled Synchronous Set/Reset Synchronous Set/Reset During Write RAM
Read RAM, no Write Operation 0 1 0 0 addr X X RAM(pdata) RAM(data)
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Functional Description
Table 25: Block RAM Function Table (Continued) Input Signals GSR 0 EN 1 SSR 0 WE 1 CLK ADDR addr DIP pdata DI Data pdata Output Signals DOP DO Write RAM, Simultaneous Read Operation WRITE_MODE = WRITE_FIRST data RAM(addr) pdata RAM(addr) pdata RAM(addr) pdata RAM(addr) data RAM(addr) pdata RAM(addr) pdata RAM Data Parity Data
WRITE_MODE = READ_FIRST RAM(data) RAM(data)
WRITE_MODE = NO_CHANGE No Chg No Chg
There are a number of different conditions under which data can be accessed at the DO outputs. Basic data access always occurs when the WE input is inactive. Under this condition, data stored in the memory location addressed by the ADDR lines passes through a output latch to the DO outputs. The timing for basic data access is shown in the
portions of Figure 33, Figure 34, and Figure 35 during which WE is Low. Data also can be accessed on the DO outputs when asserting the WE input based on the value of the WRITE_MODE attribute as described in Table 26.
Table 26: WRITE_MODE Effect on Data Output Latches During Write Operations Write Mode WRITE_FIRST Read After Write READ_FIRST Read Before Write Effect on Same Port Data on DI and DIP inputs is written into specified RAM location and simultaneously appears on DO and DOP outputs. Data from specified RAM location appears on DO and DOP outputs. Data on DI and DIP inputs is written into specified location. NO_CHANGE No Read on Write Data on DO and DOP outputs remains unchanged. Data on DI and DIP inputs is written into specified location. Invalidates data on DO and DOP outputs. Effect on Opposite Port (dual-port only with same address) Invalidates data on DO and DOP outputs.
Data from specified RAM location appears on DO and DOP outputs.
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Functional Description
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Data_in
DI
Internal Memory
DO
Data_out = Data_in
CLK
WE DI ADDR DO
XXXX 1111 2222 XXXX
aa
bb
cc
dd
0000
MEM(aa)
1111
2222
MEM(dd)
EN
DISABLED READ WRITE MEM(bb)=1111 WRITE MEM(cc)=2222 READ
DS312-2_05_020905
Figure 33: Waveforms of Block RAM Data Operations with WRITE_FIRST Selected Setting the WRITE_MODE attribute to a value of WRITE_FIRST, data is written to the addressed memory location on an enabled active CLK edge and is also passed to the DO outputs. WRITE_FIRST timing is shown in the portion of Figure 33 during which WE is High. Setting the WRITE_MODE attribute to a value of READ_FIRST, data already stored in the addressed location passes to the DO outputs before that location is overwritten with new data from the DI inputs on an enabled active CLK edge. READ_FIRST timing is shown in the portion of Figure 34 during which WE is High.
Data_in
DI
Internal Memory
DO
Prior stored data
CLK
WE DI ADDR DO EN
DISABLED READ WRITE MEM(bb)=1111 WRITE MEM(cc)=2222 READ
DS312-2_06_020905
XXXX
1111
2222
XXXX
aa
bb
cc
dd
0000
MEM(aa)
old MEM(bb)
old MEM(cc)
MEM(dd)
Figure 34: Waveforms of Block RAM Data Operations with READ_FIRST Selected
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
Data_in
DI
Internal Memory
DO
No change during write
CLK WE DI ADDR DO
XXXX 1111 2222 XXXX
aa
bb
cc
dd
0000
MEM(aa)
MEM(dd)
EN
DISABLED READ WRITE MEM(bb)=1111 WRITE MEM(cc)=2222 READ
DS312-2_07_020905
Figure 35: Waveforms of Block RAM Data Operations with NO_CHANGE Selected Setting the WRITE_MODE attribute to a value of NO_CHANGE, puts the DO outputs in a latched state when asserting WE. Under this condition, the DO outputs retain the data driven just before WE is asserted. NO_CHANGE timing is shown in the portion of Figure 35 during which WE is High.
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Functional Description
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Dedicated Multipliers
The Spartan-3E devices provide 4 to 36 dedicated multiplier blocks per device. The multipliers are located together with the block RAM in one or two columns depending on device density. See Arrangement of RAM Blocks on Die for details on the location of these blocks and their connectivity.
Operation
The multiplier blocks primarily perform two's complement numerical multiplication but can also perform some less obvious applications, such as simple data storage and barrel shifting. Logic slices also implement efficient small multipliers and thereby supplement the dedicated multipliers. The Spartan-3E dedicated multiplier blocks have additional features beyond those provided in Spartan-3 FPGAs. Each multiplier performs the principle operation P = A x B, where `A' and `B' are 18-bit words in two's complement form, and `P' is the full-precision 36-bit product, also in two's complement form. The 18-bit inputs represent values ranging from -131,07210 to +131,07110 with a resulting product ranging from -17,179,738,11210 to +17,179,869,18410.
AREG (Optional) CEA A[17:0] CE D Q
Implement multipliers with inputs less than 18 bits by sign-extending the inputs (i.e., replicating the most-significant bit). Wider multiplication operations are performed by combining the dedicated multipliers and slice-based logic in any viable combination or by time-sharing a single multiplier. Perform unsigned multiplication by restricting the inputs to the positive range. Tie the most-significant bit Low and represent the unsigned value in the remaining 17 lesser-significant bits.
Optional Pipeline Registers
As shown in Figure 36, each multiplier block has optional registers on each of the multiplier inputs and the output. The registers are named AREG, BREG, and PREG and can be used in any combination. The clock input is common to all the registers within a block, but each register has an independent clock enable and synchronous reset controls making them ideal for storing data samples and coefficients. When used for pipelining, the registers boost the multiplier clock rate, beneficial for higher performance applications. Figure 36 illustrates the principle features of the multiplier block.
RST CEP RSTA BREG (Optional) CEB B[17:0] CE D Q RSTP
PREG (Optional) CE D Q P[35:0]
X
RST
RST RSTB CLK
DS312-2_27_021205
Figure 36: Principle Ports and Functions of Dedicated Multiplier Blocks Use the MULT18X18SIO primitive shown in Figure 37 to instantiate a multiplier within a design. Although high-level logic synthesis software usually automatically infers a multiplier, adding the pipeline registers may require the MULT18X18SIO primitive. Connect the appropriate signals to the MULT18X18SIO multiplier ports and set the individual AREG, BREG, and PREG attributes to `1' to insert the associated register, or to 0 to remove it and make the signal path combinatorial.
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Functional Description
Cascading Multipliers
MULT18X18SIO A[17:0] B[17:0] CEA CEB CEP CLK RSTA RSTB RSTP BCIN[17:0] BCOUT[17:0]
DS312-2_28_021205
P[35:0]
The MULT18X18SIO primitive has two additional ports called BCIN and BCOUT to cascade or share the multiplier's `B' input among several multiplier bocks. The 18-bit BCIN "cascade" input port offers an alternate input source from the more typical `B' input. The B_INPUT attribute specifies whether the specific implementation uses the BCIN or `B' input path. Setting B_INPUT to DIRECT chooses the `B' input. Setting B_INPUT to CASCADE selects the alternate BCIN input. The BREG register then optionally holds the selected input value, if required. BCOUT is an 18-bit output port that always reflects the value that is applied to the multiplier's second input, which is either the `B' input, the cascaded value from the BCIN input, or the output of the BREG if it is inserted. Figure 38 illustrates the four possible configurations using different settings for the B_INPUT attribute and the BREG attribute.
Figure 37: MULT18X18SIO Primitive
BCOUT[17:0] BREG CEB CE D CLK RST RSTB BCIN[17:0] BREG = 1 B_INPUT = CASCADE Q
BCOUT[17:0]
X
X
BREG = 0 B_INPUT = CASCADE
BCIN[17:0] BCOUT[17:0]
BCOUT[17:0] BREG CEB B[17:0] CLK RST RSTB BREG = 1 B_INPUT = DIRECT CE D Q
X
B[17:0]
X
BREG = 0 B_INPUT = DIRECT
DS312-2_29_021505
Figure 38: Four Configurations of the B Input
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Functional Description The BCIN and BCOUT ports have associated dedicated routing that connects adjacent multipliers within the same column. Via the cascade connection, the BCOUT port of one multiplier block drives the BCIN port of the multiplier block directly above it. There is no connection to the BCIN port of the bottom-most multiplier block in a column or a connection from the BCOUT port of the top-most block in a column. As an example, Figure 39 shows the multiplier cascade capability within the XC3S100E FPGA, which has a single column of multiplier, four blocks tall. For clarity, the figure omits the register control inputs.
R
When using the BREG register, the cascade connection forms a shift register structure typically used in DSP algorithms such as direct-form FIR filters. When the BREG register is omitted, the cascade structure essentially feeds the same input value to more than one multiplier. This parallel connection serves to create wide-input multipliers, implement transpose FIR filters, and is used in any application that requires that several multipliers have the same input value.
Multiplier/Block RAM Interaction
Each multiplier is located adjacent to an 18 Kbit block RAM and shares some interconnect resources. Configuring an 18 Kbit block RAM for 36-bit wide data (512 x 36 mode) prevents use of the associated dedicated multiplier.
BCOUT A P B B_INPUT = CASCADE BCIN
The upper 16 bits of the `A' multiplicand input are shared with the upper 16 bits of the block RAM's Port A Data input. Similarly, the upper 16 bits of the `B' multiplicand input are shared with Port B's data input. See also Figure 48, page 64.
BCOUT A P B B_INPUT = CASCADE BCIN
BCOUT A P B B_INPUT = CASCADE BCIN
BCOUT A P B B_INPUT = DIRECT BCIN
DS312-2_30_021505
Figure 39: Multiplier Cascade Connection
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Functional Description
Table 27 defines each port of the MULT18X18SIO primitive. Table 27: MULT18X18SIO Embedded Multiplier Primitives Description Signal Name A[17:0] Direction Input Function The primary 18-bit two's complement value for multiplication. The block multiplies by this value asynchronously if the optional AREG and PREG registers are omitted. When AREG and/or PREG are used, the value provided on this port is qualified by the rising edge of CLK, subject to the appropriate register controls. The second 18-bit two's complement value for multiplication if the B_INPUT attribute is set to DIRECT. The block multiplies by this value asynchronously if the optional BREG and PREG registers are omitted. When BREG and/or PREG are used, the value provided on this port is qualified by the rising edge of CLK, subject to the appropriate register controls. The second 18-bit two's complement value for multiplication if the B_INPUT attribute is set to CASCADE. The block multiplies by this value asynchronously if the optional BREG and PREG registers are omitted. When BREG and/or PREG are used, the value provided on this port is qualified by the rising edge of CLK, subject to the appropriate register controls. The 36-bit two's complement product resulting from the multiplication of the two input values applied to the multiplier. If the optional AREG, BREG and PREG registers are omitted, the output operates asynchronously. Use of PREG causes this output to respond to the rising edge of CLK with the value qualified by CEP and RSTP. If PREG is omitted, but AREG and BREG are used, this output responds to the rising edge of CLK with the value qualified by CEA, RSTA, CEB, and RSTB. If PREG is omitted and only one of AREG or BREG is used, this output responds to both asynchronous and synchronous events. The value being applied to the second input of the multiplier. When the optional BREG register is omitted, this output responds asynchronously in response to changes at the B[17:0] or BCIN[17:0] ports according to the setting of the B_INPUT attribute. If BREG is used, this output responds to the rising edge of CLK with the value qualified by CEB and RSTB. Clock enable qualifier for the optional AREG register. The value provided on the A[17:0] port is captured by AREG in response to a rising edge of CLK when this signal is High, provided that RSTA is Low. Synchronous reset for the optional AREG register. AREG content is forced to the value zero in response to a rising edge of CLK when this signal is High. Clock enable qualifier for the optional BREG register. The value provided on the B[17:0] or BCIN[17:0] port is captured by BREG in response to a rising edge of CLK when this signal is High, provided that RSTB is Low. Synchronous reset for the optional BREG register. BREG content is forced to the value zero in response to a rising edge of CLK when this signal is High. Clock enable qualifier for the optional PREG register. The value provided on the output of the multiplier port is captured by PREG in response to a rising edge of CLK when this signal is High, provided that RSTP is Low. Synchronous reset for the optional PREG register. PREG content is forced to the value zero in response to a rising edge of CLK when this signal is High.
B[17:0]
Input
BCIN[17:0]
Input
P[35:0]
Output
BCOUT[17:0]
Output
CEA
Input
RSTA CEB
Input Input
RSTB CEP
Input Input
RSTP
Notes:
1.
Input
The control signals CLK, CEA, RSTA, CEB, RSTB, CEP, and RSTP have the option of inverted polarity.
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Functional Description
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Digital Clock Managers (DCMs)
Differences from the Spartan-3 Architecture
* * * Spartan-3E FPGAs have two, four, or eight DCMs, depending on device size. The variable phase shifting feature functions differently on Spartan-3E FPGAs than from Spartan-3 FPGAs. The Spartan-3E DLLs support lower input frequencies, down to 5 MHz. Spartan-3 DLLs support down to 18 MHz.
in the Spartan-3 architecture. The Digital Clock Manager is instantiated within a design using a "DCM" primitive. The DCM supports three major functions: * Clock-skew Elimination: Clock skew within a system occurs due to the different arrival times of a clock signal at different points on the die, typically caused by the clock signal distribution network. Clock skew increases setup and hold time requirements and increases clock-to-out times, all of which are undesirable in high frequency applications. The DCM eliminates clock skew by phase-aligning the output clock signal that it generates with the incoming clock signal. This mechanism effectively cancels out the clock distribution delays. Frequency Synthesis: The DCM can generate a wide range of different output clock frequencies derived from the incoming clock signal. This is accomplished by either multiplying and/or dividing the frequency of the input clock signal by any of several different factors. Phase Shifting: The DCM provides the ability to shift the phase of all its output clock signals with respect to the input clock signal.
Overview
Spartan-3E Digital Clock Managers (DCMs) provide flexible, complete control over clock frequency, phase shift and skew. To accomplish this, the DCM employs a Delay-Locked Loop (DLL), a fully digital control system that uses feedback to maintain clock signal characteristics with a high degree of precision despite normal variations in operating temperature and voltage. This section provides a fundamental description of the DCM. The XC3S100E FPGA has two DCMs, one at the top and one at the bottom of the device. The XC3S250E and XC3S500E FPGAs each include four DCMs, two at the top and two at the bottom. The XC3S1200E and XC3S1600E FPGAs contain eight DCMs with two on each edge (see also Figure 45). The DCM in Spartan-3E FPGAs is surrounded by CLBs within the logic array and is no longer located at the top and bottom of a column of block RAM as *
*
Although a single design primitive, the DCM consists of four interrelated functional units: the Delay-Locked Loop (DLL), the Digital Frequency Synthesizer (DFS), the Phase Shifter (PS), and the Status Logic. Each component has its associated signals, as shown in Figure 40.
DCM
PSINCDEC PSEN PSCLK Phase Shifter PSDONE
Output Stage
CLKIN Delay Steps Input Stage
CLK0 CLK90 CLK180 CLK270 CLK2X CLK2X180 CLKDV CLKFX CLKFX180
8
Clock Distribution Delay
CLKFB
DFS DLL RST Status Logic
LOCKED STATUS [7:0]
DS099-2_07_101205
Figure 40: DCM Functional Blocks and Associated Signals
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Functional Description
CLKIN
Delay 1
Delay 2
Delay n-1
Delay n
CLK0 CLK90 CLK180 CLK270 CLK2X CLK2X180 CLKDV
Control
Output Section
LOCKED
CLKFB RST
Phase Detection
DS099-2_08_041103
Figure 41: Simplified Functional Diagram of DLL
Table 28: DLL Signals Signal CLKIN CLKFB CLK0 CLK90 CLK180 CLK270 CLK2X CLK2X180 CLKDV Direction Input Input Output Output Output Output Output Output Output Description Receives the incoming clock signal. See Table 30, Table 31, and Table 32 for optimal external inputs to a DCM. Accepts either CLK0 or CLK2X as the feedback signal. (Set the CLK_FEEDBACK attribute accordingly). Generates a clock signal with the same frequency and phase as CLKIN. Generates a clock signal with the same frequency as CLKIN, phase-shifted by 90. Generates a clock signal with the same frequency as CLKIN, phase-shifted by 180. Generates a clock signal with the same frequency as CLKIN, phase-shifted by 270. Generates a clock signal with the same phase as CLKIN, and twice the frequency. Generates a clock signal with twice the frequency of CLKIN, and phase-shifted 180 with respect to CLK2X. Divides the CLKIN frequency by CLKDV_DIVIDE value to generate lower frequency clock signal that is phase-aligned to CLKIN. described in Table 28. The clock outputs drive simultaneously. Signals that initialize and report the state of the DLL are discussed in Status Logic. The clock signal supplied to the CLKIN input serves as a reference waveform. The DLL seeks to align the rising-edge of feedback signal at the CLKFB input with the rising-edge of CLKIN input. When eliminating clock skew, the common approach to using the DLL is as follows: The CLK0 signal is passed through the clock distribution network that feeds all the registers it synchronizes. These registers are either internal or external to the FPGA. After passing through the clock distribution network, the clock signal returns to the DLL via a feedback line called CLKFB. The control block
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Delay-Locked Loop (DLL)
The most basic function of the DLL component is to eliminate clock skew. The main signal path of the DLL consists of an input stage, followed by a series of discrete delay elements or steps, which in turn leads to an output stage. This path together with logic for phase detection and control forms a system complete with feedback as shown in Figure 41. In Spartan-3E FPGAs, the DLL is implemented using a counter-based delay line. The DLL component has two clock inputs, CLKIN and CLKFB, as well as seven clock outputs, CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV as
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Functional Description inside the DLL measures the phase error between CLKFB and CLKIN. This phase error is a measure of the clock skew that the clock distribution network introduces. The control block activates the appropriate number of delay steps to cancel out the clock skew. When the DLL phase-aligns the CLK0 signal with the CLKIN signal, it asserts the LOCKED output, indicating a lock on to the CLKIN signal. Table 29: DLL Attributes Attribute CLK_FEEDBACK CLKIN_DIVIDE_BY_2 CLKDV_DIVIDE Description Chooses either the CLK0 or CLK2X output to drive the CLKFB input Halves the frequency of the CLKIN signal just as it enters the DCM Selects the constant used to divide the CLKIN input frequency to generate the CLKDV output frequency Additional information that allows the DLL to operate with the most efficient lock time and the best jitter tolerance NONE, 1X, 2X FALSE, TRUE 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6.0, 6.5, 7.0, 7.5, 8, 9, 10, 11, 12, 13, 14, 15, and 16 Floating-point value representing the CLKIN period in nanoseconds Values
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DLL Attributes and Related Functions
The DLL unit has a variety of associated attributes as described in Table 29. Each attribute is described in detail in the sections that follow.
CLKIN_PERIOD
DLL Clock Input Connections
For best results, an external clock source enters the FPGA via a Global Clock Input (GCLK). Each specific DCM has four possible direct, optimal GCLK inputs that feed the DCM's CLKIN input, as shown in Table 30. Table 30 also provides the specific pin numbers by package for each GCLK input. The two additional DCM's on the XC3S1200E and XC3S1600E have similar optimal connections from the left-edge LHCLK and the right-edge RHCLK inputs, as described in Table 31 and Table 32. * The DCM supports differential clock inputs (for example, LVDS, LVPECL_25) via a pair of GCLK inputs
that feed an internal single-ended signal to the DCM's CLKIN input. DESIGN NOTE:
!
Avoid using global clock input GCLK1 as it is always shared with the M2 mode select pin. Global clock inputs GCLK0, GCLK2, GCLK3, GCLK12, GCLK13, GCLK14, and GCLK15 have shared functionality in some configuration modes.
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Functional Description
Table 30: Direct Clock Input Connections and Optional External Feedback to Associated DCMs Differential Pair N Package VQ100 CP132 TQ144 PQ208 FT256 FG320 FG400 FG484 P91 B7 P131 P186 D8 D9 A9 B11
GCLK11
Differential Pair N P89 C8 P129 P184 B8 B9 G10 H11
GCLK9
Differential Pair N P86 A9 P126 P181 A9 A10 E10 C12
Associated Global Buffers BUFGMUX_X1Y10 BUFGMUX_X1Y11 BUFGMUX_X2Y10 BUFGMUX_X2Y11 GCLK7
Differential Pair N P84 C9 P123 P178 F9 E10 G11 E12
GCLK5
P P90 A7 P130 P185 C8 C9 A10 C11
GCLK10
P P88 B8 P128 P183 A8 B8 H10 H12
GCLK8
P P85 B9 P125 P180 A10 B10 E11 B12
GCLK6
P P83 A10 P122 P177 E9 D10 F11 F12
GCLK4
Pin Number for Single-Ended Input
Pin Number for Single-Ended Input
Top Left DCM
XC3S100: N/A XC3S250E, XC3S500E: DCM_X0Y1 XC3S1200E, XC3S1600E: DCM_X1Y3
Top Right DCM
XC3S100: DCM_X0Y1 XC3S250E, XC3S500E: DCM_X1Y1 XC3S1200E, XC3S1600E: DCM_X2Y3
H D
BUFGMUX_X1Y0
G C
BUFGMUX_X1Y1
F B
BUFGMUX_X2Y0
E A
BUFGMUX_X2Y1
Clock Line (see Table 41)
Bottom Left DCM
XC3S100: N/A XC3S250E, XC3S500E: DCM_X0Y0 XC3S1200E, XC3S1600E: DCM_X1Y0 GCLK12 GCLK13 GCLK14 GCLK15
Bottom Right DCM
XC3S100: DCM_X0Y0 XC3S250E, XC3S500E: DCM_X1Y0 XC3S1200E, XC3S1600E: DCM_X2Y0 GCLK0 GCLK1 GCLK2 GCLK3
Associated Global Buffers
Differential Pair Package VQ100 CP132 TQ144 PQ208 FT256 FG320 FG400 FG484 P P32 M4 P50 P74 M8 N9 W9 V11 N P33 N4 P51 P75 L8 M9 W10 U11
Differential Pair P P35 M5 P53 P77 N8 U9 R10 R11 N P36 N5 P54 P78 P8 V9 P10 T11
Differential Pair P P38 M6 P56 P80 T9 U10 P11 R12 N P39 N6 P57 P81 R9 T10 P12 P12
Differential Pair P P40 P6 P58 P82 P9 R10 V10 Y12 N P41 P7 P59 P83 N9 P10 V11 W12
Pin Number for Single-Ended Input
Pin Number for Single-Ended Input
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Functional Description
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Table 31: Direct Clock Input and Optional External Feedback to Left-Edge DCMs (XC3S1200E and XC3S1600E)
Diff. Clock Single-Ended Pin Number by Package Type VQ100 CP132 TQ144 PQ208 FT256 FG320 FG400 FG484 LHCLK Left Edge DCM/BUFGMUX BUFGMUX_X0Y5 BUFGMUX_X0Y4 D C Clock Lines B A H G Clock Lines F E Diff. Clock P N P P N P
Pair
P N P N
P9 P10 P11 P12
F3 F2 F1 G1
P14 P15 P16 P17
P22 P23 P24 P25
H5 H6 H3 H4
J5 J4 J1 J2
K3 K2 K7 L7
M5 L5 L8 M8
LHCLK0 LHCLK1 LHCLK2 LHCLK3 BUFGMUX_X0Y3 BUFGMUX_X0Y2
DCM_X0Y2
Pair
BUFGMUX_X0Y9 BUFGMUX_X0Y8
Pair
P N P N
P15 P16 P17 P18
G3 H1 H2 H3
P20 P21 P22 P23
P28 P29 P30 P31
J2 J3 J5 J4
K3 K4 K6 K5
M1 L1 M3 L3
M1 N1 M3 M4
LHCLK4 LHCLK5 LHCLK6 LHCLK7 BUFGMUX_X0Y7 BUFGMUX_X0Y6
DCM_X0Y1
Table 32: Direct Clock Input and Optional External Feedback to Right-Edge DCMs (XC3S1200E and XC3S1600E)
Right Edge DCM/BUFGMUX D C Clock Lines BUFGMUX_X3Y5 BUFGMUX_X3Y4 RHCLK VQ100 Single-Ended Pin Number by Package Type CP132 TQ144 PQ208 FT256 FG320 FG400 FG484
Pair
DCM_X3Y2
RHCLK6 RHCLK5 RHCLK4
P67 P66 P65
G14 H12 H13
P93 P92 P91
P134 P133 P132
H12 H14 H15
J15 J16 J17
K20 K14 K13
L18 L21 L20
B A
BUFGMUX_X3Y3 BUFGMUX_X3Y2
H G Clock Lines
BUFGMUX_X3Y9 BUFGMUX_X3Y8
DCM_X3Y1
RHCLK2 RHCLK1 RHCLK0
P62 P61 P60
J13 J12 K14
P87 P86 P85
P128 P127 P126
J14 J16 K16
K15 K12 K13
L15 L16 M16
M15 M22 N22
F E
BUFGMUX_X3Y7 BUFGMUX_X3Y6
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DS312-2 (v3.4) November 9, 2006 Product Specification
Pair
Pair
RHCLK3
P63
J14
P88
P129
J13
K14
L14
M16
N
Pair
Pair
RHCLK7
P68
G13
P94
P135
H11
J14
J20
L19
N
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Functional Description CLK0 feedback and "2X" for CLK2X feedback. If the DFS unit is used stand-alone, without the DLL, then no feedback is required and set the CLK_FEEDBACK attribute to "NONE". Two basic cases determine how to connect the DLL clock outputs and feedback connections: on-chip synchronization and off-chip synchronization, which are illustrated in Figure 42a through Figure 42d. In the on-chip synchronization case in Figure 42a and Figure 42b, it is possible to connect any of the DLL's seven output clock signals through general routing resources to the FPGA's internal registers. Either a Global Clock Buffer (BUFG) or a BUFGMUX affords access to the global clock network. As shown in Figure 42a, the feedback loop is created by routing CLK0 (or CLK2X) in Figure 42b to a global clock net, which in turn drives the CLKFB input. In the off-chip synchronization case in Figure 42c and Figure 42d, CLK0 (or CLK2X) plus any of the DLL's other output clock signals exit the FPGA using output buffers (OBUF) to drive an external clock network plus registers on the board. As shown in Figure 42c, the feedback loop is formed by feeding CLK0 (or CLK2X) in Figure 42d back into the FPGA, then to the DCM's CLKFB input via a Global Buffer Input, specified in Table 30.
Every FPGA input provides a possible DCM clock input, but the path is not temperature and voltage compensated like the GCLKs. Alternatively, clock signals within the FPGA optionally provide a DCM clock input via a Global Clock Multiplexer Buffer (BUFGMUX). The global clock net connects directly to the CLKIN input. The internal and external connections are shown in Figure 42a and Figure 42c, respectively.
DLL Clock Output and Feedback Connections
As many as four of the nine DCM clock outputs can simultaneously drive four of the BUFGMUX buffers on the same die edge. All DCM clock outputs can simultaneously drive general routing resources, including interconnect leading to OBUF buffers. The feedback loop is essential for DLL operation. Either the CLK0 or CLK2X outputs feed back to the CLKFB input via a BUFGMUX global buffer to eliminate the clock distribution delay. The specific BUFGMUX buffer used to feed back the CLK0 or CLK2X signal is ideally one of the BUFGMUX buffers associated with a specific DCM, as shown in Table 30, Table 31, and Table 32. The feedback path also phase-aligns the other seven DLL outputs: CLK0, CLK90, CLK180, CLK270, CLKDV, CLK2X, or CLK2X180. The CLK_FEEDBACK attribute value must agree with the physical feedback connection. Use "1X" for
FPGA
BUFGMUX BUFG CLKIN CLK90 CLK180 CLK270 CLKDV CLK2X CLK2X180 CLK0 BUFGMUX CLK0 BUFG CLKIN
Clock Net Delay
FPGA
BUFGMUX CLK0 CLK90 CLK180 CLK270 CLKDV CLK2X180 CLK2X BUFGMUX CLK2X
DCM
CLKFB
DCM
CLKFB
Clock Net Delay
(a) On-Chip with CLK0 Feedback FPGA
IBUFG CLKIN CLK90 CLK180 CLK270 CLKDV CLK2X CLK2X180 CLK0 OBUF OBUF
(b) On-Chip with CLK2X Feedback FPGA
IBUFG CLKIN CLK0 CLK90 CLK180 CLK270 CLKDV CLK2X180 CLK2X OBUF OBUF
DCM
CLKFB IBUFG
Clock Net Delay
DCM
CLKFB IBUFG
Clock Net Delay
CLK0
CLK2X
(c) Off-Chip with CLK0 Feedback
(d) Off-Chip with CLK2X Feedback
DS099-2_09_082104
Figure 42: Input Clock, Output Clock, and Feedback Connections for the DLL
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Functional Description
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Accommodating Input Frequencies Beyond Specified Maximums
If the CLKIN input frequency exceeds the maximum permitted, divide it down to an acceptable value using the CLKIN_DIVIDE_BY_2 attribute. When this attribute is set to "TRUE", the CLKIN frequency is divided by a factor of two as it enters the DCM. In addition, the CLKIN_DIVIDE_BY_2 option produces a 50% duty-cycle on the input clock, although at half the CLKIN frequency.
The CLK2X output produces an in-phase signal that is twice the frequency of CLKIN. The CLK2X180 output also doubles the frequency, but is 180 out-of-phase with respect to CLKIN. The CLKDIV output generates a clock frequency that is a predetermined fraction of the CLKIN frequency. The CLKDV_DIVIDE attribute determines the factor used to divide the CLKIN frequency. The attribute can be set to various values as described in Table 29. The basic frequency synthesis outputs are described in Table 28.
Quadrant and Half-Period Phase Shift Outputs
In addition to CLK0 for zero-phase alignment to the CLKIN signal, the DLL also provides the CLK90, CLK180, and CLK270 outputs for 90, 180, and 270 phase-shifted signals, respectively. These signals are described in Table 28, page 49 and their relative timing is shown in Figure 43. For control in finer increments than 90, see Phase Shifter (PS).
Duty Cycle Correction of DLL Clock Outputs
The DLL output signals exhibit a 50% duty cycle, even if the incoming CLKIN signal has a different duty cycle. Fifty-percent duty cycle means that the High and Low times of each clock cycle are equal.
DLL Performance Differences Between Steppings
As indicated in Digital Clock Manager (DCM) Timing (Module 3), the Stepping 1 revision silicon supports higher maximum input and output frequencies. Stepping 1 devices are backwards compatible with Stepping 0 devices.
Phase:
0
o
90 180 270
o
o
o
0
o
90 180 270
o
o
o
0
o
Input Signal (40%/60% Duty Cycle)
t
Digital Frequency Synthesizer (DFS)
The DFS unit generates clock signals where the output frequency is a product of the CLKIN input clock frequency and a ratio of two user-specified integers. The two dedicated outputs from the DFS unit, CLKFX and CLKFX180, are defined in Table 33. Table 33: DFS Signals Signal CLKFX Direction Output Description Multiplies the CLKIN frequency by the attribute-value ratio (CLKFX_MULTIPLY/ CLKFX_DIVIDE) to generate a clock signal with a new target frequency. Generates a clock signal with the same frequency as CLKFX, but shifted 180 out-of-phase.
CLKIN
Output Signal - Duty Cycle Corrected
CLK0
CLK90
CLK180
CLK270
CLKFX180
Output
CLK2X
CLK2X180
CLKDV
DS099-2_10_101105
Figure 43: Characteristics of the DLL Clock Outputs
The signal at the CLKFX180 output is essentially an inversion of the CLKFX signal. These two outputs always exhibit a 50% duty cycle, even when the CLKIN signal does not. The DFS clock outputs are active coincident with the seven DLL outputs and their output phase is controlled by the Phase Shifter unit (PS). The output frequency (fCLKFX) of the DFS is a function of the incoming clock frequency (fCLKIN) and two integer attributes, as follows.
CLKFX_MULTIPLY f CLKFX = f CLKIN * ---------------------------------------------------- CLKFX_DIVIDE
Basic Frequency Synthesis Outputs
The DLL component provides basic options for frequency multiplication and division in addition to the more flexible synthesis capability of the DFS component, described in a later section. These operations result in output clock signals with frequencies that are either a fraction (for division) or a multiple (for multiplication) of the incoming clock frequency.
54
Eq. 1
The CLKFX_MULTIPLY attribute is an integer ranging from 2 to 32, inclusive, and forms the numerator in Equation 1.
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description and output clock edges coincide every three CLKIN input periods, which is equivalent in time to five CLKFX output periods. Smaller CLKFX_MULTIPLY and CLKFX_DIVIDE values result in faster lock times. Therefore, CLKFX_MULTIPLY and CLKFX_DIVIDE must be factored to reduce their values wherever possible. For example, given CLKFX_MULTIPLY = 9 and CLKFX_DIVIDE = 6, removing a factor of three yields CLKFX_MULTIPLY = 3 and CLKFX_DIVIDE = 2. While both value-pairs result in the multiplication of clock frequency by 3/2, the latter value-pair enables the DLL to lock more quickly.
The CLKFX_DIVIDE is an integer ranging from 1 to 32, inclusive and forms the denominator in Equation 1. For example, if CLKFX_MULTIPLY = 5 and CLKFX_DIVIDE = 3, the frequency of the output clock signal is 5/3 that of the input clock signal. These attributes and their acceptable ranges are described in Table 34. Table 34: DFS Attributes Attribute CLKFX_MULTIPLY Description Frequency multiplier constant Frequency divisor constant Values Integer from 2 to 32, inclusive Integer from 1 to 32, inclusive
CLKFX_DIVIDE
Phase Shifter (PS)
The DCM provides two approaches to controlling the phase of a DCM clock output signal relative to the CLKIN signal: First, eight of the nine DCM clock outputs - CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, CLKFX, and CLKFX180 - provide either quadrant or half-period phase shifting of the input clock. Second, the PS unit provides additional fine phase shift control of all nine DCM outputs. The PS unit accomplishes this by introducing a "fine phase shift" delay (TPS) between the CLKFB and CLKIN signals inside the DLL unit. In FIXED phase shift mode, the fine phase shift is specified at design time with a resolution down to 1/256th of a CLKIN cycle or one delay step (DCM_DELAY_STEP), whichever is greater. This fine phase shift value is relative to the coarser quadrant or half-period phase shift of the DCM clock output. When used, the PS unit shifts the phase of all nine DCM clock output signals.
Any combination of integer values can be assigned to the CLKFX_MULTIPLY and CLKFX_DIVIDE attributes, provided that two conditions are met: 1. The two values fall within their corresponding ranges, as specified in Table 34. 2. The fCLKFX output frequency calculated in Equation 1 falls within the DCM's operating frequency specifications (see Table 106 in Module 3).
DFS With or Without the DLL
Although the CLKIN input is shared with both units, the DFS unit functions with or separately from the DLL unit. Separate from the DLL, the DFS generates an output frequency from the CLKIN frequency according to the respective CLKFX_MULTIPLY and CLKFX_DIVIDE values. Frequency synthesis does not require a feedback loop. Furthermore, without the DLL, the DFS unit supports a broader operating frequency range. With the DLL, the DFS unit operates as described above, only with the additional benefit of eliminating the clock distribution delay. In this case, a feedback loop from the CLK0 or CLK2X output to the CLKFB input must be present. When operating with the DLL unit, the DFS's CLKFX and CLKFX180 outputs are phase-aligned with the CLKIN input every CLKFX_DIVIDE cycles of CLKIN and every CLKFX_MULTIPLY cycles of CLKFX. For example, when CLKFX_MULTIPLY = 5 and CLKFX_DIVIDE = 3, the input Table 35: PS Attributes Attribute CLKOUT_PHASE_SHIFT PHASE_SHIFT
Enabling Phase Shifting and Selecting an Operating Mode
The CLKOUT_PHASE_SHIFT attribute controls the PS unit for the specific DCM instantiation. As described in Table 35, this attribute has three possible values: NONE, FIXED, and VARIABLE. When CLKOUT_PHASE_SHIFT = NONE, the PS unit is disabled and the DCM output clocks are phase-aligned to the CLKIN input via the CLKFB feedback path. Figure 44a shows this case. The PS unit is enabled when the CLKOUT_PHASE_SHIFT attribute is set to FIXED or VARIABLE modes. These two modes are described in the sections that follow.
Description Disables the PS component or chooses between Fixed Phase and Variable Phase modes. Determines size and direction of initial fine phase shift.
Values NONE, FIXED, VARIABLE Integers from -255 to +255
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Functional Description
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FIXED Phase Shift Mode
The FIXED phase shift mode shifts the DCM outputs by a fixed amount (TPS), controlled by the user-specified PHASE_SHIFT attribute. The PHASE_SHIFT value (shown as P in Figure 44) must be an integer ranging from -255 to +255. PHASE_SHIFT specifies a phase shift delay as a fraction of the TCLKIN. The phase shift behavior is different between ISE 8.1, Service Pack 3 and prior software versions, as described below. DESIGN NOTE:
FIXED Phase Shift prior to ISE 8.1i, Service Pack 3: See Equation 3. The value corresponds to a phase shift range of -180 to +180 degrees, which is different from the Spartan-3 DCM design primitive and simulation model. Designs created prior to ISE 8.1i, Service Pack 3 must be recompiled using the most recent ISE development software.
PHASESHIFT t PS = -------------------------------------- * T CLKIN 512
Eq. 3
!
Prior to ISE 8.1i, Service Pack 3, the FIXED phase shift feature operated differently than the Spartan-3 DCM design primitive and simulation model. Designs using software prior to ISE 8.1i, Service Pack 3 require recompilation using the latest ISE software release. Please read the following Answer Record for additional information. Answer Record #23153 www.xilinx.com/xlnx/xil_ans_display.jsp?getPagePath =23153
When the PHASE_SHIFT value is zero, CLKFB and CLKIN are in phase, the same as when the PS unit is disabled. When the PHASE_SHIFT value is positive, the DCM outputs are shifted later in time with respect to CLKIN input. When the attribute value is negative, the DCM outputs are shifted earlier in time with respect to CLKIN. Figure 44b illustrates the relationship between CLKFB and CLKIN in the Fixed Phase mode. In the Fixed Phase mode, the PSEN, PSCLK, and PSINCDEC inputs are not used and must be tied to GND. Equation 2 or Equation 3 applies only to FIXED phase shift mode. The VARIABLE phase shift mode operates differently.
FIXED Phase Shift using ISE 8.1i, Service Pack 3 and later: See Equation 2. The value corresponds to a phase shift range of -360 to +360, which matches behavior of the Spartan-3 DCM design primitive and simulation model.
PHASESHIFT t PS = -------------------------------------- * T CLKIN 256
Eq. 2
a. CLKOUT_PHASE_SHIFT = NONE
CLKIN
CLKFB (via CLK0 or CLK2X feedback)
b. CLKOUT_PHASE_SHIFT = FIXED
CLKIN Shift Range over all P Values:
-255 0 P * TCLKIN 256 +255
CLKFB (via CLK0 or CLK2X feedback)
DS312-2_61_021606
Figure 44: NONE and FIXED Phase Shifter Waveforms (ISE 8.1i, Service Pack 3 and later)
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description inputs to the PS unit (PSEN, PSCLK, and PSINCDEC), as defined in Table 36 and shown in Figure 40.
VARIABLE Phase Shift Mode
In VARIABLE phase shift mode, the FPGA application dynamically adjusts the fine phase shift value using three Table 36: Signals for Variable Phase Mode Signal PSEN(1) PSCLK(1) PSINCDEC(1) PSDONE Direction Input Input Input Output
Description Enables the Phase Shift unit for variable phase adjustment. Clock to synchronize phase shift adjustment. When High, increments the current phase shift value. When Low, decrements the current phase shift value. This signal is synchronized to the PSCLK signal. Goes High to indicate that the present phase adjustment is complete and PS unit is ready for next phase adjustment request. This signal is synchronized to the PSCLK signal.
Notes:
1. This input supports either a true or inverted polarity.
The FPGA application uses the three PS inputs on the Phase Shift unit to dynamically and incrementally increase or decrease the phase shift amount on all nine DCM clock outputs. To adjust the current phase shift value, the PSEN enable signal must be High to enable the PS unit. Coincidently, PSINCDEC must be High to increment the current phase shift amount or Low to decrement the current amount. All VARIABLE phase shift operations are controlled by the PSCLK input, which can be the CLKIN signal or any other clock signal. DESIGN NOTE:
Because each DCM_DELAY_STEP has a minimum and maximum value, the actual phase shift delay for the present phase increment/decrement value (VALUE) falls within the minimum and maximum values according to Equation 4 and Equation 5.
T PS ( Max ) = VALUE * DCM_DELAY_STEP_MAX T PS ( Min ) = VALUE * DCM_DELAY_STEP_MIN
Eq. 4 Eq. 5
!
The VARIABLE phase shift feature operates differently from the Spartan-3 DCM but the DCM design primitive is common to both Spartan-3 and Spartan-3E design entry. Variable phase shift in Spartan-3E FPGAs behaves as described herein. However, the DCM design primitive and simulation model does not match this behavior. Starting with ISE 8.1i, Service Pack 3, using the VARIABLE attribute generates an error message. Please read the following Answer Record to re-enable the VARIABLE phase shift feature. Answer Record #23004 www.xilinx.com/xlnx/xil_ans_display.jsp?getPagePath =23004
The maximum variable phase shift steps, MAX_STEPS, is described in Equation 6, for a given CLKIN input period, TCLKIN, in nanoseconds. To convert this to a phase shift range measured in time and not steps, use MAX_STEPS derived in Equation 6 for VALUE in Equation 4 and Equation 5.
MAX_STEPS = [ INTEGER ( 20 * ( T CLKIN - 3 ) ) ]
Eq. 6
The phase adjustment might require as many as 100 CLKIN cycles plus 3 PSCLK cycles to take effect, at which point the DCM's PSDONE output goes High for one PSCLK cycle. This pulse indicates that the PS unit completed the previous adjustment and is now ready for the next request. Asserting the Reset (RST) input returns the phase shift to zero.
DCM_ DELAY_STEP is the finest delay resolution available in the PS unit. Its value is provided at the bottom of Table 104 in Module 3. For each enabled PSCLK cycle that PSINCDEC is High, the PS unit adds one DCM_ DELAY_STEP of phase shift to all nine DCM outputs. Similarly, for each enabled PSCLK cycle that PSINCDEC is Low, the PS unit subtracts one DCM_ DELAY_STEP of phase shift from all nine DCM outputs. example, CLKFX_MULTIPLY and CLKFX_DIVIDE). If not
DS312-2 (v3.4) November 9, 2006 Product Specification
Status Logic
The Status Logic indicates the present state of the DCM and a means to reset the DCM to its initial known state. The Status Logic signals are described in Table 37. In general, the Reset (RST) input is only asserted upon configuring the FPGA or when changing the CLKIN frequency. The RST signal must be asserted for three or more CLKIN cycles. A DCM reset does not affect attribute values (for used, RST is tied to GND.
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Functional Description The eight bits of the STATUS bus are described in Table 38. Table 37: Status Logic Signals Signal RST STATUS[7:0] LOCKED Direction Input Output Output Description A High resets the entire DCM to its initial power-on state. Initializes the DLL taps for a delay of zero. Sets the LOCKED output Low. This input is asynchronous. The bit values on the STATUS bus provide information regarding the state of DLL and PS operation Indicates that the CLKIN and CLKFB signals are in phase by going High. The two signals are out-of-phase when Low.
R
Table 38: DCM Status Bus Bit 0 1 2 3-6
Notes:
1. When only the DFS clock outputs but none of the DLL clock outputs are used, this bit does not go High when the CLKIN signal stops.
Name Reserved CLKIN Stopped CLKFX Stopped Reserved -
Description
When High, indicates that the CLKIN input signal is not toggling. When Low, indicates CLKIN is toggling. This bit functions only when the CLKFB input is connected.(1) When High, indicates that the CLKFX output is not toggling. When Low, indicates the CLKFX output is toggling. This bit functions only when the CLKFX or CLKFX180 output are connected. -
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description Clock inputs optionally connect directly to DCMs using dedicated connections. Table 30, Table 31, and Table 32 show the clock inputs that best feed a specific DCM within a given Spartan-3E part number. Different Spartan-3E FPGA densities have different numbers of DCMs. The XC3S1200E and XC3S1600E are the only two densities with the left- and right-edge DCMs. Each clock input is also optionally a user-I/O pin and connects to internal interconnect. Some clock pad pins are input-only pins as indicated in Pinout Descriptions (Module 4).
Stabilizing DCM Clocks Before User Mode
The STARTUP_WAIT attribute shown in Table 39 optionally delays the end of the FPGA's configuration process until after the DCM locks to its incoming clock frequency. This option ensures that the FPGA remains in the Startup phase of configuration until all clock outputs generated by the DCM are stable. When all DCMs that have their STARTUP_WAIT attribute set to TRUE assert the LOCKED signal, then the FPGA completes its configuration process and proceeds to user mode. The associated bitstream generator (BitGen) option LCK_cycle specifies one of the six cycles in the Startup phase. The selected cycle defines the point at which configuration stalls until all the LOCKED outputs go High. See Start-Up, page 107 for more information. Table 39: STARTUP_WAIT Attribute Attribute STARTUP_WAIT Description When TRUE, delays transition from configuration to user mode until DCM locks to the input clock. Values TRUE, FALSE
Clock Buffers/Multiplexers
Clock Buffers/Multiplexers either drive clock input signals directly onto a clock line (BUFG) or optionally provide a multiplexer to switch between two unrelated, possibly asynchronous clock signals (BUFGMUX). Each BUFGMUX element, shown in Figure 46, is a 2-to-1 multiplexer. The select line, S, chooses which of the two inputs, I0 or I1, drives the BUFGMUX's output signal, O, as described in Table 40. The switching from one clock to the other is glitch-less, and done in such a way that the output High and Low times are never shorter than the shortest High or Low time of either input clock. The two clock inputs can be asynchronous with regard to each other, and the S input can change at any time, except for a short setup time prior to the rising edge of the presently selected clock (I0 or I1). This setup time is specified as TGSI in Table 100, page 140. Violating this setup time requirement possibly results in an undefined runt pulse output.
Clocking Infrastructure
The Spartan-3E clocking infrastructure, shown in Figure 45, provides a series of low-capacitance, low-skew interconnect lines well-suited to carrying high-frequency signals throughout the FPGA. The infrastructure also includes the clock inputs and BUFGMUX clock buffers/multiplexers. The Xilinx Place-and-Route (PAR) software automatically routes high-fanout clock signals using these resources.
Table 40: BUFGMUX Select Mechanism S Input 0 1 O Output I0 Input I1 Input
Clock Inputs
Clock pins accept external clock signals and connect directly to DCMs and BUFGMUX elements. Each Spartan-3E FPGA has: * * * 16 Global Clock inputs (GCLK0 through GCLK15) located along the top and bottom edges of the FPGA 8 Right-Half Clock inputs (RHCLK0 through RHCLK7) located along the right edge 8 Left-Half Clock inputs (LHCLK0 through LHCLK7) located along the left edge DESIGN NOTE:
!
Avoid using global clock input GCLK1 as it is always shared with the M2 mode select pin. Global clock inputs GCLK0, GCLK2, GCLK3, GCLK12, GCLK13, GCLK14, and GCLK15 have shared functionality in some configuration modes.
The BUFG clock buffer primitive drives a single clock signal onto the clock network and is essentially the same element as a BUFGMUX, just without the clock select mechanism. Similarly, the BUFGCE primitive creates an enabled clock buffer using the BUFGMUX select mechanism. The I0 and I1 inputs to an BUFGMUX element originate from clock input pins, DCMs, or Double-Line interconnect, as shown in Figure 46. As shown in Figure 45, there are 24 BUFGMUX elements distributed around the four edges of the device. Clock signals from the four BUFGMUX elements at the top edge and the four at the bottom edge are truly global and connect to all clocking quadrants. The eight left-edge BUFGMUX elements only connect to the two clock quadrants in the left half of the device. Similarly, the eight right-edge BUFGMUX elements only connect to the right half of the device. BUFGMUX elements are organized in pairs and share I0 and I1 connections with adjacent BUFGMUX elements from a common clock switch matrix as shown in Figure 46. For example, the input on I0 of one BUFGMUX is also a shared input to I1 of the adjacent BUFGMUX. The clock switch matrix for the left- and right-edge BUFGMUX elements receive signals from any of the three following sources: an LHCLK or RHCLK pin as appropriate, a Double-Line interconnect, or a DCM in the XC3S1200E and XC3S1600E devices.
DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
R
Global Clock Inputs 4
GCLK11 GCLK10 GCLK7 GCLK9 GCLK8 GCLK5 GCLK4 GCLK6
4
BUFGMUX pair BUFGMUX
LHCLK6 LHCLK7
DCM
XC3S250E (X0Y1) XC3S500E (X0Y1) XC3S1200E (X1Y3) XC3S1600E (X1Y3) X1Y10 X1Y11 X2Y10 X2Y11
DCM
4 H G F E 4
XC3S100E (X0Y1) XC3S250E (X1Y1) XC3S500E (X1Y1) XC3S1200E (X2Y3) XC3S1600E (X2Y3) Clock Line in Quadrant
RHCLK3 RHCLK2
X0Y9
H
H
X3Y9 X3Y8
X0Y8
Top Left Quadrant (TL) G 2
8
4 Top Spine
8
Top Right Quadrant (TR) G 2
2
*
8 8
*
8
2
DCM
XC3S1200E (X0Y1) XC3S1600E (X0Y1)
DCM
8
XC3S1200E (X3Y1) XC3S1600E (X3Y1)
2
LHCLK2 LHCLK3 LHCLK4 LHCLK5
2
X0Y6 X0Y7
* *
* *
2 2
X3Y7
RHCLK1 RHCLK0 RHCLK7 RHCLK6
Left-Half Clock Inputs
F
F
Right-Half Clock Inputs
X3Y6
E D
Left Spine
8
Note 3 Note 3
8
Horizontal
Spine
8
Note 4 Note 4
8
Right Spine
E D
X0Y5
X3Y5 X3Y4
X0Y4
C 2 8
*
Bottom Spine 8
*
8
C 8 2
2
2
DCM
XC3S1200E (X0Y2) XC3S1600E (X0Y2)
* *
* *
DCM
XC3S1200E (X3Y2) XC3S1600E (X3Y2)
2 2
LHCLK0 LHCLK1
2 2
RHCLK5 RHCLK4
X3Y3
X0Y2 X0Y3
B Bottom Left Quadrant (BL)
B 8 Bottom Right Quadrant (BR)
X3Y2
8 4
4 4
A
A
DCM
XC3S250E (X0Y0) XC3S500E (X0Y0) XC3S1200E (X1Y0) XC3S1600E (X1Y0)
D
C
B
A
DCM
XC3S100E (X0Y0) XC3S250E (X1Y0) XC3S500E (X1Y0) XC3S1200E (X2Y0) XC3S1600E (X2Y0)
X1Y0 X1Y1
X2Y0 X2Y1
4 4
GCLK3 GCLK2 GCLK1 GCLK0 GCLK13 GCLK12
GCLK15 GCLK14
Global Clock Inputs
DS312-2_04_041106
Notes: 1. The diagram presents electrical connectivity. The diagram locations do not necessarily match the physical location on the device, although the coordinate locations shown are correct. 2. Number of DCMs and locations of these DCM varies for different device densities. The left and right DCMs are only in the XC3S1200E and XC3S1600E. The XC3S100E has only two DCMs, one on the top right and one on the bottom right of the die. 3. See Figure 47a, which shows how the eight clock lines are multiplexed on the left-hand side of the device. 4. See Figure 47b, which shows how the eight clock lines are multiplexed on the right-hand side of the device. 5. For best direct clock inputs to a particular clock buffer, not a DCM, see Table 41. 6. For best direct clock inputs to a particular DCM, not a BUFGMUX, see Table 30, Table 31, and Table 32. Direct pin inputs to a DCM are shown in gray.
Figure 45: Spartan-3E Internal Quadrant-Based Clock Network (Electrical Connectivity View)
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Functional Description The four BUFGMUX elements on the top edge are paired together and share inputs from the eight global clock inputs along the top edge. Each BUFGMUX pair connects to four of the eight global clock inputs, as shown in Figure 45. This optionally allows differential inputs to the global clock inputs without wasting a BUFGMUX element.
By contrast, the clock switch matrixes on the top and bottom edges receive signals from any of the five following sources: two GCLK pins, two DCM outputs, or one Double-Line interconnect. Table 41 indicates permissible connections between clock inputs and BUFGMUX elements. The I0-input provides the best input path to a clock buffer. The I1-input provides the secondary input for the clock multiplexer function.
Table 41: Connections from Clock Inputs to BUFGMUX Elements and Associated Quadrant Clock Quadrant Clock Line(1) H G F E D C B A
Notes:
1. 2. See Quadrant Clock Routing for connectivity details for the eight quadrant clocks. See Figure 45 for specific BUFGMUX locations, and Figure 47 for information on how BUFGMUX elements drive onto a specific clock line within a quadrant.
Left-Half BUFGMUX Location(2) X0Y9 X0Y8 X0Y7 X0Y6 X0Y5 X0Y4 X0Y3 X0Y2 I0 Input LHCLK7 LHCLK6 LHCLK5 LHCLK4 LHCLK3 LHCLK2 LHCLK1 LHCLK0 I1 Input LHCLK6 LHCLK7 LHCLK4 LHCLK5 LHCLK2 LHCLK3 LHCLK0 LHCLK1
Top or Bottom BUFGMUX
Location(2)
Right-Half BUFGMUX Location(2) X3Y9 X3Y8 X3Y7 X3Y6 X3Y5 X3Y4 X3Y3 X3Y2 I0 Input RHCLK3 RHCLK2 RHCLK1 RHCLK0 RHCLK7 RHCLK6 RHCLK5 RHCLK4 I1 Input RHCLK2 RHCLK3 RHCLK0 RHCLK1 RHCLK6 RHCLK7 RHCLK4 RHCLK5
I0 Input GCLK7 or GCLK11 GCLK6 or GCLK10 GCLK5 or GCLK9 GCLK4 or GCLK8 GCLK3 or GCLK15 GCLK2 or GCLK14 GCLK1 or GCLK13 GCLK0 or GCLK12
I1 Input GCLK6 or GCLK10 GCLK7 or GCLK11 GCLK4 or GCLK8 GCLK5 or GCLK9 GCLK2 or GCLK14 GCLK3 or GCLK15 GCLK0 or GCLK12 GCLK1 or GCLK13
X1Y10 X1Y11 X2Y10 X2Y11 X1Y0 X1Y1 X2Y0 X2Y1
The connections for the bottom-edge BUFGMUX elements are similar to the top-edge connections (see Figure 46).
On the left and right edges, only two clock inputs feed each pair of BUFGMUX elements.
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Left-/Right-Half BUFGMUX CLK Switch Matrix BUFGMUX S I0 I1 I0
Top/Bottom (Global) BUFGMUX CLK Switch Matrix BUFGMUX S I0 I1 I0 I1 S
0O 1
0O 1 0O 1
0O I1 1 S LHCLK or RHCLK input Double Line DCM output*
*(XC3S1200E and XC3S1600E only)
1st GCLK pin 1st DCM output Double Line 2nd DCM output 2nd GCLK pin
DS312-2_16_110706
Figure 46: Clock Switch Matrix to BUFGMUX Pair Connectivity
Quadrant Clock Routing
The clock routing within the FPGA is quadrant-based, as shown in Figure 45. Each clock quadrant supports eight total clock signals, labeled `A' through `H' in Table 41 and Figure 47. The clock source for an individual clock line originates either from a global BUFGMUX element along the top and bottom edges or from a BUFGMUX element along the associated edge, as shown in Figure 47. The clock lines feed the synchronous resource elements (CLBs, IOBs, block RAM, multipliers, and DCMs) within the quadrant.
The four quadrants of the device are: * * * * Top Right (TR) Bottom Right (BR) Bottom Left (BL) Top Left (TL)
Note that the quadrant clock notation (TR, BR, BL, TL) is separate from that used for similar IOB placement constraints.
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Functional Description
BUFGMUX Output X1Y10 (Global) X0Y9 (Left Half) X1Y11 (Global) X0Y8 (Left Half) X2Y10 (Global) X0Y7 (Left Half) X2Y11 (Global) X0Y6 (Left Half) X1Y0 (Global) X0Y5 (Left Half) X1Y1 (Global) X0Y4 (Left Half) X2Y0 (Global) X0Y3 (Left Half) X2Y1 (Global) X0Y2 (Left Half)
Clock Line
BUFGMUX Output X1Y10 (Global) X3Y9 (Right Half) X1Y11 (Global) X3Y8 (Right Half) X2Y10 (Global) X3Y7 (Right Half) X2Y11 (Global) X3Y6 (Right Half) X1Y0 (Global) X3Y5 (Right Half) X1Y1 (Global) X3Y4 (Right Half) X2Y0 (Global) X3Y3 (Right Half) X2Y1 (Global) X3Y2 (Right Half)
Clock Line
H G
H G
F E
F E
D
D
C
C
B
B
A
A
a. Left (TL and BL Quadrants) Half of Die
b. Right (TR and BR Quadrants) Half of Die
DS312-2_17_103105
Figure 47: Clock Sources for the Eight Clock Lines within a Clock Quadrant The outputs of the top or bottom BUFGMUX elements connect to two vertical spines, each comprising four vertical clock lines as shown in Figure 45. At the center of the die, these clock signals connect to the eight-line horizontal clock spine. Outputs of the left and right BUFGMUX elements are routed onto the left or right horizontal spines, each comprising eight horizontal clock lines. Each of the eight clock signals in a clock quadrant derives either from a global clock signal or a half clock signal. In other words, there are up to 24 total potential clock inputs to the FPGA, eight of which can connect to clocked elements in a single clock quadrant. Figure 47 shows how the clock lines in each quadrant are selected from associated BUFGMUX sources. For example, if quadrant clock `A' in the bottom left (BL) quadrant originates from BUFGMUX_X2Y1, then the clock signal from BUFGMUX_X0Y2 is unavailable in the bottom left quadrant. However, the top left (TL) quadrant clock `A' can still solely use the output from either BUFGMUX_X2Y1 or BUFGMUX_X0Y2 as the source. To minimize the dynamic power dissipation of the clock network, the Xilinx development software automatically disables all clock segments not in use.
Performance Differences between Top/Bottom and Left-/Right-Half Global Buffers
The top and bottom global buffers support higher clock frequencies than the left- and right-half buffers. Consequently, clocks exceeding 230 MHz must use the top or bottom global buffers and, if required for the application, their associated DCMs. See Table 100 in Module 3.
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Interconnect
Interconnect is the programmable network of signal pathways between the inputs and outputs of functional elements within the FPGA, such as IOBs, CLBs, DCMs, and block RAM.
Switch Matrix
The switch matrix connects to the different kinds of interconnects across the device. An interconnect tile, shown in Figure 48, is defined as a single switch matrix connected to a functional element, such as a CLB, IOB, or DCM. If a functional element spans across multiple switch matrices such as the block RAM or multipliers, then an interconnect tile is defined by the number of switch matrices connected to that functional element. A Spartan-3E device can be represented as an array of interconnect tiles where interconnect resources are for the channel between any two adjacent interconnect tile rows or columns as shown in Figure 49.
Overview
Interconnect, also called routing, is segmented for optimal connectivity. Functionally, interconnect resources are identical to that of the Spartan-3 architecture. There are four kinds of interconnects: long lines, hex lines, double lines, and direct lines. The Xilinx Place and Route (PAR) software exploits the rich interconnect array to deliver optimal system performance and the fastest compile times.
Switch Matrix
CLB
Switch Matrix Switch Matrix
Switch Matrix
IOB Switch Matrix
18Kb Block RAM
MULT 18 x 18
Switch Matrix
DCM
Switch Matrix
DS312_08_020905
Figure 48: Four Types of Interconnect Tiles (CLBs, IOBs, DCMs, and Block RAM/Multiplier)
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Functional Description
Switch Matrix
IOB
Switch Matrix
IOB
Switch Matrix
IOB
Switch Matrix
IOB
Switch Matrix
Switch Matrix
IOB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
Switch Matrix
IOB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
Switch Matrix
IOB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
Switch Matrix
IOB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
DS312_09_020905
Figure 49: Array of Interconnect Tiles in Spartan-3E FPGA Horizontal and Vertical Long Lines (horizontal channel shown as an example)
24
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
* * *
* * *
* * *
* * *
6
6
6
6
DS312-2_10_022305
Horizontal and Vertical Hex Lines (horizontal channel shown as an example)
8
CLB
CLB
CLB
CLB
CLB
CLB
DS312-2_11_020905
Horizontal and Vertical Double Lines (horizontal channel shown as an example)
8
CLB
CLB
CLB
DS312-2_15_022305
Figure 50: Interconnect Types between Two Adjacent Interconnect Tiles
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* * *
6
CLB
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Direct Connections
CLB CLB CLB
CLB
CLB
CLB
CLB
CLB
CLB
DS312-2_12_020905
Figure 50: Interconnect Types between Two Adjacent Interconnect Tiles (Continued) The four types of general-purpose interconnect available in each channel, shown in Figure 50, are described below.
Global Controls (STARTUP_SPARTAN3E)
In addition to the general-purpose interconnect, Spartan-3E FPGAs have two global logic control signals, as described in Table 42. These signals are available to the FPGA application via the STARTUP_SPARTAN3E primitive. Table 42: Spartan-3E Global Logic Control Signals Global Control Input Description Global Set/Reset: When High, asynchronously places all registers and flip-flops in their initial state (see Initialization, page 31). Asserted automatically during the FPGA configuration process (see Start-Up, page 107). Global Three-State: When High, asynchronously forces all I/O pins to a high-impedance state (Hi-Z, three-state).
Long Lines
Each set of 24 long line signals spans the die both horizontally and vertically and connects to one out of every six interconnect tiles. At any tile, four of the long lines drive or receive signals from a switch matrix. Because of their low capacitance, these lines are well-suited for carrying high-frequency signals with minimal loading effects (e.g. skew). If all global clock lines are already committed and additional clock signals remain to be assigned, long lines serve as a good alternative.
GSR
Hex Lines
Each set of eight hex lines are connected to one out of every three tiles, both horizontally and vertically. Thirty-two hex lines are available between any given interconnect tile. Hex lines are only driven from one end of the route.
GTS
Double Lines
Each set of eight double lines are connected to every other tile, both horizontally and vertically. in all four directions. Thirty-two double lines available between any given interconnect tile. Double lines are more connections and more flexibility, compared to long line and hex lines.
Direct Connections
Direct connect lines route signals to neighboring tiles: vertically, horizontally, and diagonally. These lines most often drive a signal from a "source" tile to a double, hex, or long line and conversely from the longer interconnect back to a direct line accessing a "destination" tile.
The Global Set/Reset (GSR) signal replaces the global reset signal included in many ASIC-style designs. Use the GSR control instead of a separate global reset signal in the design to free up CLB inputs, resulting in a smaller, more efficient design. Similarly, the GSR signal is asserted automatically during the FPGA configuration process, guaranteeing that the FPGA starts-up in a known state. The STARTUP_SPARTAN3E primitive also includes two other signals used specifically during configuration. The MBT signals are for Dynamically Loading Multiple Configuration Images Using MultiBoot Option, page 93. The CLK input is an alternate clock for configuration Start-Up, page 107.
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Functional Description borrowed and returned to the application as general-purpose user I/Os after configuration completes. Spartan-3E FPGAs offer several configuration options to minimize the impact of configuration on the overall system design. In some configuration modes, the FPGA generates a clock and loads itself from an external memory source, either serially or via a byte-wide data path. Alternatively, an external host such as a microprocessor downloads the FPGA's configuration data using a simple synchronous serial interface or via a byte-wide peripheral-style interface. Furthermore, multiple-FPGA designs share a single configuration memory source, creating a structure called a daisy chain. Three FPGA pins--M2, M1, and M0--select the desired configuration mode. The mode pin settings appear in Table 43. The mode pin values are sampled during the start of configuration when the FPGA's INIT_B output goes High. After the FPGA completes configuration, the mode pins are available as user I/Os.
Configuration
Differences from Spartan-3 FPGAs
In general, Spartan-3E FPGA configuration modes are a superset to those available in Spartan-3 FPGAs. Two new modes added in Spartan-3E FPGAs provide a glue-less configuration interface to industry-standard parallel NOR Flash and SPI serial Flash memories. Unlike Spartan-3 FPGAs, nearly all of the Spartan-3E configuration pins become available as user I/Os after configuration.
Configuration Process
The function of a Spartan-3E FPGA is defined by loading application-specific configuration data into the FPGA's internal, reprogrammable CMOS configuration latches (CCLs), similar to the way a microprocessor's function is defined by its application program. For FPGAs, this configuration process uses a subset of the device pins, some of which are dedicated to configuration; other pins are merely
Table 43: Spartan-3E Configuration Mode Options and Pin Settings
Master Serial M[2:0] mode pin settings Data width Configuration memory source <0:0:0> SPI <0:0:1> BPI <0:1:0>=Up <0:1:1>=Down Byte-wide Industry-standard parallel NOR Flash or Xilinx parallel Platform Flash Internal oscillator Slave Parallel <1:1:0> Slave Serial <1:1:1> JTAG <1:0:1>
Serial Xilinx Platform Flash
Serial Industry-standard SPI serial Flash
Byte-wide Any source via microcontroller, CPU, Xilinx parallel Platform Flash, etc. External clock on CCLK pin
Serial Any source via microcontroller, CPU, Xilinx Platform Flash, etc. External clock on CCLK pin
Serial Any source via microcontroller, CPU, System ACETM CF, etc.
Clock source Total I/O pins borrowed during configuration Configuration mode for downstream daisy-chained FPGAs Stand-alone FPGA applications (no external download host) Uses low-cost, industry-standard Flash Supports optional MultiBoot, multi-configuration mode
Internal oscillator
Internal oscillator
External clock on TCK pin
8
Slave Serial
13
Slave Serial
46
Slave Parallel
21
Slave Parallel or Memory Mapped
Possible using XCFxxP Platform Flash, which optionally generates CCLK
8
Slave Serial
0
JTAG
Possible using XCFxxP Platform Flash, which optionally generates CCLK
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Configuration Bitstream Image Sizes
A specific Spartan-3E part type always requires a constant number of configuration bits, regardless of design complexity, as shown in Table 44. The configuration file size for a multiple-FPGA daisy-chain design roughly equals the sum of the individual file sizes. Table 44: Number of Bits to Program a Spartan-3E FPGA (Uncompressed Bitstreams) Spartan-3E FPGA XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Number of Configuration Bits 581,344 1,353,728 2,270,208 3,841,184 5,969,696
Pin Behavior During Configuration
Table 45 shows how various pins behave during the FPGA configuration process. The actual behavior depends on the values applied to the M2, M1, and M0 mode select pins and the HSWAP pin. The mode select pins determine which of the I/O pins are borrowed during configuration and how they function. In JTAG configuration mode, no user-I/O pins are borrowed for configuration. All user-I/O pins, input-only pins, and dual-purpose pins that are not actively involved in the currently-select configuration mode are high impedance (floating, three-stated, Hi-Z) during the configuration process. These pins are indicated in Table 45 as gray shaded table entries or cells. The HSWAP input controls whether all user-I/O pins, input-only pins, and dual-purpose pins have a pull-up resistor to the supply rail or not. When HSWAP is Low, each pin has an internal pull-up resistor that is active throughout configuration. After configuration, pull-up and pull-down resistors are available in the FPGA application as described in Pull-Up and Pull-Down Resistors. The yellow-shaded table entries or cells represent pins where the pull-up resistor is always enabled during configuration, regardless of the HSWAP input. The post-configuration behavior of these pins is defined by Bitstream Generator options as defined in Table 68.
Table 45: Pin Behavior during Configuration
Pin Name IO* (user-I/O) IP* (input-only) TDI TMS TCK TDO PROG_B DONE HSWAP M2 M1 M0 CCLK INIT_B CSO_B DOUT/BUSY MOSI/CSI_B D7 D6 D5 D4 DOUT TDI TMS TCK TDO PROG_B DONE HSWAP 0 0 0 CCLK (I/O) INIT_B TDI TMS TCK TDO PROG_B DONE HSWAP 0 0 1 CCLK (I/O) INIT_B CSO_B DOUT MOSI TDI TMS TCK TDO PROG_B DONE HSWAP 0 1 0 = Up 1 = Down CCLK (I/O) INIT_B CSO_B BUSY CSI_B D7 D6 D5 D4 TDI TMS TCK TDO PROG_B DONE HSWAP 1 0 1 TDI TMS TCK TDO PROG_B DONE HSWAP 1 1 0 CCLK (I) INIT_B CSO_B BUSY CSI_B D7 D6 D5 D4 DOUT TDI TMS TCK TDO PROG_B DONE HSWAP 1 1 1 CCLK (I) INIT_B Master Serial SPI (Serial Flash) BPI (Parallel NOR Flash) JTAG Slave Parallel Slave Serial Supply/ I/O Bank VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX 0 2 2 2 2 2 2 2 2 2 2 2 2
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Functional Description
Table 45: Pin Behavior during Configuration (Continued)
Pin Name D3 D2 D1 D0/DIN RDWR_B A23 A22 A21 A20 A19/VS2 A18/VS1 A17/VS0 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 LDC0 LDC1 LDC2 HDC VS2 VS1 VS0 DIN DIN Master Serial SPI (Serial Flash) BPI (Parallel NOR Flash) D3 D2 D1 D0 RDWR_B A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 LDC0 LDC1 LDC2 HDC JTAG Slave Parallel D3 D2 D1 D0 RDWR_B DIN Slave Serial Supply/ I/O Bank 2 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Notes: 1. Gray shaded cells represent pins that are in a high-impedance state (Hi-Z, floating) during configuration. These pins have an optional internal pull-up resistor to their respective VCCO supply pin that is active throughout configuration if the HSWAP input is Low. 2. Yellow shaded cells represent pins with an internal pull-up resistor to its respective voltage supply rail that is active during configuration, regardless of the HSWAP pin.
The HSWAP pin itself has an pull-up resistor enabled during configuration. However, the VCCO_0 supply voltage must be applied before the pull-up resistor becomes active. If the VCCO_0 supply ramps after the VCCO_2 power supply, do not let HSWAP float; tie HSWAP to the desired logic level externally.
Spartan-3E FPGAs have only six dedicated configuration pins, including the DONE and PROG_B pins, and the four JTAG boundary-scan pins: TDI, TDO, TMS, and TCK. All other configuration pins are dual-purpose I/O pins and are available to the FPGA application after the DONE pin goes High. See Start-Up for additional information.
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Table 46: Default I/O Standard Setting During Configuration (VCCO_2 = 2.5V) Pin(s) All, including CCLK I/O Standard LVCMOS25 Output Drive 8 mA Slew Rate Slow
Table 46 shows the default I/O standard setting for the various configuration pins during the configuration process. The configuration interface is designed primarily for 2.5V operation when the VCCO_2 (and VCCO_1 in BPI mode) connects to 2.5V. The configuration pins also operate at other voltages by setting VCCO_2 (and VCCO_1 in BPI mode) to either 3.3V or 1.8V. The change on the VCCO supply also changes the I/O drive characteristics. For example, with VCCO = 3.3V, the output current when driving High, IOH, increases to approximately 12 to 16 mA, while the current when driving Low, IOL, remains 8 mA. At VCCO = 1.8V, the output current when driving High, IOH, decreases slightly to approximately 6 to 8 mA. Again, the current when driving Low, IOL, remains 8 mA.
Design Considerations for the HSWAP, M[2:0], and VS[2:0] Pins
Unlike previous Spartan FPGA families, nearly all of the Spartan-3E dual-purpose configuration pins are available as full-featured user I/O pins after successful configuration, when the DONE output goes High. The HSWAP pin, the mode select pins (M[2:0]), and the variant-select pins (VS[2:0]) must have valid and stable logic values at the start of configuration. VS[2:0] are only used in the SPI configuration mode. The levels on the M[2:0] pins and VS[2:0] pins are sampled when the INIT_B pin returns High. See Figure 77 for a timing example. The HSWAP pin defines whether FPGA user I/O pins have a pull-up resistor connected to their associated VCCO supply pin during configuration or not, as shown Table 47. HSWAP must be valid at the start of configuration and remain constant throughout the configuration process. Table 47: HSWAP Behavior HSWAP Value 0 Description Pull-up resistors connect to the associated VCCO supply for all user-I/O or dual-purpose I/O pins during configuration. Pull-up resistors are active until configuration completes. Pull-up resistors disabled during configuration. All user-I/O or dual-purpose I/O pins are in a high-impedance state.
CCLK Design Considerations
The FPGA's configuration process is controlled by the CCLK configuration clock. Consequently, signal integrity of CCLK is important to guarantee successful configuration. Poor CCLK signal integrity caused by ringing or reflections might cause double-clocking, causing the configuration process to fail. Although the CCLK frequency is relatively low, Spartan-3E FPGA output edge rates are fast. Therefore, careful attention must be paid to the CCLK signal integrity on the printed circuit board. Signal integrity simulation with IBIS is recommended. For all configuration modes except JTAG, the signal integrity must be considered at every CCLK trace destination, including the FPGA's CCLK pin. This analysis is especially important when the FPGA re-uses the CCLK pin as a user-I/O after configuration. In these cases, there might be unrelated devices attached to CCLK, which add additional trace length and signal destinations. In the Master Serial, SPI, and BPI configuration modes, the FPGA drives the CCLK pin and CCLK should be treated as a full bidirectional I/O pin for signal integrity analysis. In BPI mode, CCLK is only used in multi-FPGA daisy-chains. The best signal integrity is ensured by following these basic PCB guidelines: * * * * Route the CCLK signal as a 50 controlled-impedance transmission line. Route the CCLK signal without any branching. Do not use a "star" topology. Keep stubs, if required, shorter than 10 mm (0.4 inches). Terminate the end of the CCLK transmission line.
1
The Configuration section provides detailed schematics for each configuration mode. The schematics indicate the required logic values for HSWAP, M[2:0], and VS[2:0] but do not specify how the application provides the logic Low or High value. The HSWAP, M[2:0], and VS[2:0] pins can be either dedicated or reused by the FPGA application.
Dedicating the HSWAP, M[2:0], and VS[2:0] Pins
If the HSWAP, M[2:0], and VS[2:0] pins are not required by the FPGA design after configuration, simply connect these pins directly to the VCCO or GND supply rail shown in the appropriate configuration schematic.
Reusing HSWAP, M[2:0], and VS[2:0] After Configuration
To reuse the HSWAP, M[2:0], and VS[2:0] pin after configuration, use pull-up or pull-down resistors to define the logic values shown in the appropriate configuration schematic.
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Functional Description
Table 48: Pull-up or Pull-down Values for HSWAP, M[2:0], and VS[2:0] Required Resistor Value to Define Logic Level on HSWAP, M[2:0], or VS[2:0] High Pulled High via an internal pull-up resistor to the associated VCCO supply. No external pull-up resistor is necessary. Pulled High using a 3.3 to 4.7 k resistor to the associated VCCO supply. Low Pulled Low using an appropriately sized pull-down resistor to GND. For a 2.5V or 3.3V interface: R < 560 . For a 1.8V interface: R < 1.1 k. Pulled Low using a 3.3 to 4.7 k resistor to GND.
HSWAP Value 0
I/O Pull-up Resistors during Configuration Enabled
1
Disabled
The logic level on HSWAP dictates how to define the logic levels on M[2:0] and VS[2:0], as shown in Table 48. If the application requires HSWAP to be High, the HSWAP pin is pulled High using an external 3.3 to 4.7 k resistor to VCCO_0. If the application requires HSWAP to be Low during configuration, then HSWAP is either connected to GND or pulled Low using an appropriately sized external pull-down resistor to GND. When HSWAP is Low, its pin has an internal pull-up resistor to VCCO_0. The external pull-down resistor must be strong enough to define a logic Low on HSWAP for the I/O standard used during configuration. For 2.5V or 3.3V I/O, the pull-down resistor is 560 or
lower. For 1.8V I/O, the pull-down resistor is 1.1 k or lower. Once HSWAP is defined, use Table 48 to define the logic values for M[2:0] and VS[2:0]. Use the weakest external pull-up or pull-down resistor value allowed by the application. The resistor must be strong enough to define a logic Low or High during configuration. However, when driving the HSWAP, M[2:0], or VS[2:0] pins after configuration, the output driver must be strong enough to overcome the pull-up or pull-down resistor value and generate the appropriate logic levels. For example, to overcome a 560 pull-down resistor, a 3.3V FPGA I/O pin must use a 6 mA or stronger driver.
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Master Serial Mode
In Master Serial mode (M[2:0] = <0:0:0>), the Spartan-3E FPGA configures itself from an attached Xilinx Platform Flash PROM, as illustrated in Figure 51. The FPGA supplies the CCLK output clock from its internal oscillator to the
+1.2V
attached Platform Flash PROM. In response, the Platform Flash PROM supplies bit-serial data to the FPGA's DIN input, and the FPGA accepts this data on each rising CCLK edge.
P
Serial Master Mode `0' `0' `0'
VCCO_0
M2 M1 M0
VCCO_2 DIN CCLK DOUT INIT_B
V
4.7k
VCCINT HSWAP VCCO_0
V
XCFxxS = +3.3V XCFxxP = +1.8V VCCINT D0 CLK OE/RESET VCCO
V
+2.5V
Spartan-3E
4.7k
330
Platform Flash XCFxx
CE CEO VCCJ TDO +2.5V CF
+2.5V JTAG TDI TMS TCK TDO
TDI TMS TCK PROG_B GND
VCCAUX TDO
+2.5V TDI TMS TCK GND
DONE
PROG_B Recommend open-drain driver
DS312-2_44_102105
Figure 51: Master Serial Mode using Platform Flash PROM All mode select pins, M[2:0], must be Low when sampled, when the FPGA's INIT_B output goes High. After configuration, when the FPGA's DONE output goes High, the mode select pins are available as full-featured user-I/O pins.
P Similarly, the FPGA's HSWAP pin must be Low to enable pull-up resistors on all user-I/O pins during configuration or High to disable the pull-up resistors. The HSWAP control must remain at a constant logic level throughout
FPGA configuration. After configuration, when the FPGA's DONE output goes High, the HSWAP pin is available as full-featured user-I/O pin and is powered by the VCCO_0 supply. The FPGA's DOUT pin is used in daisy-chain applications, described later. In a single-FPGA application, the FPGA's DOUT pin is not used but is actively driving during the configuration process.
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Functional Description
Table 49: Serial Master Mode Connections
Pin Name HSWAP FPGA Direction Input Description User I/O Pull-Up Control. When Low during configuration, enables pull-up resistors in all I/O pins to respective I/O bank VCCO input. 0: Pull-ups during configuration 1: No pull-ups M[2:0] Input Mode Select. Selects the FPGA configuration mode. See Design Considerations for the HSWAP, M[2:0], and VS[2:0] Pins. Serial Data Input. Configuration Clock. Generated by FPGA internal oscillator. Frequency controlled by ConfigRate bitstream generator option. If CCLK PCB trace is long or has multiple connections, terminate this output to maintain signal integrity. See CCLK Design Considerations. Serial Data Output. M2 = 0, M1 = 0, M0 = 0. Sampled when INIT_B goes High. Receives serial data from PROM's D0 output. Drives PROM's CLK clock input. User I/O During Configuration Drive at valid logic level throughout configuration. After Configuration User I/O
P
DIN CCLK
Input Output
User I/O User I/O
DOUT
Output
Actively drives. Not used in single-FPGA designs. In a daisy-chain configuration, this pin connects to DIN input of the next FPGA in the chain. Connects to PROM's OE/RESET input. FPGA clears PROM's address counter at start of configuration, enables outputs during configuration. PROM also holds FPGA in Initialization state until PROM reaches Power-On Reset (POR) state. If CRC error detected during configuration, FPGA drives INIT_B Low.
User I/O
INIT_B
Open-drain bidirectional I/O
Initialization Indicator. Active Low. Goes Low at start of configuration during Initialization memory clearing process. Released at end of memory clearing, when mode select pins are sampled. Requires external 4.7 k pull-up resistor to VCCO_2.
User I/O. If unused in the application, drive INIT_B High.
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Functional Description Table 49: Serial Master Mode Connections (Continued)
Pin Name DONE FPGA Direction Open-drain bidirectional I/O Description FPGA Configuration Done. Low during configuration. Goes High when FPGA successfully completes configuration. Requires external 330 pull-up resistor to 2.5V. During Configuration Connects to PROM's chip-enable (CE) input. Enables PROM during configuration. Disables PROM after configuration. After Configuration Pulled High via external pull-up. When High, indicates that the FPGA successfully configured. Drive PROG_B Low and release to reprogram FPGA.
R
PROG_B
Input
Program FPGA. Active Low. When asserted Low for 300 ns or longer, forces the FPGA to restart its configuration process by clearing configuration memory and resetting the DONE and INIT_B pins once PROG_B returns High. Requires external 4.7 k pull-up resistor to 2.5V. If driving externally with a 3.3V output, use an open-drain or open-collector driver or use a current limiting series resistor.
Must be High during configuration to allow configuration to start. Connects to PROM's CF pin, allowing JTAG PROM programming algorithm to reprogram the FPGA.
Voltage Compatibility
The PROM's VCCINT supply must be either 3.3V for the serial XCFxxS Platform Flash PROMs or 1.8V for the serial/parallel XCFxxP PROMs.
V The FPGA's VCCO_2 supply input and the Platform
Flash PROM's VCCO supply input must be the same voltage, ideally +2.5V. Both devices also support 1.8V and 3.3V interfaces but the FPGA's PROG_B and DONE pins require special attention as they are powered by the FPGA's VCCAUX supply, nominally 2.5V. See application note XAPP453: The 3.3V Configuration of Spartan-3 FPGAs for additional information.
The XC3S1600E requires an 8 Mbit PROM. Two solutions are possible: either a single 8 Mbit XCF08P parallel/serial PROM or two 4 Mbit XCF04S serial PROMs cascaded. The two XCF04S PROMs use a 3.3V VCCINT supply while the XCF08P requires a 1.8V VCCINT supply. If the board does not already have a 1.8V supply available, the two cascaded XCF04S PROM solution is recommended.
CCLK Frequency
In Master Serial mode, the FPGA's internal oscillator generates the configuration clock frequency. The FPGA provides this clock on its CCLK output pin, driving the PROM's CLK input pin. The FPGA starts configuration at its lowest frequency and increases its frequency for the remainder of the configuration process if so specified in the configuration bitstream. The maximum frequency is specified using the ConfigRate bitstream generator option. Table 51 shows the maximum ConfigRate settings, approximately equal to MHz, for various Platform Flash devices and I/O voltages. For the serial XCFxxS PROMs, the maximum frequency also depends on the interface voltage. Table 51: Maximum ConfigRate Settings for Platform Flash Platform Flash Part Number XCF01S XCF02S XCF04S XCF08P XCF16P XCF32P I/O Voltage (VCCO_2, VCCO) 3.3V or 2.5V 1.8V 3.3V, 2.5V, or 1.8V Maximum ConfigRate Setting 25 12 25
Supported Platform Flash PROMs
Table 50 shows the smallest available Platform Flash PROM to program one Spartan-3E FPGA. A multiple-FPGA daisy-chain application requires a Platform Flash PROM large enough to contain the sum of the various FPGA file sizes. Table 50: Number of Bits to Program a Spartan-3E FPGA and Smallest Platform Flash PROM Spartan-3E FPGA XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Number of Configuration Bits 581,344 1,353,728 2,270,208 3,841,184 5,969,696 Smallest Available Platform Flash XCF01S XCF02S XCF04S XCF04S XCF08P or 2 x XCF04S
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Functional Description
CCLK +1.2V XCFxxS = +3.3V XCFxxP = +1.8V VCCO_0 +1.2V
P
Serial Master Mode `0' `0' `0'
HSWAP
VCCINT VCCO_0 VCCO_2 DIN CCLK DOUT INIT_B
P
VCCINT D0 CLK OE/RESET VCCO
HSWAP
VCCINT VCCO_0 VCCO_2
VCCO_0
V
V
Slave Serial Mode `1' `1' `1' M2 M1 M0
V
M2 M1 M0
DOUT INIT_B
DOUT
Spartan-3E FPGA
+2.5V JTAG TDI TMS TCK TDO VCCAUX TDO +2.5V
Platform Flash XCFxx
CE CF CEO VCCJ TDO +2.5V TDI TMS TCK CCLK DIN
Spartan-3E FPGA
VCCAUX TDO +2.5V
TDI TMS TCK PROG_B GND
TDI TMS TCK GND
+2.5V
V
DONE
PROG_B
DONE GND
330
4.7k
4.7k
PROG_B Recommend open-drain driver
PROG_B TCK TMS DONE INIT_B
DS312-2_45_102105
Figure 52: Daisy-Chaining from Master Serial Mode
Daisy-Chaining
If the application requires multiple FPGAs with different configurations, then configure the FPGAs using a daisy chain, as shown in Figure 52. Use Master Serial mode (M[2:0] = <0:0:0>) for the FPGA connected to the Platform Flash PROM and Slave Serial mode (M[2:0] = <1:1:1>) for all other FPGAs in the daisy-chain. After the master FPGA--the FPGA on the left in the diagram--finishes loading its configuration data from the Platform Flash, the master device supplies data using its DOUT output pin to the next device in the daisy-chain, on the falling CCLK edge.
is provided by the Xilinx iMPACT programming software and the associated Xilinx Parallel Cable IV, MultiPRO, or Platform Cable USB programming cables.
Storing Additional User Data in Platform Flash
After configuration, the FPGA application can continue to use the Master Serial interface pins to communicate with the Platform Flash PROM. If desired, use a larger Platform Flash PROM to hold additional non-volatile application data, such as MicroBlaze processor code, or other user data such as serial numbers and Ethernet MAC IDs. The FPGA first configures from Platform Flash PROM. Then using FPGA logic after configuration, the FPGA copies MicroBlaze code from Platform Flash into external DDR SDRAM for code execution. See XAPP694: Reading User Data from Configuration PROMs and XAPP482: MicroBlaze Platform Flash/PROM Boot Loader and User Data Storage for specific details on how to implement such an interface.
JTAG Interface
Both the Spartan-3E FPGA and the Platform Flash PROM have a four-wire IEEE 1149.1/1532 JTAG port. Both devices share the TCK clock input and the TMS mode select input. The devices may connect in either order on the JTAG chain with the TDO output of one device feeding the TDI input of the following device in the chain. The TDO output of the last device in the JTAG chain drives the JTAG connector. The JTAG interface on Spartan-3E FPGAs is powered by the 2.5V VCCAUX supply. Consequently, the PROM's VCCJ supply input must also be 2.5V. To create a 3.3V JTAG interface, please refer to application note XAPP453: The 3.3V Configuration of Spartan-3 FPGAs for additional information.
SPI Serial Flash Mode
In SPI Serial Flash mode (M[2:0] = <0:0:1>), the Spartan-3E FPGA configures itself from an attached industry-standard SPI serial Flash PROM, as illustrated in Figure 53 and Figure 54. The FPGA supplies the CCLK output clock from its internal oscillator to the clock input of the attached SPI Flash PROM.
In-System Programming Support
Both the FPGA and the Platform Flash PROM are in-system programmable via the JTAG chain. Download support
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Functional Description
R
+1.2V
+3.3V
4.7k
P
VCCINT HSWAP VCCO_0 VCCO_2 MOSI DIN CSO_B
VCCO_0 +3.3V
P
SPI Serial Flash
VCC DATA_IN DATA_OUT SELECT WR_PROTECT HOLD CLOCK GND
I
SPI Mode `0' `0' `1' Variant Select `1' M2 M1 M0
W
`1'
`1'
CCLK DOUT INIT_B VCCAUX TDO +2.5V
+2.5V JTAG TDI TMS TCK TDO
4.7k
+2.5V
S
VS2 VS1 VS0
Spartan-3E FPGA
+3.3V
330
DONE GND
PROG_B
PROG_B
Recommend open-drain driver
4.7k
DS312-2_46_103105
TDI TMS TCK
Figure 53: SPI Flash PROM Interface for PROMs Supporting READ (0x03) and FAST_READ (0x0B) Commands
S Although SPI is a standard four-wire interface, various
available SPI Flash PROMs use different command protocols. The FPGA's variant select pins, VS[2:0], define how the FPGA communicates with the SPI Flash, including which SPI Flash command the FPGA issues to start the read operation and the number of dummy bytes inserted before the FPGA expects to receive valid data from the SPI Flash. Table 52 shows the available SPI Flash PROMs expected to operate with Spartan-3E FPGAs. Other compatible devices might work but have not been tested for suitability with Spartan-3E FPGAs. All other VS[2:0] values are reserved for future use. Consult the data sheet for the desired SPI Flash device to determine its suitability. The basic timing requirements and waveforms are provided in Serial Peripheral Interface (SPI) Configuration Timing in Module 3.
Figure 53 shows the general connection diagram for those SPI Flash PROMs that support the 0x03 READ command or the 0x0B FAST READ commands. Figure 54 shows the connection diagram for Atmel DataFlash serial PROMs, which also use an SPI-based protocol. `B'-series DataFlash devices are limited to FPGA applications operating over the commercial temperature range. Industrial temperature range applications must use `C'- or `D'-series DataFlash devices, which have a shorter DataFlash select setup time, because of the faster FPGA CCLK frequency at cold temperatures. Figure 57, page 84 demonstrates how to configure multiple FPGAs with different configurations, all stored in a single SPI Flash. The diagram uses standard SPI Flash memories but the same general technique applies for Atmel DataFlash.
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Functional Description
+1.2V
+3.3V
VCCINT
P
HSWAP
VCCO_0 VCCO_2 MOSI
VCCO_0 +3.3V
I
4.7k
P
VCC SI SO CS WP RESET RDY/BUSY SCK GND
Atmel AT45DB DataFlash
SPI Mode `0' `0' `1' Variant Select `1' `1' `0'
VS2 VS1 VS0 M2 M1 M0
DIN CSO_B
W
`1'
Spartan-3E FPGA
+3.3V
Power-on monitor is only required if +3.3V (VCCO_2) supply is the last supply in power-on sequence, after VCCINT and VCCAUX. Must delay FPGA configuration for > 20 ms after SPI DataFlash reaches its minimum VCC. Force FPGA INIT_B input OR PROG_B input Low with an open-drain or opencollector driver.
+3.3V
DOUT INIT_B +2.5V JTAG TDI TMS TCK TDO PROG_B GND DONE VCCAUX TDI TMS TCK TDO +2.5V
4.7k
CCLK
INIT_B
+2.5V
Power-On Monitor
4.7k
330
or
+3.3V
PROG_B Recommend open-drain driver
PROG_B
Power-On Monitor
DS312-2_50a_031706
Figure 54: Atmel SPI-based DataFlash Configuration Interface
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Functional Description
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Table 52: Variant Select Codes for Various SPI Serial Flash PROMs SPI Read Command Dummy Bytes iMPACT Programming Support Yes
VS2
VS1
VS0
SPI Serial Flash Vendor STMicroelectronics (ST)
SPI Flash Family M25Pxx M25PExx/M45PExx AT45DB `D'-Series Data Flash AT26 / AT25
Atmel Intel Spansion (AMD, Fujitsu) 1 1 1 FAST READ (0x0B) (see Figure 53) 1 Winbond (NexFlash) Macronix Silicon Storage Technology (SST) Programmable Microelectronics Corp. (PMC) AMIC Technology Eon Silicon Solution, Inc. STMicroelectronics (ST) Spansion (AMD, Fujitsu) Winbond (NexFlash) 1 0 1 READ (0x03) (see Figure 53) Macronix 0 Silicon Storage Technology (SST) Programmable Microelectronics Corp. (PMC)
READ ARRAY (0xE8)
Yes
S33 S25FLxxxA NX25 / W25 MX25Lxxxx SST25LFxxxA SST25VFxxxA Pm25LVxxx A25L EN25 M25Pxx M25PExx/M45PExx S25FLxxxA NX25 / W25 MX25Lxxxx SST25LFxxxA SST25VFxxxA SST25VFxxx Pm25LVxxx AT45DB DataFlash Yes
1
1
0
(see Figure 54) Reserved
4
Atmel Corporation
(use only `C' or `D'
Series for Industrial temperature range)
Yes
Others
W Table 53 shows the connections between the SPI Flash PROM and the FPGA's SPI configuration interface. Each SPI Flash PROM vendor uses slightly different signal naming. The SPI Flash PROM's write protect and hold controls
are not used by the FPGA during configuration. However, the HOLD pin must be High during the configuration process. The PROM's write protect input must be High in order to write or program the Flash memory.
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Table 53: Example SPI Flash PROM Connections and Pin Naming Silicon Storage Technology SI SO CE# SCK Atmel DataFlash SI SO CS SCK
SPI Flash Pin DATA_IN DATA_OUT SELECT CLOCK WR_PROTECT
W
FPGA Connection MOSI DIN CSO_B CCLK Not required for FPGA configuration. Must be High to program SPI Flash. Optional connection to FPGA user I/O after configuration. Not required for FPGA configuration but must be High during configuration. Optional connection to FPGA user I/O after configuration. Not applicable to Atmel DataFlash. Only applicable to Atmel DataFlash. Not required for FPGA configuration but must be High during configuration. Optional connection to FPGA user I/O after configuration. Do not connect to FPGA's PROG_B as this will prevent direct programming of the DataFlash. Only applicable to Atmel DataFlash and only available on certain packages. Not required for FPGA configuration. Output from DataFlash PROM. Optional connection to FPGA user I/O after configuration.
STMicro D Q S C
NexFlash DI DO CS CLK
W
WP
WP#
WP
HOLD (see Figure 53)
HOLD
HOLD
HOLD#
N/A
RESET (see Figure 54)
N/A
N/A
N/A
RESET
RDY/BUSY (see Figure 54)
N/A
N/A
N/A
RDY/BUSY
The mode select pins, M[2:0], and the variant select pins, VS[2:0] are sampled when the FPGA's INIT_B output goes High and must be at defined logic levels during this time. After configuration, when the FPGA's DONE output goes High, these pins are all available as full-featured user-I/O pins. Similarly, the FPGA's HSWAP pin must be Low to enable pull-up resistors on all user-I/O pins or High to disP
able the pull-up resistors. The HSWAP control must remain at a constant logic level throughout FPGA configuration. After configuration, when the FPGA's DONE output goes High, the HSWAP pin is available as full-featured user-I/O pin and is powered by the VCCO_0 supply. In a single-FPGA application, the FPGA's DOUT pin is not used but is actively driving during the configuration process.
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Functional Description
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Table 54: Serial Peripheral Interface (SPI) Connections
Pin Name HSWAP FPGA Direction Input Description User I/O Pull-Up Control. When Low during configuration, enables pull-up resistors in all I/O pins to respective I/O bank VCCO input. 0: Pull-ups during configuration 1: No pull-ups M[2:0] Input Mode Select. Selects the FPGA configuration mode. See Design Considerations for the HSWAP, M[2:0], and VS[2:0] Pins. Variant Select. Instructs the FPGA how to communicate with the attached SPI Flash PROM. See Design Considerations for the HSWAP, M[2:0], and VS[2:0] Pins. Serial Data Output. M2 = 0, M1 = 0, M0 = 1. Sampled when INIT_B goes High. Must be at the logic levels shown in Table 52. Sampled when INIT_B goes High. User I/O During Configuration Drive at valid logic level throughout configuration. After Configuration User I/O
P
VS[2:0]
Input
User I/O
S
MOSI
Output
FPGA sends SPI Flash memory read commands and starting address to the PROM's serial data input. FPGA receives serial data from PROM's serial data output. Connects to the SPI Flash PROM's chip-select input. If HSWAP = 1, connect this signal to a 4.7 k pull-up resistor to 3.3V.
User I/O
DIN CSO_B
Input Output
Serial Data Input. Chip Select Output. Active Low.
User I/O Drive CSO_B High after configuration to disable the SPI Flash and reclaim the MOSI, DIN, and CCLK pins. Optionally, re-use this pin and MOSI, DIN, and CCLK to continue communicating with SPI Flash. User I/O
CCLK
Output
Configuration Clock. Generated by FPGA internal oscillator. Frequency controlled by ConfigRate bitstream generator option. If CCLK PCB trace is long or has multiple connections, terminate this output to maintain signal integrity. See CCLK Design Considerations. Serial Data Output.
Drives PROM's clock input.
DOUT
Output
Actively drives. Not used in single-FPGA designs. In a daisy-chain configuration, this pin connects to DIN input of the next FPGA in the chain.
User I/O
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Functional Description
Table 54: Serial Peripheral Interface (SPI) Connections (Continued)
Pin Name INIT_B FPGA Direction Open-drain bidirectional I/O Description Initialization Indicator. Active Low. Goes Low at start of configuration during Initialization memory clearing process. Released at end of memory clearing, when mode select pins are sampled. In daisy-chain applications, this signal requires an external 4.7 k pull-up resistor to VCCO_2. FPGA Configuration Done. Low during configuration. Goes High when FPGA successfully completes configuration. Requires external 330 pull-up resistor to 2.5V. Program FPGA. Active Low. When asserted Low for 300 ns or longer, forces the FPGA to restart its configuration process by clearing configuration memory and resetting the DONE and INIT_B pins once PROG_B returns High. Requires external 4.7 k pull-up resistor to 2.5V. If driving externally with a 3.3V output, use an open-drain or open-collector driver or use a current limiting series resistor. During Configuration Active during configuration. If SPI Flash PROM requires > 2 ms to awake after powering on, hold INIT_B Low until PROM is ready. If CRC error detected during configuration, FPGA drives INIT_B Low. Low indicates that the FPGA is not yet configured. After Configuration User I/O. If unused in the application, drive INIT_B High.
DONE
Open-drain bidirectional I/O
Pulled High via external pull-up. When High, indicates that the FPGA successfully configured. Drive PROG_B Low and release to reprogram FPGA. Hold PROG_B to force FPGA I/O pins into Hi-Z, allowing direct programming access to SPI Flash PROM pins.
PROG_B
Input
Must be High to allow configuration to start.
Voltage Compatibility
Available SPI Flash PROMs use a single 3.3V supply voltage. All of the FPGA's SPI Flash interface signals are within I/O Bank 2. Consequently, the FPGA's VCCO_2 supply voltage must also be 3.3V to match the SPI Flash PROM.
power supplies -- VCCINT, VCCAUX, and VCCO to I/O Bank 2 (VCCO_2) -- to reach their respective power-on thresholds before beginning the configuration process. The SPI Flash PROM is powered by the same voltage supply feeding the FPGA's VCCO_2 voltage input, typically 3.3V. SPI Flash PROMs specify that they cannot be accessed until their VCC supply reaches its minimum data sheet voltage, followed by an additional delay. For some devices, this additional delay is as little as 10 s as shown in Table 55. For other vendors, this delay is as much as 20 ms.
Power-On Precautions if 3.3V Supply is Last in Sequence
Spartan-3E FPGAs have a built-in power-on reset (POR) circuit, as shown in Figure 66. The FPGA waits for its three
Table 55: Example Minimum Power-On to Select Times for Various SPI Flash PROMs Vendor STMicroelectronics Spansion NexFlash Macronix Silicon Storage Technology Programmable Microelectronics Corporation Atmel Corporation SPI Flash PROM Part Number M25Pxx S25FLxxxA NX25xx MX25Lxxxx SST25LFxx Pm25LVxxx AT45DBxxxD AT45DBxxxB Data Sheet Minimum Time from VCC min to Select = Low Symbol TVSL tPU TVSL tVSL TPU-READ TVCS tVCSL Value 10 10 10 10 10 50 30 20 Units s ms s s s s s ms
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Functional Description In many systems, the 3.3V supply feeding the FPGA's VCCO_2 input is valid before the FPGA's other VCCINT and VCCAUX supplies, and consequently, there is no issue. How3.3V Supply SPI Flash cannot be selected SPI Flash PROM minimum voltage SPI Flash PROM CS delay (tVSL ) SPI Flash available for read operations SPI Flash PROM must be ready for FPGA access, otherwise delay FPGA configuration FPGA accesses SPI Flash PROM
DS312-2_50b_110206
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ever, if the 3.3V supply feeding the FPGA's VCCO_2 supply is last in the sequence, a potential race occurs between the FPGA and the SPI Flash PROM, as shown in Figure 55.
FPGA VCCO_2 minimum Power On Reset Voltage
(VCCO2T )
(VCCINT, VCCAUX already valid) FPGA initializes configuration memory (TPOR) Time
Figure 55: SPI Flash PROM/FPGA Power-On Timing if 3.3V Supply is Last in Power-On Sequence If the FPGA's VCCINT and VCCAUX supplies are already valid, then the FPGA waits for VCCO_2 to reach its minimum threshold voltage before starting configuration. This threshold voltage is labeled as VCCO2T in Table 73 of Module 3 and ranges from approximately 0.4V to 1.0V, substantially lower than the SPI Flash PROM's minimum voltage. Once all three FPGA supplies reach their respective Power On Reset (POR) thresholds, the FPGA starts the configuration process and begins initializing its internal configuration memory. Initialization requires approximately 1 ms (TPOR, minimum in Table 110 of Module 3, after which the FPGA de-asserts INIT_B, selects the SPI Flash PROM, and starts sending the appropriate read command. The SPI Flash PROM must be ready for read operations at this time. Spartan-3E FPGAs issue the read command just once. If the SPI Flash is not ready, then the FPGA does not properly configure. If the 3.3V supply is last in the sequence and does not ramp fast enough, or if the SPI Flash PROM cannot be ready when required by the FPGA, delay the FPGA configuration process by holding either the FPGA's PROG_B input or INIT_B input Low, as highlighted in Figure 54. Release the FPGA when the SPI Flash PROM is ready. For example, a simple R-C delay circuit attached to the INIT_B pin forces the FPGA to wait for a preselected amount of time. Alternately, a Power Good signal from the 3.3V supply or a system reset signal accomplishes the same purpose. Use an open-drain or open-collector output when driving PROG_B or INIT_B. a SPI Flash PROM large enough to contain the sum of the FPGA file sizes. An application can also use a larger-density SPI Flash PROM to hold additional data beyond just FPGA configuration data. For example, the SPI Flash PROM can also store application code for a MicroBlazeTM RISC processor core integrated in the Spartan-3E FPGA. See Using the SPI Flash Interface after Configuration. Table 56: Number of Bits to Program a Spartan-3E FPGA and Smallest SPI Flash PROM Number of Configuration Bits 581,344 1,353,728 2,270,208 3,841,184 5,969,696 Smallest Usable SPI Flash PROM 1 Mbit 2 Mbit 4 Mbit 4 Mbit 8 Mbit
Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
CCLK Frequency
In SPI Flash mode, the FPGA's internal oscillator generates the configuration clock frequency. The FPGA provides this clock on its CCLK output pin, driving the PROM's clock input pin. The FPGA starts configuration at its lowest frequency and increases its frequency for the remainder of the configuration process if so specified in the configuration bitstream. The maximum frequency is specified using the ConfigRate bitstream generator option. The maximum frequency supported by the FPGA configuration logic depends on the timing for the SPI Flash device. Without examining the timing for a specific SPI Flash PROM, use
SPI Flash PROM Density Requirements
Table 56 shows the smallest usable SPI Flash PROM to program a single Spartan-3E FPGA. Commercially available SPI Flash PROMs range in density from 1 Mbit to 128 Mbits. A multiple-FPGA daisy-chained application requires
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Functional Description FPGA application can store non-volatile application data within the SPI Flash PROM. The FPGA configuration data is stored starting at location 0. Store any additional data beginning in the next available SPI Flash PROM sector or page. Do not mix configuration data and user data in the same sector or page. Similarly, the SPI bus can be expanded to additional SPI peripherals. Because SPI is a common industry-standard interface, various SPI-based peripherals are available, such as analog-to-digital (A/D) converters, digital-to-analog (D/A) converters, CAN controllers, and temperature sensors. However, if sufficient I/O pins are available in the application, Xilinx recommends creating a separate SPI bus to control peripherals. Creating a second port reduces the loading on the CCLK and DIN pins, which are crucial for configuration. The MOSI, DIN, and CCLK pins are common to all SPI peripherals. Connect the select input on each additional SPI peripheral to one of the FPGA user I/O pins. If HSWAP = 0 during configuration, the FPGA holds the select line High. If HSWAP = 1, connect the select line to +3.3V via an external 4.7 k pull-up resistor to avoid spurious read or write operations. After configuration, drive the select line Low to select the desired SPI peripheral. During the configuration process, CCLK is controlled by the FPGA and limited to the frequencies generated by the FPGA. After configuration, the FPGA application can use other clock signals to drive the CCLK pin and can further optimize SPI-based communication. Refer to the individual SPI peripheral data sheet for specific interface and communication protocol requirements.
ConfigRate = 12 or lower. SPI Flash PROMs that support the FAST READ command support higher data rates. Some such PROMs support up to ConfigRate = 25 and beyond but require careful data sheet analysis. See Serial Peripheral Interface (SPI) Configuration Timing for more detailed timing analysis.
Using the SPI Flash Interface after Configuration
After the FPGA successfully completes configuration, all of the pins connected to the SPI Flash PROM are available as user-I/O pins. If not using the SPI Flash PROM after configuration, drive CSO_B High to disable the PROM. The MOSI, DIN, and CCLK pins are then available to the FPGA application. Because all the interface pins are user I/O after configuration, the FPGA application can continue to use the SPI Flash interface pins to communicate with the SPI Flash PROM, as shown in Figure 56. SPI Flash PROMs offer random-accessible, byte-addressable, read/write, non-volatile storage to the FPGA application. SPI Flash PROMs are available in densities ranging from 1 Mbit up to 128 Mbits. However, a single Spartan-3E FPGA requires less than 6 Mbits. If desired, use a larger SPI Flash PROM to contain additional non-volatile application data, such as MicroBlaze processor code, or other user data such as serial numbers and Ethernet MAC IDs. In the example shown in Figure 56, the FPGA configures from SPI Flash PROM. Then using FPGA logic after configuration, the FPGA copies MicroBlaze code from SPI Flash into external DDR SDRAM for code execution. Similarly, the
Spartan-3E FPGA SPI Serial Flash PROM
FFFFF
DDR SDRAM
FPGA-based SPI Master
MOSI DIN CCLK CSO_B User I/O +3.3V 4.7k
DATA_IN DATA_OUT CLOCK SELECT
User Data MicroBlaze Code FPGA Configuration
0
SPI Peripherals
DATA_IN DATA_OUT CLOCK SELECT - A/D Converter - D/A Converter - CAN Controller - Displays - Temperature Sensor - ASSP
To other SPI slave peripherals
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Figure 56: Using the SPI Flash Interface After Configuration
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Daisy-Chaining
DESIGN NOTE:
!
SPI mode daisy chains are supported only in Stepping 1 and later silicon versions.
If the application requires multiple FPGAs with different configurations, then configure the FPGAs using a daisy chain, as shown in Figure 57. Daisy-chaining from a single SPI
SPI-based daisy-chaining is
+1.2V
serial Flash PROM is supported in Stepping 1 and later devices. It is not supported in Stepping 0 devices. Use SPI Flash mode (M[2:0] = <0:0:1>) for the FPGA connected to the Platform Flash PROM and Slave Serial mode (M[2:0] = <1:1:1>) for all other FPGAs in the daisy-chain. After the master FPGA--the FPGA on the left in the diagram--finishes loading its configuration data from the SPI Flash PROM, the master device uses its DOUT output pin to supply data to the next device in the daisy-chain, on the falling CCLK edge.
! only supported in Stepping 1.
+3.3V +1.2V
CCLK
4.7k
P
VCCINT HSWAP VCCO_0 VCCO_2 MOSI DIN CSO_B
VCCO_0 +3.3V
P
SPI Serial Flash
VCC DATA_IN DATA_OUT SELECT WR_PROTECT HOLD CLOCK GND
I
P
Slave Serial Mode `1' `1' `1'
HSWAP
VCCINT VCCO_0 VCCO_2
VCCO_0 +3.3V
SPI Mode `0' `0' `1' Variant Select `1' M2 M1 M0
W
`1'
M2 M1 M0
S
`1'
VS2 VS1 VS0
Spartan-3E FPGA
CCLK DOUT INIT_B VCCAUX TDO +2.5V
Spartan-3E FPGA
CCLK DIN
+2.5V JTAG
TDI TMS TCK TDO TDI TMS TCK PROG_B GND
DOUT INIT_B VCCAUX TDO +2.5V
DOUT
+2.5V DONE
+3.3V
TDI TMS TCK PROG_B
DONE GND
4.7k
4.7k
330
PROG_B Recommend open-drain driver
PROG_B TCK TMS DONE INIT_B
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Figure 57: Daisy-Chaining from SPI Flash Mode (Stepping 1 and Later)
Programming Support
For successful daisy-chaining, the DONE_cycle configuration option must be set to cycle 5 or sooner. The default cycle is 4. See Table 68 and the Start-Up section for additional information.
I In production applications, the SPI Flash PROM is usually pre-programmed before it is mounted on the printed circuit board. The Xilinx ISE development software produces industry-standard programming files that can be used with third-party gang programmers. Consult your specific SPI Flash vendor for recommended production programming solutions.
drive the FPGA's PROG_B input Low with an open-drain driver. This action places all FPGA I/O pins, including those attached to the SPI Flash, in high-impedance (Hi-Z). If the HSWAP input is Low, the I/Os have pull-up resistors to the VCCO input on their respective I/O bank. The external programming hardware then has direct access to the SPI Flash pins. The programming access points are highlighted in the gray box in Figure 53, Figure 54, and Figure 57. Beginning with the Xilinx ISE 8.2i software release, the iMPACT programming utility provides direct, in-system prototype programming support for STMicro M25P-series SPI serial Flash PROMs and the Atmel AT45DB-series Data Flash PROMs using the Platform Cable USB, Xilinx Parallel IV, or other compatible programming cable.
In-system programming support is available from some third-party PROM programmers using a socket adapter with attached wires. To gain access to the SPI Flash signals,
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Functional Description unused. For configuration, the BPI interface does not require any specific Flash PROM features, such as boot block or a specific sector size. The BPI interface also functions with Xilinx parallel Platform Flash PROMs (XCFxxP), although the FPGA's address lines are left unconnected. The BPI interface also works equally wells with other asynchronous memories that use a similar SRAM-style interface such as SRAM, NVRAM, EEPROM, EPROM, or masked ROM. NAND Flash memory is commonly used in memory cards for digital cameras. Spartan-3E FPGAs do not configure directly from NAND Flash memories. The FPGA's internal oscillator controls the interface timing and the FPGA supplies the clock on the CCLK output pin. However, the CCLK signal is not used in single FPGA applications. Similarly, the FPGA drives three pins Low during configuration (LDC[2:0]) and one pin High during configuration (HDC) to the PROM's control inputs.
Byte-Wide Peripheral Interface (BPI) Parallel Flash Mode
In Byte-wide Peripheral Interface (BPI) mode (M[2:0] = <0:1:0> or <0:1:1>), a Spartan-3E FPGA configures itself from an industry-standard parallel NOR Flash PROM, as illustrated in Figure 58. The FPGA generates up to a 24-bit address lines to access an attached parallel Flash. Only 20 address lines are generated for Spartan-3E FPGAs in the TQ144 package. Similarly, the XC3S100E FPGA in the CP132 package only has 20 address lines while the XC3S250E and XC3S500E FPGAs in the same package have 24 address lines. When using the VQ100 package, the BPI mode is not available when using parallel NOR Flash, but is supported using parallel Platform Flash (XCFxxP). The BPI configuration interface is primarily designed for standard parallel NOR Flash PROMs and supports both byte-wide (x8) and byte-wide/halfword (x8/x16) PROMs. The interface functions with halfword-only (x16) PROMs, but the upper byte in a portion of the PROM remains
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+1.2V
V
VCCINT
P
HSWAP
VCCO_0 VCCO_1 LDC0 LDC1 HDC LDC2 A[16:0]
VCCO_0
I V
CE# OE# WE#
VCCO
x8 or x8/x16 Flash PROM D
Not available in VQ100 package
BYTE# DQ[15:7]
BPI Mode `0' `1'
M2 M1 M0
VCCO_2 D[7:0] A[23:17]
V
DQ[7:0] A[n:0] GND
A
V
CCLK 4.7k
Spartan-3E BUSY FPGA
`0' `0'
+2.5V JTAG TDI TMS TCK TDO PROG_B GND DONE TDI TMS TCK CSI_B RDWR_B CSO_B INIT_B VCCAUX TDO
+2.5V
+2.5V
PROG_B
Recommend open-drain driver
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Figure 58: Byte-wide Peripheral Interface (BPI) Mode Configured from Parallel NOR Flash PROMs
A During configuration, the value of the M0 mode pin determines how the FPGA generates addresses, as shown Table 57. When M0 = 0, the FPGA generates addresses starting at 0 and increments the address on every falling CCLK edge. Conversely, when M0 = 1, the FPGA generates addresses starting at 0xFF_FFFF (all ones) and decrements the address on every falling CCLK edge.
Table 57: BPI Addressing Control M2 0 M1 1 1 0xFF_FFFF Decrementing M0 0 Start Address 0 Addressing Incrementing
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Functional Description High, the HSWAP pin is available as full-featured user-I/O pin and is powered by the VCCO_0 supply. The RDWR_B and CSI_B must be Low throughout the configuration process. After configuration, these pins also become user I/O. In a single-FPGA application, the FPGA's CSO_B and CCLK pins are not used but are actively driving during the configuration process. The BUSY pin is not used but also actively drives during configuration and is available as a user I/O after configuration. After configuration, all of the interface pins except DONE and PROG_B are available as user I/Os. Furthermore, the bidirectional SelectMAP configuration peripheral interface (see Slave Parallel Mode) is available after configuration. To continue using SelectMAP mode, set the Persist bitstream generator option to Yes. An external host can then read and verify configuration data.
This addressing flexibility allows the FPGA to share the parallel Flash PROM with an external or embedded processor. Depending on the specific processor architecture, the processor boots either from the top or bottom of memory. The FPGA is flexible and boots from the opposite end of memory from the processor. Only the processor or the FPGA can boot at any given time. The FPGA can configure first, holding the processor in reset or the processor can boot first, asserting the FPGA's PROG_B pin. The mode select pins, M[2:0], are sampled when the FPGA's INIT_B output goes High and must be at defined logic levels during this time. After configuration, when the FPGA's DONE output goes High, the mode pins are available as full-featured user-I/O pins.
P Similarly, the FPGA's HSWAP pin must be Low to enable pull-up resistors on all user-I/O pins or High to disable the pull-up resistors. The HSWAP control must remain at a constant logic level throughout FPGA configuration. After configuration, when the FPGA's DONE output goes
Table 58: Byte-Wide Peripheral Interface (BPI) Connections
Pin Name HSWAP FPGA Direction Input Description User I/O Pull-Up Control. When Low during configuration, enables pull-up resistors in all I/O pins to respective I/O bank VCCO input. 0: Pull-ups during configuration 1: No pull-ups M[2:0] Input Mode Select. Selects the FPGA configuration mode. See Design Considerations for the HSWAP, M[2:0], and VS[2:0] Pins. M2 = 0, M1 = 1. Set M0 = 0 to start at address 0, increment addresses. Set M0 = 1 to start at address 0xFFFFFF and decrement addresses. Sampled when INIT_B goes High. Must be Low throughout configuration. User I/O During Configuration Drive at valid logic level throughout configuration. After Configuration User I/O
P
A
CSI_B
Input
Chip Select Input. Active Low.
User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface. User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface. User I/O. If the FPGA does not access the PROM after configuration, drive this pin High to deselect the PROM. A[23:0], D[7:0], LDC[2:1], and HDC then become available as user I/O. User I/O
RDWR_B
Input
Read/Write Control. Active Low write enable. Read functionality typically only used after configuration, if bitstream option Persist=Yes. PROM Chip Enable
Must be Low throughout configuration.
LDC0
Output
Connect to PROM chip-select input (CE#). FPGA drives this signal Low throughout configuration.
LDC1
Output
PROM Output Enable
Connect to the PROM output-enable input (OE#). The FPGA drives this signal Low throughout configuration.
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Functional Description Table 58: Byte-Wide Peripheral Interface (BPI) Connections (Continued)
Pin Name HDC FPGA Direction Output Description PROM Write Enable During Configuration Connect to PROM write-enable input (WE#). FPGA drives this signal High throughout configuration. This signal is not used for x8 PROMs. For PROMs with a x8/x16 data width control, connect to PROM byte-mode input (BYTE#). See Precautions Using x8/x16 Flash PROMs. FPGA drives this signal Low throughout configuration. Connect to PROM address inputs. High-order address lines may not be available in all packages and not all may be required. Number of address lines required depends on the size of the attached Flash PROM. FPGA address generation controlled by M0 mode pin. Addresses presented on falling CCLK edge. Only 20 address lines are available in TQ144 package. D[7:0] Input Data Input FPGA receives byte-wide data on these pins in response the address presented on A[23:0]. Data captured by FPGA Not used in single FPGA applications. In a daisy-chain configuration, this pin connects to the CSI_B pin of the next FPGA in the chain. If HSWAP = 1 in a multi-FPGA daisy-chain application, connect this signal to a 4.7 k pull-up resistor to VCCO_2. Actively drives Low when selecting a downstream device in the chain. Not used during configuration but actively drives. User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface. User I/O After Configuration User I/O
R
LDC2 D
Output
PROM Byte Mode
User I/O. Drive this pin High after configuration to use a x8/x16 PROM in x16 mode.
A[23:0]
Output
Address
User I/O
CSO_B
Output
Chip Select Output. Active Low.
BUSY
Output
Busy Indicator. Typically only used after configuration, if bitstream option Persist=Yes.
User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface. User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface.
CCLK
Output
Configuration Clock. Generated by FPGA internal oscillator. Frequency controlled by ConfigRate bitstream generator option. If CCLK PCB trace is long or has multiple connections, terminate this output to maintain signal integrity. See CCLK Design Considerations.
Not used in single FPGA applications but actively drives. In a daisy-chain configuration, drives the CCLK inputs of all other FPGAs in the daisy-chain.
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Functional Description
Table 58: Byte-Wide Peripheral Interface (BPI) Connections (Continued)
Pin Name INIT_B FPGA Direction Open-drain bidirectional I/O Description Initialization Indicator. Active Low. Goes Low at start of configuration during the Initialization memory clearing process. Released at the end of memory clearing, when the mode select pins are sampled. In daisy-chain applications, this signal requires an external 4.7 k pull-up resistor to VCCO_2. FPGA Configuration Done. Low during configuration. Goes High when FPGA successfully completes configuration. Requires external 330 pull-up resistor to 2.5V. Program FPGA. Active Low. When asserted Low for 300 ns or longer, forces the FPGA to restart its configuration process by clearing configuration memory and resetting the DONE and INIT_B pins once PROG_B returns High. Requires external 4.7 k pull-up resistor to 2.5V. If driving externally with a 3.3V output, use an open-drain or open-collector driver or use a current limiting series resistor. During Configuration Active during configuration. If CRC error detected during configuration, FPGA drives INIT_B Low. After Configuration User I/O. If unused in the application, drive INIT_B High.
DONE
Open-drain bidirectional I/O
Low indicates that the FPGA is not yet configured.
Pulled High via external pull-up. When High, indicates that the FPGA is successfully configured.
PROG_B
Input
Must be High to allow configuration to start.
Drive PROG_B Low and release to reprogram FPGA. Hold PROG_B to force FPGA I/O pins into Hi-Z, allowing direct programming access to Flash PROM pins.
Voltage Compatibility
V The FPGA's parallel Flash interface signals are within
cautions if 3.3V Supply is Last in Sequence for a similar description of the issue for SPI Flash PROMs.
I/O Banks 1 and 2. The majority of parallel Flash PROMs use a single 3.3V supply voltage. Consequently, in most cases, the FPGA's VCCO_1 and VCCO_2 supply voltages must also be 3.3V to match the parallel Flash PROM. There are some 1.8V parallel Flash PROMs available and the FPGA interfaces with these devices if the VCCO_1 and VCCO_2 supplies are also 1.8V.
Supported Parallel NOR Flash PROM Densities
Table 59 indicates the smallest usable parallel Flash PROM to program a single Spartan-3E FPGA. Parallel Flash density is specified in bits but addressed as bytes. The FPGA presents up to 24 address lines during configuration but not all are required for single FPGA applications. Table 59 shows the minimum required number of address lines between the FPGA and parallel Flash PROM. The actual number of address line required depends on the density of the attached parallel Flash PROM. A multiple-FPGA daisy-chained application requires a parallel Flash PROM large enough to contain the sum of the FPGA file sizes. An application can also use a larger-density parallel Flash PROM to hold additional data beyond just FPGA configuration data. For example, the parallel Flash PROM can also contain the application code for a MicroBlaze RISC processor core implemented within the Spartan-3E FPGA. After configuration, the MicroBlaze processor can execute directly from external Flash or can copy the code to other, faster system memory before executing the code.
Power-On Precautions if PROM Supply is Last in Sequence
Like SPI Flash PROMs, parallel Flash PROMs typically require some amount of internal initialization time when the supply voltage reaches its minimum value. The PROM supply voltage also connects to the FPGA's VCCO_2 supply input. In many systems, the PROM supply feeding the FPGA's VCCO_2 input is valid before the FPGA's other VCCINT and VCCAUX supplies, and consequently, there is no issue. However, if the PROM supply is last in the sequence, a potential race occurs between the FPGA and the parallel Flash PROM. See Power-On Pre-
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Table 59: Number of Bits to Program a Spartan-3E FPGA and Smallest Parallel Flash PROM Spartan-3E FPGA XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Uncompressed File Sizes (bits) 581,344 1,353,728 2,270,208 3,841,184 5,969,696 Smallest Usable Parallel Flash PROM 1 Mbit 2 Mbit 4 Mbit 4 Mbit 8 Mbit Minimum Required Address Lines A[16:0] A[17:0] A[18:0] A[18:0] A[19:0]
Compatible Flash Families
The Spartan-3E BPI configuration interface operates with a wide variety of x8 or x8/x16 parallel NOR Flash devices. Table 60 provides a few Flash memory families that operate with the Spartan-3E BPI interface. Consult the data sheet for the desired parallel NOR Flash to determine its suitability The basic timing requirements and waveforms are provided in Byte Peripheral Interface (BPI) Configuration Timing (Module 3). Table 60: Compatible Parallel NOR Flash Families Flash Vendor ST Microelectronics Atmel Spansion (AMD, Fujitsu) Intel Macronix Flash Memory Family M29W AT29 / AT49 Am29 / S29 J3D StrataFlash MX29
ature operating range. See Byte Peripheral Interface (BPI) Configuration Timing (Module 3) for more detailed information. Despite using slower ConfigRate settings, BPI mode is equally fast as the other configuration modes. In BPI mode, data is accessed at the ConfigRate frequency and internally serialized with an 8X clock frequency.
Using the BPI Interface after Configuration
After the FPGA successfully completes configuration, all pins connected to the parallel Flash PROM are available as user I/Os. If not using the parallel Flash PROM after configuration, drive LDC0 High to disable the PROM's chip-select input. The remainder of the BPI pins then become available to the FPGA application, including all 24 address lines, the eight data lines, and the LDC2, LDC1, and HDC control pins. Because all the interface pins are user I/Os after configuration, the FPGA application can continue to use the interface pins to communicate with the parallel Flash PROM. Parallel Flash PROMs are available in densities ranging from 1 Mbit up to 128 Mbits and beyond. However, a single Spartan-3E FPGA requires less than 6 Mbits for configuration. If desired, use a larger parallel Flash PROM to contain additional non-volatile application data, such as MicroBlaze processor code, or other user data, such as serial numbers and Ethernet MAC IDs. In such an example, the FPGA configures from parallel Flash PROM. Then using FPGA logic after configuration, a MicroBlaze processor embedded within the FPGA can either execute code directly from parallel Flash PROM or copy the code to external DDR SDRAM and execute from DDR SDRAM. Similarly, the FPGA application can store non-volatile application data within the parallel Flash PROM. The FPGA configuration data is stored starting at either at location 0 or the top of memory (addresses all ones) or at both locations for MultiBoot mode. Store any additional data beginning in other available parallel Flash PROM sectors. Do not mix configuration data and user data in the same sector. Similarly, the parallel Flash PROM interface can be expanded to additional parallel peripherals.
CCLK Frequency
In BPI mode, the FPGA's internal oscillator generates the configuration clock frequency that controls all the interface timing. The FPGA starts configuration at its lowest frequency and increases its frequency for the remainder of the configuration process if so specified in the configuration bitstream. The maximum frequency is specified using the ConfigRate bitstream generator option. Table 61: Maximum ConfigRate Settings for Parallel Flash PROMs (Commercial Temperature Range) Flash Read Access Time < 250 ns < 115 ns < 45 ns Maximum ConfigRate Setting 3 6 12
Table 61 shows the maximum ConfigRate settings for various PROM read access times over the Commercial temper90
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Functional Description FPGA supports either x8 or x16 modes. In x16 mode, up to eight additional user I/O pins are required for the upper data bits, D[15:8]. Connecting a Spartan-3E FPGA to a x8/x16 Flash PROM is simple, but does require a precaution. Various Flash PROM vendors use slightly different interfaces to support both x8 and x16 modes. Some vendors (Intel, Micron, some STMicroelectronics devices) use a straightforward interface with pin naming that matches the FPGA connections. However, the PROM's A0 pin is wasted in x16 applications and a separate FPGA user-I/O pin is required for the D15 data line. Fortunately, the FPGA A0 pin is still available as a user I/O after configuration, even though it connects to the Flash PROM. Other vendors (AMD, Atmel, Silicon Storage Technology, some STMicroelectronics devices) use a pin-efficient interface but change the function of one pin, called IO15/A-1, depending if the PROM is in x8 or x16 mode. In x8 mode, BYTE# = 0, this pin is the least-significant address line. The A0 address line selects the halfword location. The A-1 address line selects the byte location. When in x16 mode, BYTE# = 1, the IO15/A-1 pin becomes the most-significant data bit, D15 because byte addressing is not required in this mode. Check to see if the Flash PROM has a pin named "IO15/A-1" or "DQ15/A-1". If so, be careful to connect x8/x16 Flash PROMs correctly, as shown in Table 62. Also, remember that the D[14:8] data connections require FPGA user I/O pins but that the D15 data is already connected for the FPGA's A0 pin.
The address, data, and LDC1 (OE#) and HDC (WE#) control signals are common to all parallel peripherals. Connect the chip-select input on each additional peripheral to one of the FPGA user I/O pins. If HSWAP = 0 during configuration, the FPGA holds the chip-select line High via an internal pull-up resistor. If HSWAP = 1, connect the select line to +3.3V via an external 4.7 k pull-up resistor to avoid spurious read or write operations. After configuration, drive the select line Low to select the desired peripheral. Refer to the individual peripheral data sheet for specific interface and communication protocol requirements. The FPGA optionally supports a 16-bit peripheral interface by driving the LDC2 (BYTE#) control pin High after configuration. See Precautions Using x8/x16 Flash PROMs for additional information. The FPGA provides up to 24 address lines during configuration, addressing up to 128 Mbits (16 Mbytes). If using a larger parallel PROM, connect the upper address lines to FPGA user I/O. During configuration, the upper address lines will be pulled High if HSWAP = 0. Otherwise, use external pull-up or pull-down resistors on these address lines to define their values during configuration.
Precautions Using x8/x16 Flash PROMs
D Most low- to mid-density PROMs are byte-wide (x8)
only. Many higher-density Flash PROMs support both byte-wide (x8) and halfword-wide (x16) data paths and include a mode input called BYTE# that switches between x8 or x16. During configuration, Spartan-3E FPGAs only support byte-wide data. However, after configuration, the
Table 62: FPGA Connections to Flash PROM with IO15/A-1 Pin FPGA Pin LDC2 Connection to Flash PROM with IO15/A-1 Pin BYTE# x8 Flash PROM Interface After FPGA Configuration Drive LDC2 Low or leave unconnected and tie PROM BYTE# input to GND Active-Low Flash PROM output-enable control Active-Low Flash PROM chip-select control Flash PROM write-enable control A[n:0] IO15/A-1 is the least-significant address input IO[7:0] Upper data lines IO[14:8] not required x16 Flash PROM Interface After FPGA Configuration Drive LCD2 High
LDC1 LDC0 HDC A[23:1] A0 D[7:0] User I/O
OE# CS# WE# A[n:0] IO15/A-1 IO[7:0] Upper data lines IO[14:8] not required unless used as x16 Flash interface after configuration
Active-Low Flash PROM output-enable control Active-Low Flash PROM chip-select control Flash PROM write-enable control A[n:0] IO15/A-1 is the most-significant data line, IO15 IO[7:0] IO[14:8]
DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description Some x8/x16 Flash PROMs have a long setup time requirement on the BYTE# signal. For the FPGA to configure correctly, the PROM must be in x8 mode with BYTE# = 0 at power-on or when the FPGA's PROG_B pin is pulsed Low. If required, extend the BYTE# setup time for a 3.3V PROM using an external 680 pull-down resistor on the FPGA's LDC2 pin or by delaying assertion of the CSI_B select input to the FPGA.
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device (Bank 1 and Bank 2, respectively). These pins are not easily reclaimable for clock inputs after configuration, especially if the FPGA application access the parallel NOR Flash after configuration. Table 63 summarizes the shared pins. Table 63: Shared BPI Configuration Mode and Global Buffer Input Pins Device Edge Global Buffer Input Pin GCLK0 GCLK2 GCLK3 Bottom GCLK12 GCLK13 GCLK14 GCLK15 RHCLK0 BPI Mode Configuration Pin RDWR_B D2 D1 D7 D6 D4 D3 A10 A9 A8 A7 A6 A5 A4 A3
Daisy-Chaining
DESIGN NOTE:
!
BPI mode daisy chain software support is available starting in ISE 8.2i. Answer Record #23061 www.xilinx.com/xlnx/xil_ans_display.jsp?getPagePath =23061 Also, in a multi-FPGA daisy-chain configuration of more than two devices, all intermediate FPGAs between the first and last devices must be Spartan-3E or Virtex-5 FPGAs. The last FPGA in the chain can be from any Xilinx FPGA family.
If the application requires multiple FPGAs with different configurations, then configure the FPGAs using a daisy chain, as shown in Figure 59. Use BPI mode (M[2:0] = <0:1:0> or <0:1:1>) for the FPGA connected to the parallel NOR Flash PROM and Slave Parallel mode (M[2:0] = <1:1:0>) for all downstream FPGAs in the daisy-chain. If there are more than two FPGAs in the chain, then last FPGA in the chain can be from any Xilinx FPGA family. However, all intermediate FPGAs located in the chain between the first and last FPGAs must from either the Spartan-3E or VirtexTM-5 FPGA families. After the master FPGA--the FPGA on the left in the diagram--finishes loading its configuration data from the parallel Flash PROM, the master device continues generating addresses to the Flash PROM and asserts its CSO_B output Low, enabling the next FPGA in the daisy-chain. The next FPGA then receives parallel configuration data from the Flash PROM. The master FPGA's CCLK output synchronizes data capture. If HSWAP = 1, an external 4.7k pull-up resistor must be added on the CSO_B pin. If HSWAP = 0, no external pull-up is necessary.
RHCLK1 RHCLK2 RHCLK3 Right RHCLK4 RHCLK5 RHCLK6 RHCLK7
Stepping 0 Limitations when Reprogramming via JTAG if FPGA Set for BPI Configuration
The FPGA can always be reprogrammed via the JTAG port, regardless of the mode pin (M[2:0]) settings. However, Stepping 0 devices have a minor limitation. If a Stepping 0 FPGA is set to configure in BPI mode and the FPGA is attached to a parallel memory containing a valid FPGA configuration file, then subsequent reconfigurations using the JTAG port will fail. Potential workarounds include setting the mode pins for JTAG configuration (M[2:0] = <1:0:1>) or offsetting the initial memory location in Flash by 0x2000. Stepping 1 and later devices fully support JTAG configuration even when the FPGA mode pins are set for BPI mode.
BPI Mode Interaction with Right and Bottom Edge Global Clock Inputs
Some of the BPI mode configuration pins are shared with global clock inputs along the right and bottom edges of the
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
CCLK D[7:0] +1.2V +1.2V
V
4.7k
P
HSWAP
VCCINT VCCO_0 VCCO_1 LDC0 LDC1 HDC LDC2 A[16:0] VCCO_2 D[7:0] A[23:17]
VCCO_0
V
I
P
HSWAP
VCCINT VCCO_0 VCCO_1
VCCO_0 VCCO_1
VCC CE# x8 or OE# x8/x16 Flash WE# PROM BYTE#
Not available in VQ100 package BPI Mode `0' `1' M2 M1 M0
D
DQ[15:7] Slave Parallel Mode `1' `1' `0' M2 M1 M0
V
DQ[7:0] A[n:0] GND
VCCO_2 D[7:0]
V
A
Spartan-3E BUSY FPGA CCLK
`0' `0' CSI_B RDWR_B TDI TMS TCK PROG_B GND CSO_B INIT_B VCCAUX TDO +2.5V `0'
2.5V JTAG TDI TMS TCK TDO
CCLK CSI_B RDWR_B TDI TMS TCK PROG_B
Spartan-3E BUSY FPGA
CSO_B INIT_B VCCAUX TDO +2.5V CSO_B
+2.5V DONE
V
DONE GND
PROG_B Recommend open-drain driver
4.7k
4.7k
330
PROG_B TCK TMS DONE INIT_B
DS312-2_50_103105
Figure 59: Daisy-Chaining from BPI Flash Mode
In-System Programming Support
I In a production application, the parallel Flash PROM is usually preprogrammed before it is mounted on the printed circuit board. In-system programming support is available from third-party boundary-scan tool vendors and from some third-party PROM programmers using a socket adapter with attached wires. To gain access to the parallel Flash signals, drive the FPGA's PROG_B input Low with an open-drain driver. This action places all FPGA I/O pins, including those attached to the parallel Flash, in high-impedance (Hi-Z). If the HSWAP input is Low, the I/Os have pull-up resistors to the VCCO input on their respective I/O bank. The external programming hardware then has direct access to the parallel Flash pins. The programming access points are highlighted in the gray boxes in Figure 58 and Figure 59.
Dynamically Loading Multiple Configuration Images Using MultiBoot Option
After the FPGA configures itself using BPI mode from one end of the parallel Flash PROM, then the FPGA can trigger a MultiBoot event and reconfigure itself from the opposite end of the parallel Flash PROM. MultiBoot is only available when using BPI mode and only for applications with a single Spartan-3E FPGA. By default, MultiBoot mode is disabled. To trigger a MultiBoot event, assert a Low pulse lasting at least 300 ns on the MultiBoot Trigger (MBT) input to the STARTUP_SPARTAN3E library primitive. When the MBT signal returns High after the 300 ns or longer pulse, the FPGA automatically reconfigures from the opposite end of the parallel Flash memory. Figure 60 shows an example usage. At power up, the FPGA loads itself from the attached parallel Flash PROM. In this example, the M0 mode pin is Low so the FPGA starts at address 0 and increments through the Flash PROM memory locations. After the FPGA completes configuration, the application initially loaded into the FPGA performs a board-level or system test using FPGA logic. If the test is
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The FPGA itself can also be used as a parallel Flash PROM programmer during development and test phases. Initially, an FPGA-based programmer is downloaded into the FPGA via JTAG. Then the FPGA performs the Flash PROM programming algorithms and receives programming data from the host via the FPGA's JTAG interface. See Chapter 11 in Embedded System Tools Reference Manual.
DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description successful, the FPGA then triggers a MultiBoot event, causing the FPGA to reconfigure from the opposite end of the Flash PROM memory. This second configuration contains the FPGA application for normal operation.
Parallel Flash PROM FFFFFF General FPGA Application General FPGA Application
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Similarly, the general FPGA application could trigger another MultiBoot event at any time to reload the diagnostics design, and so on.
Parallel Flash PROM
FFFFFF
STARTUP_SPARTAN3E GSR
User Area
> 300 ns
GTS MBT CLK Reconfigure 0
User Area
Di agnostics FPGA Application
Di agnostics FPGA Application 0
First Configuration
Second Configuration
DS312-2_51_103105
Figure 60: Use MultiBoot to Load Alternate Configuration Images In another potential application, the initial design loaded into the FPGA image contains a "golden" or "fail-safe" configuration image, which then communicates with the outside world and checks for a newer image. If there is a new configuration revision and the new image verifies as good, the "golden" configuration triggers a MultiBoot event to load the new image. When a MultiBoot event is triggered, the FPGA then again drives its configuration pins as described in Table 58. However, the FPGA does not assert the PROG_B pin. The system design must ensure that no other device drives on these same pins during the reconfiguration process. The FPGA's DONE, LDC[2:0], or HDC pins can temporarily disable any conflicting drivers during reconfiguration. Asserting the PROG_B pin Low overrides the MultiBoot feature and forces the FPGA to reconfigure starting from the end of memory defined by the mode pins, shown in Table 57.
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
+1.2V
P
Slave Parallel Mode
HSWAP
VCCINT VCCO_0
VCCO_0
VCCO_2 M2 M1 M0 D[7:0] FPGA BUSY CSI_B CSO_B INIT_B RDWR_B CCLK VCCAUX TDO
V
V Intelligent Download Host
VCC D[7:0] BUSY SELECT READ/WRITE CLOCK PROG_B DONE INIT_B GND
`1' `1' `0'
V 4.7k
+2.5V +2.5V DONE
4.7k 330
DS312-2_52_103105
Spartan-3E
Configuration Memory Source - Internal memory - Disk drive - Over network - Over RF link
TDI TMS TCK PROG_B GND
- Microcontroller - Processor - Tester - Computer
PROG_B
Recommend open-drain driver
+2.5V JTAG
TDI
TMS TCK TDO
Figure 61: Slave Parallel Configuration Mode
Slave Parallel Mode
In Slave Parallel mode (M[2:0] = <1:1:0>), an external host, such as a microprocessor or microcontroller, writes byte-wide configuration data into the FPGA, using a typical peripheral interface as shown in Figure 61. The external download host starts the configuration process by pulsing PROG_B and monitoring that the INIT_B pin goes High, indicating that the FPGA is ready to receive its first data. The host asserts the active-Low chip-select signal (CSI_B) and the active-Low Write signal (RDWR_B). The host then continues supplying data and clock signals until either the FPGA's DONE pin goes High, indicating a successful configuration, or until the FPGA's INIT_B pin goes Low, indicating a configuration error. The FPGA captures data on the rising CCLK edge. If the CCLK frequency exceeds 50 MHz, then the host must also monitor the FPGA's BUSY output. If the FPGA asserts
DS312-2 (v3.4) November 9, 2006 Product Specification
BUSY High, the host must hold the data for an additional clock cycle, until BUSY returns Low. If the CCLK frequency is 50 MHz or below, the BUSY pin may be ignored but actively drives during configuration. The configuration process requires more clock cycles than indicated from the configuration file size. Additional clocks are required during the FPGA's start-up sequence, especially if the FPGA is programmed to wait for selected Digital Clock Managers (DCMs) to lock to their respective clock inputs (see Start-Up, page 107). If the Slave Parallel interface is only used to configure the FPGA, never to read data back, then the RDWR_B signal can also be eliminated from the interface. However, RDWR_B must remain Low during configuration. After configuration, all of the interface pins except DONE and PROG_B are available as user I/Os. Alternatively, the bidirectional SelectMAP configuration interface is available
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Functional Description after configuration. To continue using SelectMAP mode, set the Persist bitstream generator option to Yes. The external host can then read and verify configuration data. The Slave Parallel mode is also used with BPI mode to create multi-FPGA daisy-chains. The lead FPGA is set for BPI Table 64: Slave Parallel Mode Connections
Pin Name HSWAP FPGA Direction Input Description User I/O Pull-Up Control. When Low during configuration, enables pull-up resistors in all I/O pins to respective I/O bank VCCO input. 0: Pull-ups during configuration 1: No pull-ups M[2:0] Input Mode Select. Selects the FPGA configuration mode. See Design Considerations for the HSWAP, M[2:0], and VS[2:0] Pins. Data Input. M2 = 1, M1 = 1, M0 = 0 Sampled when INIT_B goes High. User I/O During Configuration Drive at valid logic level throughout configuration. After Configuration User I/O
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mode configuration; all the downstream daisy-chain FPGAs are set for Slave Parallel configuration, as highlighted in Figure 59.
D[7:0]
Input
Byte-wide data provided by host. FPGA captures data on rising CCLK edge.
User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface. User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface.
BUSY
Output
Busy Indicator.
If CCLK frequency is < 50 MHz, this pin may be ignored. When High, indicates that the FPGA is not ready to receive additional configuration data. Host must hold data an additional clock cycle. Must be Low throughout configuration.
CSI_B
Input
Chip Select Input. Active Low.
User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface. User I/O. If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface. User I/O If bitstream option Persist=Yes, becomes part of SelectMap parallel peripheral interface. User I/O
RDWR_B
Input
Read/Write Control. Active Low write enable.
Must be Low throughout configuration.
CCLK
Input
Configuration Clock. If CCLK PCB trace is long or has multiple connections, terminate this output to maintain signal integrity. See CCLK Design Considerations. Chip Select Output. Active Low.
External clock.
CSO_B
Output
Not used in single FPGA applications. In a daisy-chain configuration, this pin connects to the CSI_B pin of the next FPGA in the chain. Actively drives.
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
Table 64: Slave Parallel Mode Connections (Continued)
Pin Name INIT_B FPGA Direction Open-drain bidirectional I/O Description Initialization Indicator. Active Low. Goes Low at the start of configuration during the Initialization memory clearing process. Released at the end of memory clearing, when mode select pins are sampled. In daisy-chain applications, this signal requires an external 4.7 k pull-up resistor to VCCO_2. FPGA Configuration Done. Low during configuration. Goes High when FPGA successfully completes configuration. Requires external 330 pull-up resistor to 2.5V. Program FPGA. Active Low. When asserted Low for 300 ns or longer, forces the FPGA to restart its configuration process by clearing configuration memory and resetting the DONE and INIT_B pins once PROG_B returns High. Requires external 4.7 k pull-up resistor to 2.5V. If driving externally with a 3.3V output, use an open-drain or open-collector driver or use a current limiting series resistor. During Configuration Active during configuration. If CRC error detected during configuration, FPGA drives INIT_B Low. After Configuration User I/O. If unused in the application, drive INIT_B High.
DONE
Open-drain bidirectional I/O
Low indicates that the FPGA is not yet configured.
Pulled High via external pull-up. When High, indicates that the FPGA successfully configured. Drive PROG_B Low and release to reprogram FPGA.
PROG_B
Input
Must be High to allow configuration to start.
Voltage Compatibility
Most Slave Parallel interface signals are within the FPGA's I/O Bank 2, supplied by the VCCO_2 supply input. The VCCO_2 voltage can be 1.8V, 2.5V, or 3.3V to match the requirements of the external host, ideally 2.5V. Using 1.8V or 3.3V requires additional design considerations as the DONE and PROG_B pins are powered by the FPGA's 2.5V VCCAUX supply. See XAPP453: The 3.3V Configuration of Spartan-3 FPGAs for additional information. The LDC[2:0] and HDC signal are active in I/O Bank 1 but are not used in the interface. Consequently, VCCO_1 can be set the appropriate voltage for the application.
V
Daisy-Chaining
If the application requires multiple FPGAs with different configurations, then configure the FPGAs using a daisy chain. Use Slave Parallel mode (M[2:0] = <1:1:0>) for all FPGAs in the daisy-chain. The schematic in Figure 62 is optimized for FPGA downloading and does not support the SelectMAP read interface. The FPGA's RDWR_B pin must be Low during configuration. After the lead FPGA is filled with its configuration data, the lead FPGA enables the next FPGA in the daisy-chain by asserting is chip-select output, CSO_B.
DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
R
D[7:0] CCLK +1.2V +1.2V
P
HSWAP
VCCINT VCCO_0 VCCO_1 LDC0 LDC1 HDC LDC2 VCCO_2
VCCO_0 VCCO_1
P
HSWAP
VCCINT VCCO_0 VCCO_1 LDC0 LDC1 HDC LDC2 VCCO_2
VCCO_0 VCCO_1
Slave Parallel Mode
V Intelligent Download Host
Configuration Memory Source VCC DATA[7:0] BUSY SELECT READ/WRITE CLOCK PROG_B DONE INIT_B GND
V V
4.7k
Slave Parallel Mode `1' `1' `0' M2 M1 M0
V
`1' `1' `0'
M2 M1 M0
* Internal memory * Disk drive * Over network * Over RF link
`0'
BUSY CSI_B RDWR_B CCLK
Spartan-3E D[7:0] FPGA
CSO_B INIT_B
`0'
D[7:0] FPGA BUSY CSI_B CSO_B RDWR_B INIT_B CCLK VCCAUX TDO +2.5V
Spartan-3E
CSO_B
TDI TMS TCK PROG_B GND
VCCAUX TDO
+2.5V TDI TMS TCK PROG_B
+2.5V DONE
4.7k
330
*Microcontroller *Processor *Tester
PROG_B Recommend 2.5V open-drain driver JTAG TDI TMS TCK TDO
DONE GND
PROG_B DONE INIT_B TMS TCK
DS312-2_53_022305
Figure 62: Daisy-Chaining using Slave Parallel Mode
Slave Serial Mode
In Slave Serial mode (M[2:0] = <1:1:1>), an external host such as a microprocessor or microcontroller writes serial configuration data into the FPGA, using the synchronous serial interface shown in Figure 63. The serial configuration data is presented on the FPGA's DIN input pin with sufficient setup time before each rising edge of the externally generated CCLK clock input. The intelligent host starts the configuration process by pulsing PROG_B and monitoring that the INIT_B pin goes High,
indicating that the FPGA is ready to receive its first data. The host then continues supplying data and clock signals until either the DONE pin goes High, indicating a successful configuration, or until the INIT_B pin goes Low, indicating a configuration error. The configuration process requires more clock cycles than indicated from the configuration file size. Additional clocks are required during the FPGA's start-up sequence, especially if the FPGA is programmed to wait for selected Digital Clock Managers (DCMs) to lock to their respective clock inputs (see Start-Up, page 107).
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
+1.2V
P
Slave Serial Mode
HSWAP
VCCINT VCCO_0 VCCO_2
VCCO_0
V V
Configuration Memory Source * Internal memory * Disk drive * Over network * Over RF link
VCC CLOCK SERIAL_OUT PROG_B DONE INIT_B GND * Microcontroller * Processor * Tester * Computer
CCLK DIN
Spartan-3E FPGA
DOUT INIT_B VCCAUX TDO +2.5V
TDI TMS TCK PROG_B GND
4.7k
Intelligent Download Host
V
`1' `1' `1'
M2 M1 M0
+2.5V DONE
PROG_B
Recommend open-drain driver +2.5V JTAG TDI TMS TCK TDO
DS312-2_54_022305
Figure 63: Slave Serial Configuration The mode select pins, M[2:0], are sampled when the FPGA's INIT_B output goes High and must be at defined logic levels during this time. After configuration, when the FPGA's DONE output goes High, the mode pins are available as full-featured user-I/O pins.
P Similarly, the FPGA's HSWAP pin must be Low to enable pull-up resistors on all user-I/O pins or High to disable the pull-up resistors. The HSWAP control must remain at a constant logic level throughout FPGA configuration. After configuration, when the FPGA's DONE output goes High, the HSWAP pin is available as full-featured user-I/O pin and is powered by the VCCO_0 supply.
The VCCO_2 voltage can be 3.3V, 2.5V, or 1.8V to match the requirements of the external host, ideally 2.5V. Using 3.3V or 1.8V requires additional design considerations as the DONE and PROG_B pins are powered by the FPGA's 2.5V VCCAUX supply. See XAPP453: The 3.3V Configuration of Spartan-3 FPGAs for additional information.
Daisy-Chaining
If the application requires multiple FPGAs with different configurations, then configure the FPGAs using a daisy chain, as shown in Figure 64. Use Slave Serial mode (M[2:0] = <1:1:1>) for all FPGAs in the daisy-chain. After the lead FPGA is filled with its configuration data, the lead FPGA passes configuration data via its DOUT output pin to the next FPGA on the falling CCLK edge.
Voltage Compatibility
Most Slave Serial interface signals are within the FPGA's I/O Bank 2, supplied by the VCCO_2 supply input.
V
DS312-2 (v3.4) November 9, 2006 Product Specification
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4.7k
330
99
Functional Description
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Table 65: Slave Serial Mode Connections
Pin Name HSWAP FPGA Direction Input Description User I/O Pull-Up Control. When Low during configuration, enables pull-up resistors in all I/O pins to respective I/O bank VCCO input. 0: Pull-up during configuration 1: No pull-ups M[2:0] Input Mode Select. Selects the FPGA configuration mode. See Design Considerations for the HSWAP, M[2:0], and VS[2:0] Pins. Data Input. M2 = 1, M1 = 1, M0 = 1 Sampled when INIT_B goes High. User I/O During Configuration Drive at valid logic level throughout configuration. After Configuration User I/O
DIN
Input
Serial data provided by host. FPGA captures data on rising CCLK edge. External clock.
User I/O
CCLK
Input
Configuration Clock. If CCLK PCB trace is long or has multiple connections, terminate this output to maintain signal integrity. See CCLK Design Considerations. Initialization Indicator. Active Low. Goes Low at start of configuration during Initialization memory clearing process. Released at end of memory clearing, when mode select pins are sampled. In daisy-chain applications, this signal requires an external 4.7 k pull-up resistor to VCCO_2. FPGA Configuration Done. Low during configuration. Goes High when FPGA successfully completes configuration. Requires external 330 pull-up resistor to 2.5V. Program FPGA. Active Low. When asserted Low for 300 ns or longer, forces the FPGA to restart its configuration process by clearing configuration memory and resetting the DONE and INIT_B pins once PROG_B returns High. Requires external 4.7 k pull-up resistor to 2.5V. If driving externally with a 3.3V output, use an open-drain or open-collector driver or use a current limiting series resistor.
User I/O
INIT_B
Open-drain bidirectional I/O
Active during configuration. If CRC error detected during configuration, FPGA drives INIT_B Low.
User I/O. If unused in the application, drive INIT_B High.
DONE
Open-drain bidirectional I/O
Low indicates that the FPGA is not yet configured.
Pulled High via external pull-up. When High, indicates that the FPGA successfully configured.
PROG_B
Input
Must be High to allow configuration to start.
Drive PROG_B Low and release to reprogram FPGA.
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DS312-2 (v3.4) November 9, 2006 Product Specification
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Functional Description
CCLK +1.2V +1.2V
P
Slave Serial Mode
HSWAP
VCCINT VCCO_0 VCCO_2
VCCO_0
P
Slave Serial Mode `1' `1' `1'
HSWAP
VCCINT VCCO_0 VCCO_2
VCCO_0 VCCO_2
V V
Configuration Memory Source
* Internal memory * Disk drive *Over network *Over RF link
VCC CLOCK SERIAL_OUT PROG_B DONE INIT_B GND
CCLK DIN
Spartan-3E FPGA
DOUT INIT_B VCCAUX TDO +2.5V
4.7k
Intelligent V Download Host
`1' `1' `1'
M2 M1 M0
M2 M1 M0
CCLK DIN
Spartan-3E FPGA
DOUT INIT_B VCCAUX TDO +2.5V DOUT
TDI TMS TCK PROG_B GND
4.7k
330
* Microcontroller *Processor * Tester * Computer
PROG_B Recommend open-drain driver +2.5V JTAG TDI TMS TCK TDO
+2.5V DONE
TDI TMS TCK PROG_B GND
DONE
PROG_B DONE INIT_B
TMS TCK
DS312-2_55_102105
Figure 64: Daisy-Chaining using Slave Serial Mode
JTAG Mode
The Spartan-3E FPGA has a dedicated four-wire IEEE 1149.1/1532 JTAG port that is always available any time the FPGA is powered and regardless of the mode pin settings. However, when the FPGA mode pins are set for JTAG mode (M[2:0] = <1:0:1>), the FPGA waits to be configured via the JTAG port after a power-on event or when PROG_B is asserted. Selecting the JTAG mode simply disables the
other configuration modes. No other pins are required as part of the configuration interface. Figure 65 illustrates a JTAG-only configuration interface. The JTAG interface is easily cascaded to any number of FPGAs by connecting the TDO output of one device to the TDI input of the next device in the chain. The TDO output of the last device in the chain loops back to the port connector.
DS312-2 (v3.4) November 9, 2006 Product Specification
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101
Functional Description
R
+1.2V
+1.2V
P
JTAG Mode `1' `0' `1'
VCCINT HSWAP VCCO_0 VCCO_2
VCCO_0 VCCO_2
P
JTAG Mode
VCCINT HSWAP VCCO_0 VCCO_2
VCCO_0 VCCO_2
M2 M1 M0 TDI TMS TCK
Spartan-3E FPGA
VCCAUX TDO +2.5V
`1' `0' `1'
M2 M1 M0 TDI TMS TCK
Spartan-3E FPGA
VCCAUX TDO +2.5V
PROG_B +2.5V JTAG TDI TMS TCK TDO GND
DONE
PROG_B GND
DONE
TMS TCK
DS312-2_56_021405
Figure 65: JTAG Configuration Mode
Voltage Compatibility
The 2.5V VCCAUX supply powers the JTAG interface. All of the user I/Os are separately powered by their respective VCCO_# supplies. When connecting the Spartan-3E JTAG port to a 3.3V interface, the JTAG input pins must be current-limited to 10 mA or less using series resistors. Similarly, the TDO pin is a CMOS output powered from +2.5V. The TDO output can directly drive a 3.3V input but with reduced noise immunity. See XAPP453: The 3.3V Configuration of Spartan-3 FPGAs for additional information. Table 66: Spartan-3E JTAG Device Identifiers 4-Bit Revision Code Spartan-3E FPGA XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Step 0 0x0 0x0 0x0 0x2 0x0 0x1 0x0 0x1 Step 1 0x1 0x1 0x4 0x2 0x2 28-Bit Vendor/Device Identifier 0x1C 10 093 0x1C 1A 093 0x1C 22 093 0x1C 2E 093 0x1C 3A 093
JTAG Device ID
Each Spartan-3E FPGA array type has a 32-bit device-specific JTAG device identifier as shown in Table 66. The lower 28 bits represent the device vendor (Xilinx) and device identifer. The upper four bits, ignored by most tools, represent the revision level of the silicon mounted on the printed circuit board. Table 66 associates the revision code with a specific stepping level.
JTAG User ID
The Spartan-3E JTAG interface also provides the option to store a 32-bit User ID, loaded during configuration. The User ID value is specified via the UserID configuration bitstream option, shown in Table 68, page 108.
Using JTAG Interface to Communicate to a Configured FPGA Design
After the FPGA is configured, using any of the available modes, the JTAG interface offers a possible communications channel to internal FPGA logic. The BSCAN_SPARTAN3 design primitive provides two private JTAG instructions to create an internal boundary scan chain.
Maximum Bitstream Size for Daisy-Chains
The maximum bitstream length supported by Spartan-3E FPGAs in serial daisy-chains is 4,294,967,264 bits
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(4 Gbits), roughly equivalent to a daisy-chain with 720 XC3S1600E FPGAs. This is a limit only for serial daisy-chains where configuration data is passed via the FPGA's DOUT pin. There is no such limit for JTAG chains.
Initialization
Configuration automatically begins after power-on or after asserting the FPGA PROG_B pin, unless delayed using the FPGA's INIT_B pin. The FPGA holds the open-drain INIT_B signal Low while it clears its internal configuration memory. Externally holding the INIT_B pin Low forces the configuration sequencer to wait until INIT_B again goes High. The FPGA signals when the memory-clearing phase is complete by releasing the open-drain INIT_B pin, allowing the pin to go High via the external pull-up resistor to VCCO_2.
Configuration Sequence
The Spartan-3E configuration process is three-stage process that begins after the FPGA powers on (a POR event) or after the PROG_B input is asserted. Power-On Reset (POR) occurs after the VCCINT, VCCAUX, and the VCCO Bank 2 supplies reach their respective input threshold levels. After either a POR or PROG_B event, the three-stage configuration process begins. 1. The FPGA clears (initializes) the internal configuration memory. 2. Configuration data is loaded into the internal memory. 3. The user-application is activated by a start-up process. Figure 66 is a generalized block diagram of the Spartan-3E configuration logic, showing the interaction of different device inputs and Bitstream Generator (BitGen) options. A flow diagram for the configuration sequence of the Serial and Parallel modes appears in Figure 67. Figure 68 shows the Boundary-Scan or JTAG configuration sequence.
Loading Configuration Data
After initialization, configuration data is written to the FPGA's internal memory. The FPGA holds the Global Set/Reset (GSR) signal active throughout configuration, holding all FPGA flip-flops in a reset state. The FPGA signals when the entire configuration process completes by releasing the DONE pin, allowing it to go High. The FPGA configuration sequence can also be initiated by asserting PROG_B. Once released, the FPGA begins clearing its internal configuration memory, and progresses through the remainder of the configuration process.
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Figure 66: Generalized Spartan-3E FPGA Configuration Logic Block Diagram
LOCKED Option Option = Bitstream Generator (BitGen) Option = Design Attribute DCM in User Application STARTUP_WAIT=TRUE All DCMs
STARTUP
EN DCMs_LOCKED LCK_cycle DONE DONE_cycle DONE
INITIALIZATION
Power On Reset (POR)
VCCO_2
VCCO2T
CONFIGURATION
ENABLE DONE USER USER
Enable application logic and I/O pins
ENABLE
DONE
ENABLE
GTS GTS_cycle
Force all I/Os Hi-Z Hold all storage elements reset Disable write operations to storage elements
Clear internal CMOS configuration latches CLEARING_MEMORY POWER_GOOD
VCCINTT
Load application data into CMOS configuration latches
* *
GTS_IN GSR GSR_IN GWE
VCCINT
RESET
WAIT
RESET
RESET
WAIT DonePipe
GWE_cycle
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VCCAUX
VCCAUXT
EN INIT_B
PROG_B
Glitch Filter USER_CLOCK JTAG_CLOCK
*
StartupClk
*
These connections are available via the STARTUP_SPARTAN3E library primitive.
CCLK TCK
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1 1 0 ConfigRate 0 INTERNAL_CONFIGURATION_CLOCK
M1
Internal Oscillator
CRC
ENABLE
ERROR
M2
Configuration Error Detection (CRC Checker)
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Power-On
Set PROG_B Low after Power-On
VCCINT >1V and VCCAUX > 2V and VCCO Bank 2 > 1V
No
Yes Yes
Clear configuration memory
PROG_B = Low
No
No
INIT_ B = High?
Yes
Sample mode pins
M[2:0] and VS[2:0] pins are sampled on INIT_B rising edge
Load configuration data frames
CRC correct?
No
INIT_B goes Low. Abort Start-Up
Yes Start-Up sequence
DONE pin goes High, signaling end of configuration
User mode
No
Reconfigure?
Yes
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Figure 67: General Configuration Process
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Power-On
Set PROG_B Low after Power-On
VCCINT >1V and VCCAUX > 2V and VCCO Bank 2 > 1V Load JPROG instruction
No
Yes Clear configuration memory Yes
PROG_B = Low
No No INIT_B = High?
Yes Sample mode pins (JTAG port becomes available)
Load CFG_IN instruction
Load configuration data frames
CRC correct? Yes Synchronous TAP reset (Clock five 1's on TMS)
No
INIT_B goes Low. Abort Start-Up
Load JSTART instruction
Start-Up sequence
User mode
Yes
Reconfigure?
No
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Figure 68: Boundary-Scan Configuration Flow Diagram
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Functional Description during configuration before the user application in the FPGA starts driving output signals. One clock cycle later, the Global Write Enable (GWE) signal is released. This allows signals to propagate within the FPGA before any clocked storage elements such as flip-flops and block ROM are enabled. The function of the dual-purpose I/O pins, such as M[2:0], VS[2:0], HSWAP, and A[23:0], also changes when the DONE pin goes High. When DONE is High, these pins become user I/Os. Like all user-I/O pins, GTS controls when the dual-purpose pins can drive out.
Start-Up
At the end of configuration, the FPGA automatically pulses the Global Set/Reset (GSR) signal, placing all flip-flops in a known state. After configuration completes, the FPGA switches over to the user application loaded into the FPGA. The sequence and timing of how the FPGA switches over is programmable as is the clock source controlling the sequence. The default start-up sequence appears in Figure 69, where the Global Three-State signal (GTS) is released one clock cycle after DONE goes High. This sequence allows the DONE signal to enable or disable any external logic used
Default Cycles
Start-Up Clock
Phase
0
1
2
3
4
5
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DONE
GTS
GWE
Sync-to-DONE
Start-Up Clock
Phase
0
1
2
3
4
5
67
DONE High
DONE
GTS
GWE
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Figure 69: Default Start-Up Sequence
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Functional Description The relative timing of configuration events is programmed via the Bitstream Generator (BitGen) options in the Xilinx development software. For example, the GTS and GWE events can be programmed to wait for all the DONE pins to High on all the devices in a multiple-FPGA daisy-chain, forcing the FPGAs to start synchronously. Similarly, the start-up sequence can be paused at any stage, waiting for selected DCMs to lock to their respective input clock signals. See also Stabilizing DCM Clocks Before User Mode. By default, the start-up sequence is synchronized to CCLK. Alternatively, the start-up sequence can be synchronized to a user-specified clock from within the FPGA application using the STARTUP_SPARTAN3E library primitive and by setting the StartupClk bitstream generator option. The FPGA application can optionally assert the GSR and GTS signals via the STARTUP_SPARTAN3E primitive. For JTAG configuration, the start-up sequence can be synchronized to the TCK clock input.
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Commercial temperature devices. If Readback is required in an XC3S1200E or XC3S1600E FPGA, or if block RAM Readback is required on any Spartan-3E FPGA, upgrade to either the Industrial temperature grade version or the -5 speed grade. The Xilinx iMPACT programming software uses the Readback feature for its optional Verify and Readback operations. The Xilinx ChipScopeTM software presently does not use Readback but may in future updates. Table 67: Readback Support in Spartan-3E FPGAs Temperature Range Speed Grade Block RAM Readback All Spartan-3E FPGAs No Yes Yes Commercial -4 -5 Industrial -4
General Readback (registers, distributed RAM) XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Yes Yes Yes No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Readback
FPGA configuration data can be read back using either the Slave Parallel or JTAG mode. This function is disabled if the Bitstream Generator Security option is set to either Level1 or Level2. Along with the configuration data, it is possible to read back the contents of all registers and distributed RAM. To synchronously control when register values are captured for readback, use the CAPTURE_SPARTAN3 library primitive, which applies for both Spartan-3 and Spartan-3E FPGA families. The Readback feature is available in most Spartan-3E FPGA product options, as indicated in Table 67. The Readback feature is not available in the XC3S1200E and XC3S1600E FPGAs when using the -4 speed grade in the Commercial temperature grade. Similarly, block RAM Readback support is not available in the -4 speed grade,
Bitstream Generator (BitGen) Options
Various Spartan-3E FPGA functions are controlled by specific bits in the configuration bitstream image. These values are specified when creating the bitstream image with the Bitstream Generator (BitGen) software. Table 68 provides a list of all BitGen options for Spartan-3E FPGAs.
Table 68: Spartan-3E FPGA Bitstream Generator (BitGen) Options
Option Name ConfigRate Pins/Function Affected CCLK, Configuration Values (default) 1, 3, 6, 12, 25, 50 Description Sets the approximate frequency, in MHz, of the internal oscillator using for Master Serial, SPI, and BPI configuration modes. The internal oscillator powers up at its lowest frequency, and the new setting is loaded as part of the configuration bitstream. The software default value is 1 (~1.5 MHz) starting with ISE 8.1, Service Pack 1. Default. The CCLK signal (internally or externally generated) controls the startup sequence when the FPGA transitions from configuration mode to the user mode. See Start-Up. A clock signal from within the FPGA application controls the startup sequence when the FPGA transitions from configuration mode to the user mode. See Start-Up. The FPGA application supplies the user clock on the CLK pin on the STARTUP_SPARTAN3E primitive. The JTAG TCK input controls the startup sequence when the FPGA transitions from the configuration mode to the user mode. See Start-Up.
StartupClk
Configuration, Startup
Cclk
UserClk
Jtag
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Table 68: Spartan-3E FPGA Bitstream Generator (BitGen) Options (Continued)
Option Name UnusedPin Pins/Function Affected Unused I/O Pins Values (default) Pulldown Pullup Pullnone Description Default. All unused I/O pins and input-only pins have a pull-down resistor to GND. All unused I/O pins and input-only pins have a pull-up resistor to the VCCO_# supply for its associated I/O bank. All unused I/O pins and input-only pins are left floating (Hi-Z, high-impedance, three-state). Use external pull-up or pull-down resistors or logic to apply a valid signal level. Selects the Configuration Startup phase that activates the FPGA's DONE pin. See Start-Up. Selects the Configuration Startup phase that asserts the internal write-enable signal to all flip-flops, LUT RAMs and shift registers (SRL16). It also enables block RAM read and write operations. See Start-Up. Waits for the DONE pin input to go High before asserting the internal write-enable signal to all flip-flops, LUT RAMs and shift registers (SRL16). Block RAM read and write operations are enabled at this time. Retains the current GWE_cycle setting for partial reconfiguration applications. Selects the Configuration Startup phase that releases the internal three-state control, holding all I/O buffers in high-impedance (Hi-Z). Output buffers actively drive, if so configured, after this point. See Start-Up. Waits for the DONE pin input to go High before releasing the internal three-state control, holding all I/O buffers in high-impedance (Hi-Z). Output buffers actively drive, if so configured, after this point. Retains the current GTS_cycle setting for partial reconfiguration applications. The FPGA does not wait for selected DCMs to lock before completing configuration. If one or more DCMs in the design have the STARTUP_WAIT attribute set to TRUE, the FPGA waits for such DCMs to acquire their respective input clock and assert their LOCKED output. This setting selects the Configuration Startup phase where the FPGA waits for the DCMs to lock. Internally connects a pull-up resistor between DONE pin and VCCAUX. An external 330 pull-up resistor to VCCAUX is still recommended. No internal pull-up resistor on DONE pin. An external 330 pull-up resistor to VCCAUX is required. When configuration completes, the DONE pin stops driving Low and relies on an external 330 pull-up resistor to VCCAUX for a valid logic High. When configuration completes, the DONE pin actively drives High. When using this option, an external pull-up resistor is no longer required. Only one device in an FPGA daisy-chain should use this setting. The input path from DONE pin input back to the Startup sequencer is not pipelined. This option adds a pipeline register stage between the DONE pin input and the Startup sequencer. Used for high-speed daisy-chain configurations when DONE cannot rise in a single CCLK cycle. Releases GWE and GTS signals on the first rising edge of StartupClk after the DONE pin input goes High.
DONE_cycle
DONE pin, Configuration Startup All flip-flops, LUT RAMs, and SRL16 shift registers, Block RAM, Configuration Startup
1, 2, 3, 4, 5, 6 1, 2, 3, 4, 5, 6 Done
GWE_cycle
Keep GTS_cycle All I/O pins, Configuration 1, 2, 3, 4, 5, 6 Done
Keep LCK_cycle DCMs, Configuration Startup NoWait 0, 1, 2, 3, 4, 5, 6
DonePin
DONE pin
Pullup Pullnone
DriveDone
DONE pin
No Yes
DonePipe
DONE pin
No Yes
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Functional Description Table 68: Spartan-3E FPGA Bitstream Generator (BitGen) Options (Continued)
Option Name ProgPin Pins/Function Affected PROG_B pin Values (default) Pullup Pullnone TckPin JTAG TCK pin Pullup Pulldown Pullnone TdiPin JTAG TDI pin Pullup Pulldown Pullnone TdoPin JTAG TDO pin Pullup Pulldown Pullnone TmsPin JTAG TMS pin Pullup Pulldown Pullnone UserID JTAG User ID register JTAG, SelectMAP, Readback, Partial reconfiguration User string None Level1 Level2 CRC Configuration Enable Disable Persist SelectMAP interface pins, BPI mode, Slave mode, Configuration No Yes Description Internally connects a pull-up resistor or between PROG_B pin and VCCAUX. An external 4.7 k pull-up resistor to VCCAUX is still recommended. No internal pull-up resistor on PROG_B pin. An external 4.7 k pull-up resistor to VCCAUX is required. Internally connects a pull-up resistor between JTAG TCK pin and VCCAUX. Internally connects a pull-down resistor between JTAG TCK pin and GND. No internal pull-up resistor on JTAG TCK pin. Internally connects a pull-up resistor between JTAG TDI pin and VCCAUX. Internally connects a pull-down resistor between JTAG TDI pin and GND. No internal pull-up resistor on JTAG TDI pin. Internally connects a pull-up resistor between JTAG TDO pin and VCCAUX. Internally connects a pull-down resistor between JTAG TDO pin and GND. No internal pull-up resistor on JTAG TDO pin. Internally connects a pull-up resistor between JTAG TMS pin and VCCAUX. Internally connects a pull-down resistor between JTAG TMS pin and GND. No internal pull-up resistor on JTAG TMS pin. The 32-bit JTAG User ID register value is loaded during configuration. The default value is all ones, 0xFFFF_FFFF hexadecimal. To specify another value, enter an 8-character hexadecimal value. Readback and limited partial reconfiguration are available via the JTAG port or via the SelectMAP interface, if the Persist option is set to Yes. Readback function is disabled. Limited partial reconfiguration is still available via the JTAG port or via the SelectMAP interface, if the Persist option is set to Yes. Readback function is disabled. Limited partial reconfiguration is disabled. Default. Enable CRC checking on the FPGA bitstream. If error detected, FPGA asserts INIT_B Low and DONE pin stays Low. Turn off CRC checking. All BPI and Slave mode configuration pins are available as user-I/O after configuration. This option is required for Readback and partial reconfiguration using the SelectMAP interface. The SelectMAP interface pins (see Slave Parallel Mode) are reserved after configuration and are not available as user-I/O.
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Powering Spartan-3E FPGAs
Voltage Supplies
Like Spartan-3 FPGAs, Spartan-3E FPGAs have multiple voltage supply inputs, as shown in Table 69. There are two supply inputs for internal logic functions, VCCINT and VCCAUX. Each of the four I/O banks has a separate VCCO Table 69: Spartan-3E Voltage Supplies Supply Input VCCINT VCCAUX Description Internal core supply voltage. Supplies all internal logic functions, such as CLBs, block RAM, and multipliers. Input to Power-On Reset (POR) circuit. Auxiliary supply voltage. Supplies Digital Clock Managers (DCMs), differential drivers, dedicated configuration pins, JTAG interface. Input to Power-On Reset (POR) circuit. Supplies the output buffers in I/O Bank 0, the bank along the top edge of the FPGA. Supplies the output buffers in I/O Bank 1, the bank along the right edge of the FPGA. In Byte-Wide Peripheral Interface (BPI) Parallel Flash Mode, connects to the same voltage as the Flash PROM. Supplies the output buffers in I/O Bank 2, the bank along the bottom edge of the FPGA. Connects to the same voltage as the FPGA configuration source. Input to Power-On Reset (POR) circuit. Supplies the output buffers in I/O Bank 3, the bank along the left edge of the FPGA. Nominal Supply Voltage 1.2V 2.5V supply input that powers the output buffers within the associated I/O bank. All of the VCCO connections to a specific I/O bank must be connected and must connect to the same voltage.
VCCO_0 VCCO_1
Selectable, 3.3V, 2.5V, 1.8, 1.5V, or 1.2V Selectable, 3.3V, 2.5V, 1.8, 1.5V, or 1.2V Selectable, 3.3V, 2.5V, 1.8, 1.5V, or 1.2V Selectable, 3.3V, 2.5V, 1.8, 1.5V, or 1.2V
VCCO_2
VCCO_3
In a 3.3V-only application, all four VCCO supplies connect to 3.3V. However, Spartan-3E FPGAs provide the ability to bridge between different I/O voltages and standards by applying different voltages to the VCCO inputs of different banks. Refer to I/O Banking Rules for which I/O standards can be intermixed within a single I/O bank. Each I/O bank also has an separate, optional input voltage reference supply, called VREF. If the I/O bank includes an I/O standard that requires a voltage reference such as HSTL or SSTL, then all VREF pins within the I/O bank must be connected to the same voltage.
mance applications, greater than 100 MHz. Proper design results in better overall performance, lower clock and DCM jitter, and a generally more robust system. Before designing the printed circuit board (PCB) for the FPGA design, please review XAPP623: Power Distribution System (PDS) Design: Using Bypass/Decoupling Capacitors.
Power-On Behavior
Spartan-3E FPGAs have a built-in Power-On Reset (POR) circuit that monitors the three power rails required to successfully configure the FPGA. At power-up, the POR circuit holds the FPGA in a reset state until the VCCINT, VCCAUX, and VCCO Bank 2 supplies reach their respective input threshold levels (see Table 73 in Module 3). After all three supplies reach their respective thresholds, the POR reset is released and the FPGA begins its configuration process.
Voltage Regulators
Various power supply manufacturers offer complete power solutions for Xilinx FPGAs including some with integrated three-rail regulators specifically designed for Spartan-3 and Spartan-3E FPGAs. The Xilinx Power Corner website provides links to vendor solution guides and Xilinx power estimation and analysis tools.
Supply Sequencing
Because the three FPGA supply inputs must be valid to release the POR reset and can be supplied in any order, there are no FPGA-specific voltage sequencing requirements. Applying the FPGA's VCCAUX supply before the VCCINT supply uses the least ICCINT current.
Power Distribution System (PDS) Design and Decoupling/Bypass Capacitors
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Functional Description Although the FPGA has no specific voltage sequence requirements, be sure to consider any potential sequencing requirement of the configuration device attached to the FPGA, such as an SPI serial Flash PROM, a parallel NOR Flash PROM, or a microcontroller. For example, Flash PROMs have a minimum time requirement before the PROM can be selected and this must be considered if the 3.3V supply is the last in the sequence. See Power-On Precautions if 3.3V Supply is Last in Sequence for more details. When all three supplies are valid, the minimum current required to power-on the FPGA equals the worst-case quiescent current, specified in Table 78. Spartan-3E FPGAs do not require Power-On Surge (POS) current to successfully configure.
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have a foldback feature that could inadvertently shut down in the presence of the surplus current.
Configuration Data Retention, Brown-Out
The FPGA's configuration data is stored in robust CMOS configuration latches. The data in these latches is retained even when the voltages drop to the minimum levels necessary to preserve RAM contents, as specified in Table 75. If, after configuration, the VCCAUX or VCCINT supply drops below its data retention voltage, the current device configuration must be cleared using one of the following methods: * Force the VCCAUX or VCCINT supply voltage below the minimum Power On Reset (POR) voltage threshold (Table 73). Assert PROG_B Low.
Surplus ICCINT if VCCINT Applied before VCCAUX
If the VCCINT supply is applied before the VCCAUX supply, the FPGA might draw a surplus ICCINT current in addition to the ICCINT quiescent current levels specified in Table 78, page 121. The momentary additional ICCINT surplus current might be a few hundred milliamperes under nominal conditions, significantly less than the instantaneous current consumed by the bypass capacitors at power-on. However, the surplus current immediately disappears when the VCCAUX supply is applied, and, in response, the FPGA's ICCINT quiescent current demand drops to the levels specified in Table 78. The FPGA does not use or require the surplus current to successfully power-on and configure. If applying VCCINT before VCCAUX, ensure that the regulator does not
*
The POR circuit does not monitor the VCCO_2 supply after configuration. Consequently, dropping the VCCO_2 voltage does not reset the device by triggering a Power-On Reset (POR) event.
No Internal Charge Pumps or Free-Running Oscillators
Some system applications are sensitive to sources of analog noise. Spartan-3E FPGA circuitry is fully static and does not employ internal charge pumps. The CCLK configuration clock is active during the FPGA configuration process. After configuration completes, the CCLK oscillator is automatically disabled unless the Bitstream Generator (BitGen) option Persist=Yes.
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Production Stepping
The Spartan-3E FPGA family uses production stepping to indicate improved capabilities or enhanced features. All devices ordered using the standard part number support Stepping 0 functionality and performance. Later steppings are, by definition, a functional superset of any previous stepping. Furthermore, configuration bitstreams generated for any stepping are compatible with later steppings. Xilinx ships both Stepping 0 and Stepping 1. Designs operating on the Stepping 0 devices perform similarly on a Stepping 1 device.
Differences Between Steppings
Table 70 summarizes the feature and performance differences between Stepping 0 devices and Stepping 1 devices.
Table 70: Differences between Spartan-3E Production Stepping Levels Stepping 0 Production status JTAG ID code DCM DLL maximum input frequency DCM DFS output frequency range(s) Production Stepping 1 Production starting March 2006 240 MHz (-4 speed grade) 275 MHz (-5 speed grade) Continuous range: 5 - 311 MHz (-4) 5 - 333 MHz (-5) Yes
Different revision fields. See Table 66. 90 MHz (200 MHz for XC3S1200E) Split ranges at 5 - 90 MHz and 220 - 307 MHz (single range 5 - 307 MHz for XC3S1200E) No, single FPGA only No(1) Yes: XC3S100E, XC3S250E, XC3S500E No(2): XC3S1200E, XC3S1600E
Supports multi-FPGA daisy-chain configurations from SPI Flash JTAG configuration supported when FPGA in BPI mode with a valid image in the attached parallel NOR Flash PROM JTAG EXTEST, INTEST, SAMPLE support
Notes:
1. 2.
Yes Yes All Devices
Workarounds exist. See Stepping 0 Limitations when Reprogramming via JTAG if FPGA Set for BPI Configuration. JTAG BYPASS and JTAG configuration are supported
Ordering a Later Stepping
Spartan-3E FPGAs ordered using the standard part number always support the Stepping 0 feature set. To order only the later stepping, append an "S#" suffix to the standard ordering code, where `#' is the stepping number, as indicated in Table 71. Beginning with Stepping 1 and later, the stepping level is marked on the device using a single number character, as shown in Figure 2, Figure 3, and Figure 4 in Module 1. Stepping 0 devices are represented with either a `0' mark
or no mark. See Ordering Information, page 7 in Module 1 for additional information. Table 71: Spartan-3E Stepping Levels Stepping Number 0 1 Suffix Code None S1 Status Production Production
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Software Version Requirements
Production Spartan-3E applications must be processed using the Xilinx ISE 8.1i, Service Pack 3 or later development software, using the v1.21 or later speed files. The ISE 8.1i software implements critical bitstream generator updates.
For additional information on Spartan-3E development software and known issues, see the following Answer Record: * Xilinx Answer #22253
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Revision History
The following table shows the revision history for this document. Date
03/01/05 03/21/05 11/23/05
Version
1.0 1.1 2.0 Initial Xilinx release.
Revision
Updated Figure 45. Modified title on Table 39 and Table 44. Updated values of On-Chip Differential Termination resistors. Updated Table 7. Updated configuration bitstream sizes for XC3S250E through XC3S1600E in Table 44, Table 50, Table 56, and Table 59. Added DLL Performance Differences Between Steppings. Added Stepping 0 Limitations when Reprogramming via JTAG if FPGA Set for BPI Configuration. Added Stepping 0 limitations when Daisy-Chaining in SPI configuration mode. Added Multiplier/Block RAM Interaction section. Updated Digital Clock Managers (DCMs) section, especially Phase Shifter (PS) portion. Corrected and enhanced the clock infrastructure diagram in Figure 45 and Table 41. Added CCLK Design Considerations section. Added Design Considerations for the HSWAP, M[2:0], and VS[2:0] Pins section. Added Spansion, Winbond, and Macronix to list of SPI Flash vendors in Table 52 and Table 55. Clarified that SPI mode configuration supports Atmel `C'- and `D'-series DataFlash. Updated the Programming Support section for SPI Flash PROMs. Added Power-On Precautions if PROM Supply is Last in Sequence, Compatible Flash Families, and BPI Mode Interaction with Right and Bottom Edge Global Clock Inputs sections to BPI configuration mode topic. Updated and amplified Powering Spartan-3E FPGAs section. Added Production Stepping section. Upgraded data sheet status to Preliminary. Updated Input Delay Functions and Figure 6. Added clarification that Input-only pins also have Pull-Up and Pull-Down Resistors. Added design note about address setup and hold requirements to Block RAM. Added warning message about software differences between ISE 8.1i, Service Pack 3 and earlier software to FIXED Phase Shift Mode and VARIABLE Phase Shift Mode. Added message about using GCLK1 in DLL Clock Input Connections and Clock Inputs. Updated Figure 45. Added additional information on HSWAP behavior to Pin Behavior During Configuration. Highlighted which pins have configuration pull-up resistors unaffected by HSWAP in Table 45. Updated bitstream image sizes for the XC3S1200E and XC3S1600E in Table 44, Table 50, Table 56, and Table 59. Clarified that `B'-series Atmel DataFlash SPI PROMs can be used in Commercial temperature range applications in Table 52 and Figure 54. Updated Figure 56. Updated Dynamically Loading Multiple Configuration Images Using MultiBoot Option section. Added design note about BPI daisy-chaining software support to BPI Daisy-Chaining section. Updated JTAG revision codes in Table 66. Added No Internal Charge Pumps or Free-Running Oscillators. Updated information on production stepping differences in Table 70. Updated Software Version Requirements. Updated JTAG User ID information. Clarified Note 1, Figure 5. Clarified that Figure 45 shows electrical connectivity and corrected left- and right-edge DCM coordinates. Updated Table 30, Table 31, and Table 32 to show the specific clock line driven by the associated BUFGMUX primitive. Corrected the coordinate locations for the associated BUFGMUX primitives in Table 31 and Table 32. Updated Table 41 to show that the I0-input is the preferred connection to a BUFGMUX. Made further clarifying changes to Figure 46, showing both direct inputs to BUFGMUX primitives and to DCMs. Added Atmel AT45DBxxxD-series DataFlash serial PROMs to Table 52. Added details that intermediate FPGAs in a BPI-mode, multi-FPGA configuration daisy-chain must be from either the Spartan-3E or the Virtex-5 FPGA families (see BPI Daisy-Chaining). Added Using JTAG Interface to Communicate to a Configured FPGA Design. Minor updates to Figure 67 and Figure 68. Clarified which Spartan-3E FPGA product options support the Readback feature, shown in Table 67. Corrected various typos and incorrect links.
03/22/06
3.0
04/10/06
3.1
05/19/06
3.2
05/30/06
3.2.1
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Functional Description
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Date
10/02/06
Version
3.3
Revision
Clarified that the block RAM Readback feature is available either on the -5 speed grade or the Industrial temperature range.
11/09/06
3.4
Updated the description of the Input Delay Functions. The ODDR2 flip-flop with C0 or C1 Alignment is no longer supported. Updated Figure 5. Updated Table 6 for improved PCI input voltage tolerance. Replaced missing text in Clock Buffers/Multiplexers. Updated SPI Flash devices in Table 52. Updated parallel NOR Flash devices in Table 60. Direct, SPI Flash in-system Programming Support was added beginning with ISE 8.1i iMPACT software for STMicro and Atmel SPI PROMs. Updated Table 70 and Table 71 as Stepping 1 is in full production. Freshened various hyperlinks. Promoted Module 2 to Production status.
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Spartan-3E FPGA Family: DC and Switching Characteristics
0
DS312-3 (v3.4) November 9, 2006
Product Specification
DC Electrical Characteristics
In this section, specifications may be designated as Advance, Preliminary, or Production. These terms are defined as follows: Advance: Initial estimates are based on simulation, early characterization, and/or extrapolation from the characteristics of other families. Values are subject to change. Use as estimates, not for production. Preliminary: Based on characterization. Further changes are not expected. Production: These specifications are approved once the silicon has been characterized over numerous production lots. Parameter values are considered stable with no future changes expected. All parameter limits are representative of worst-case supply voltage and junction temperature conditions. Unless otherwise noted, the published parameter values apply to all SpartanTM-3E devices. AC and DC characteristics are specified using the same numbers for both commercial and industrial grades.
Absolute Maximum Ratings
Stresses beyond those listed under Table 72: Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions beyond those listed under the Recommended Operating Conditions is not implied. Exposure to absolute maximum conditions for extended periods of time adversely affects device reliability.
Table 72: Absolute Maximum Ratings
Symbol VCCINT VCCAUX VCCO VREF VIN(1,2,3) Description Internal supply voltage Auxiliary supply voltage Output driver supply voltage Input reference voltage Voltage applied to all User I/O pins and Dual-Purpose pins Voltage applied to all Dedicated pins IIK VESD Input clamp current per I/O pin Electrostatic Discharge Voltage Driver in a high-impedance state Commercial Industrial All temp. ranges Conditions Min -0.5 -0.5 -0.5 -0.5 -0.95 -0.85 -0.5 - - - - - -65 Max 1.32 3.00 3.75 VCCO + 0.5(1) 4.4 4.3 VCCAUX + 0.5(3) Units V V V V V V V mA V V V C C
-0.5 V < VIN < (VCCO + 0.5 V) Human body model Charged device model Machine model
100 2000 500 200
125 150
TJ TSTG Notes:
1. 2. 3.
Junction temperature Storage temperature
4.
Each of the User I/O and Dual-Purpose pins is associated with one of the four banks' VCCO rails. Keeping VIN within 500 mV of the associated VCCO rails or ground rail ensures that the internal diode junctions do not turn on. Table 76 specifies the VCCO range used to evaluate the maximum VIN voltage. Input voltages outside the -0.5V to VCCO + 0.5V voltage range are permissible provided that the IIK input diode clamp diode rating is met and no more than 100 pins exceed the range simultaneously. All Dedicated pins (PROG_B, DONE, TCK, TDI, TDO, and TMS) draw power from the VCCAUX rail (2.5V). Meeting the VIN max limit ensures that the internal diode junctions that exist between each of these pins and the VCCAUX rail do not turn on. Table 76 specifies the VCCAUX range used to evaluate the maximum VIN voltage. As long as the VIN max specification is met, oxide stress is not possible. For soldering guidelines, see UG112: Device Packaging and Thermal Characteristics and XAPP427: Implementation and Solder Reflow Guidelines for Pb-Free Packages.
(c) 2005-2006 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners.
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Power Supply Specifications
Table 73: Supply Voltage Thresholds for Power-On Reset Symbol VCCINTT VCCAUXT VCCO2T
Notes:
1. VCCINT, VCCAUX, and VCCO supplies to the FPGA can be applied in any order. However, the FPGA's configuration source (Platform Flash, SPI Flash, parallel NOR Flash, microcontroller) might have specific requirements. Check the data sheet for the attached configuration source. To ensure successful power-on, VCCINT, VCCO Bank 2, and VCCAUX supplies must rise through their respective threshold-voltage ranges with no dips at any point.
Description Threshold for the VCCINT supply Threshold for the VCCAUX supply Threshold for the VCCO Bank 2 supply
Min 0.4 0.8 0.4
Max 1.0 2.0 1.0
Units V V V
2.
Table 74: Supply Voltage Ramp Rate Symbol VCCINTR VCCAUXR VCCO2R
Notes:
1. VCCINT, VCCAUX, and VCCO supplies to the FPGA can be applied in any order. However, the FPGA's configuration source (Platform Flash, SPI Flash, parallel NOR Flash, microcontroller) might have specific requirements. Check the data sheet for the attached configuration source. To ensure successful power-on, VCCINT, VCCO Bank 2, and VCCAUX supplies must rise through their respective threshold-voltage ranges with no dips at any point.
Description Ramp rate from GND to valid VCCINT supply level Ramp rate from GND to valid VCCAUX supply level Ramp rate from GND to valid VCCO Bank 2 supply level
Min 0.2 0.2 0.2
Max 50 50 50
Units ms ms ms
2.
Table 75: Supply Voltage Levels Necessary for Preserving RAM Contents Symbol VDRINT VDRAUX
Notes:
1. RAM contents include configuration data.
Description VCCINT level required to retain RAM data VCCAUX level required to retain RAM data
Min 1.0 2.0
Units V V
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General Recommended Operating Conditions
Table 76: General Recommended Operating Conditions Symbol TJ VCCINT VCCO
(1)
Description Junction temperature Internal supply voltage Output driver supply voltage Auxiliary supply voltage Input voltage extremes to avoid turning on I/O protection diodes. Input signal transition time(3) I/O, Input-only, and Dual-Purpose pins(2) Dedicated pins(3) Commercial Industrial
Min 0 -40 1.140 1.100 2.375 -0.5 -0.5 -
Nominal - - 1.200 2.500 - - -
Max 85 100 1.260 3.450 2.625 VCCO + 0.5 VCCAUX + 0.5 500
Units C C V V V V
VCCAUX VIN(2,3,4)
TIN
Notes:
1. 2.
ns
3. 4. 5.
This VCCO range spans the lowest and highest operating voltages for all supported I/O standards. Table 79 lists the recommended VCCO range specific to each of the single-ended I/O standards, and Table 81 lists that specific to the differential standards. Each of the User I/O and Dual-Purpose pins is associated with one of the four banks' VCCO rails. Meeting the VIN limit ensures that the internal diode junctions that exist between these pins and their associated VCCO and GND rails do not turn on. The absolute maximum rating is provided in Table 72. All Dedicated pins (PROG_B, DONE, TCK, TDI, TDO, and TMS) draw power from the VCCAUX rail (2.5V). Meeting the VIN max limit ensures that the internal diode junctions that exist between each of these pins and the VCCAUX and GND rails do not turn on. Input voltages outside the recommended range is permissible provided that the IIK input diode clamp diode rating is met. Measured between 10% and 90% VCCO.
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General DC Characteristics for I/O Pins
Table 77: General DC Characteristics of User I/O, Dual-Purpose, and Dedicated Pins Symbol IL Description Leakage current at User I/O, Input-only, Dual-Purpose, and Dedicated pins Current through pull-up resistor at User I/O, Dual-Purpose, Input-only, and Dedicated pins Test Conditions Driver is in a high-impedance state, VIN = 0V or VCCO max, sample-tested VIN = 0V, VCCO = 3.3V VIN = 0V, VCCO = 2.5V VIN = 0V, VCCO = 1.8V VIN = 0V, VCCO = 1.5V VIN = 0V, VCCO = 1.2V RPU(2) Equivalent pull-up resistor value at User I/O, Dual-Purpose, Input-only, and Dedicated pins (based on IRPU per Note 2) VIN = 0V, VCCO = 3.0V to 3.45V VIN = 0V, VCCO = 2.3V to 2.7V VIN = 0V, VCCO = 1.7V to 1.9V VIN = 0V, VCCO =1.4V to 1.6V VIN = 0V, VCCO = 1.14V to 1.26V IRPD(2) Current through pull-down resistor at User I/O, Dual-Purpose, Input-only, and Dedicated pins Equivalent pull-down resistor value at User I/O, Dual-Purpose, Input-only, and Dedicated pins (based on IRPD per Note 2) VIN = VCCO Min -10 Typ - Max +10 Units A
IRPU(2)
-0.36 -0.22 -0.10 -0.06 -0.04 2.4 2.7 4.3 5.0 5.5 0.10
- - - - - - - - - - -
-1.24 -0.80 -0.42 -0.27 -0.22 10.8 11.8 20.2 25.9 32.0 0.75
mA mA mA mA mA k k k k k mA
RPD(2)
VIN = VCCO = 3.0V to 3.45V VIN = VCCO = 2.3V to 2.7V VIN = VCCO = 1.7V to 1.9V VIN = VCCO = 1.4V to 1.6V VIN = VCCO = 1.14V to 1.26V
4.0 3.0 2.3 1.8 1.5 -10 3 -
- - - - - - - 120
34.5 27.0 19.0 16.0 12.6 +10 10 -
k k k k k A pF
IREF CIN RDT
VREF current per pin Input capacitance Resistance of optional differential termination circuit within a differential I/O pair. Not available on Input-only pairs.
All VCCO levels VOCM Min VICM VOCM Max VOD Min VID VOD Max VCCO = 2.5V
Notes:
1. 2. The numbers in this table are based on the conditions set forth in Table 76. This parameter is based on characterization. The pull-up resistance RPU = VCCO / IRPU. The pull-down resistance RPD = VIN / IRPD.
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Quiescent Current Requirements
Table 78: Quiescent Supply Current Characteristics Symbol ICCINTQ Description Quiescent VCCINT supply current Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E ICCOQ Quiescent VCCO supply current XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E ICCAUXQ Quiescent VCCAUX supply current XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
Notes:
1. 2. The numbers in this table are based on the conditions set forth in Table 76. Quiescent supply current is measured with all I/O drivers in a high-impedance state and with all pull-up/pull-down resistors at the I/O pads disabled. Typical values are characterized using typical devices at ambient room temperature (TA of 25C at VCCINT = 1.2 V, VCCO = 3.3V, and VCCAUX = 2.5V). The maximum limits are tested for each device at the respective maximum specified junction temperature and at maximum voltage limits with VCCINT = 1.26V, VCCO = 3.45V, and VCCAUX = 2.625V. The FPGA is programmed with a "blank" configuration data file (i.e., a design with no functional elements instantiated). For conditions other than those described above, (e.g., a design including functional elements), measured quiescent current levels may be different than the values in the table. There are two recommended ways to estimate the total power consumption (quiescent plus dynamic) for a specific design: a) The Spartan-3E XPower Estimator provides quick, approximate, typical estimates, and does not require a netlist of the design. b) XPower Analyzer uses a netlist as input to provide maximum estimates as well as more accurate typical estimates. The maximum numbers in this table indicate the minimum current each power rail requires in order for the FPGA to power-on successfully.
Typical(2) 8 15 25 50 65 1.5 1.5 2 3 3 8 12 18 35 45
Commercial Maximum(2) 60 120 165 400 560 8 8 10 12 12 25 30 40 65 80
Industrial Maximum(2) 80 160 210 500 700 10 10 12 15 15 28 35 45 75 90
Units mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
3.
4.
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Single-Ended I/O Standards
Table 79: Recommended Operating Conditions for User I/Os Using Single-Ended Standards IOSTANDARD Attribute LVTTL LVCMOS33(4) LVCMOS25(4,5) LVCMOS18(4) LVCMOS15(4) LVCMOS12(4) PCI33_3 PCI66_3 PCIX HSTL_I_18 HSTL_III_18 SSTL18_I SSTL2_I
Notes:
1. Descriptions of the symbols used in this table are as follows: VCCO - the supply voltage for output drivers VREF - the reference voltage for setting the input switching threshold VIL - the input voltage that indicates a Low logic level VIH - the input voltage that indicates a High logic level The VCCO rails supply only output drivers, not input circuits. For device operation, the maximum signal voltage (VIH max) may be as high as VIN max. See Table 72. There is approximately 100 mV of hysteresis on inputs using LVCMOS33 and LVCMOS25 I/O standards. All Dedicated pins (PROG_B, DONE, TCK, TDI, TDO, and TMS) use the LVCMOS25 standard and draw power from the VCCAUX rail (2.5V). The Dual-Purpose configuration pins use the LVCMOS25 standard before the User mode. When using these pins as part of a standard 2.5V configuration interface, apply 2.5V to the VCCO lines of Banks 0, 1, and 2 at power-on as well as throughout configuration.
VCCO for Drivers(2) Min (V) 3.0 3.0 2.3 1.65 1.4 1.1 3.0 3.0 3.0 1.7 1.7 1.7 2.3 Nom (V) 3.3 3.3 2.5 1.8 1.5 1.2 3.3 3.3 3.3 1.8 1.8 1.8 2.5 Max (V) 3.45 3.45 2.7 1.95 1.6 1.3 3.45 3.45 3.45 1.9 1.9 1.9 2.7 0.8 0.833 1.15 Min (V)
VREF Nom (V) Max (V)
VIL Max (V) 0.8 0.8 0.7 0.38
VIH Min (V) 2.0 2.0 1.7 0.8 0.8 0.8 1.5 1.5
VREF is not used for these I/O standards
0.38 0.38 0.9 0.9
0.9 1.1 0.900 1.25
1.1 0.969 1.35
VREF - 0.1 VREF - 0.1 VREF - 0.125 VREF - 0.125
VREF + 0.1 VREF + 0.1 VREF + 0.125 VREF + 0.125
2. 3. 4. 5.
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DC and Switching Characteristics Table 80: DC Characteristics of User I/Os Using Single-Ended Standards
Test Conditions IOSTANDARD Attribute LVTTL(3) 2 4 6 8 12 16 LVCMOS33(3) 2 4 6 8 12 16 LVCMOS25(3) 2 4 6 8 12 LVCMOS18(3) 2 4 6 8 LVCMOS15(3) 2 4 6 LVCMOS12(3) PCI33_3(4) PCI66_3(4) PCIX HSTL_I_18 HSTL_III_18 SSTL18_I 2 IOL
(mA)
Table 80: DC Characteristics of User I/Os Using Single-Ended Standards (Continued)
Test Conditions IOSTANDARD Attribute SSTL2_I Notes:
1. 2. The numbers in this table are based on the conditions set forth in Table 76 and Table 79. Descriptions of the symbols used in this table are as follows:
IOL - the output current condition under which VOL is tested IOH - the output current condition under which VOH is tested VOL - the output voltage that indicates a Low logic level VOH - the output voltage that indicates a High logic level VIL - the input voltage that indicates a Low logic level VIH - the input voltage that indicates a High logic level VCCO - the supply voltage for output drivers VREF - the reference voltage for setting the input switching threshold VTT - the voltage applied to a resistor termination
Logic Level Characteristics VOL Max (V) 0.4 VOH Min (V) 2.4
Logic Level Characteristics VOL Max (V) VTT - 0.61 VOH Min (V) VTT + 0.61
IOH
(mA)
IOL
(mA)
IOH
(mA)
2 4 6 8 12 16 2 4 6 8 12 16 2 4 6 8 12 2 4 6 8 2 4 6 2 1.5 1.5 1.5 8 24 6.7
-2 -4 -6 -8 -12 -16 -2 -4 -6 -8 -12 -16 -2 -4 -6 -8 -12 -2 -4 -6 -8 -2 -4 -6 -2 -0.5 -0.5 -0.5 -8 -8 -6.7
8.1
-8.1
0.4
VCCO - 0.4
3. 4.
For the LVCMOS and LVTTL standards: the same VOL and VOH limits apply for both the Fast and Slow slew attributes. Tested according to the relevant PCI specifications. For more information, see XAPP653: Virtex-II Pro and Spartan-3 3.3V PCI Reference Design.
0.4
VCCO - 0.4
0.4
VCCO - 0.4
0.4
VCCO - 0.4
0.4 10% VCCO 10% VCCO 10% VCCO 0.4 0.4
VTT - 0.475
VCCO - 0.4 90% VCCO 90% VCCO 90% VCCO VCCO - 0.4 VCCO - 0.4
VTT + 0.475
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Differential I/O Standards
VINP Internal Logic VINN P N Differential I/O Pair Pins
VINN VINP GND level
50%
VICM
VID
VICM = Input common mode voltage =
VINP + VINN 2
VID = Differential input voltage = VINP - VINN
DS099-3_01_012304
Figure 70: Differential Input Voltages Table 81: Recommended Operating Conditions for User I/Os Using Differential Signal Standards
VCCO for Drivers(1) VID Min (mV) 100 100 200 100 2.625 1.9 1.9 1.9 2.7 100 100 100 100 100 Nom (mV) 350 350 800 200 Max (mV) 600 600 600 1000 Min (V) 0.30 0.30 0.30 0.5 0.3 0.8 0.8 0.7 1.0 VICM Nom (V) 1.25 1.25 1.2 1.20 Max (V) 2.20 2.20 2.2 2.0 1.4 1.1 1.1 1.1 1.5
IOSTANDARD Attribute
LVDS_25 BLVDS_25 MINI_LVDS_25 LVPECL_25(2) RSDS_25 DIFF_HSTL_I_18 DIFF_HSTL_III_18 DIFF_SSTL18_I DIFF_SSTL2_I Notes:
1. 2.
Min (V) 2.375 2.375 2.375
Nom (V) 2.50 2.50 2.50 Inputs Only
Max (V) 2.625 2.625 2.625
2.375 1.7 1.7 1.7 2.3
2.50 1.8 1.8 1.8 2.5
The VCCO rails supply only differential output drivers, not input circuits. VREF inputs are not used for any of the differential I/O standards.
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VOUTP Internal Logic VOUTN
P N
Differential I/O Pair Pins
VOUTN VOUTP GND level
50%
VOH VOD VOCM
VOL
VOCM = Output common mode voltage =
VOUTP + VOUTN
2 VOD = Output differential voltage = VOUTP - VOUTN
VOH = Output voltage indicating a High logic level VOL = Output voltage indicating a Low logic level
DS312-3_03_021505
Figure 71: Differential Output Voltages Table 82: DC Characteristics of User I/Os Using Differential Signal Standards
VOD IOSTANDARD Attribute LVDS_25 BLVDS_25 MINI_LVDS_25 RSDS_25 DIFF_HSTL_I_18 DIFF_HSTL_III_18 DIFF_SSTL18_I DIFF_SSTL2_I Notes:
1. 2. 3. The numbers in this table are based on the conditions set forth in Table 76 and Table 81. Output voltage measurements for all differential standards are made with a termination resistor (RT) of 100 across the N and P pins of the differential signal pair. The exception is for BLVDS, shown in Figure 72 below. At any given time, no more than two of the following differential output standards may be assigned to an I/O bank: LVDS_25, RSDS_25, MINI_LVDS_25
VOD Max (mV) 450 450 600 400 - - - - Min (mV) - - - - - - - - Max (mV) - - 50 - - - - - Min (V) 1.125 - 1.0 1.1 - - - -
VOCM Typ (V) - 1.20 - - - - - - Max (V) 1.375 - 1.4 1.4 - - - -
VOCM Min (mV) - - - - - - - - Max (mV) - - 50 - - - - -
VOH Min (V) - - - - VCCO - 0.4 VCCO - 0.4
VTT + 0.475
VOL Max (V) - - - - 0.4 0.4
VTT - 0.475
Min (mV) 250 250 300 100 - - - -
Typ (mV) 350 350 - - - - - -
VTT + 0.61
VTT - 0.61
1/4th of Bourns Part Number CAT16-LV4F12
1/4th of Bourns Part Number CAT16-PT4F4
VCCO = 2.5V
165 140 165
Z0 = 50 100
VCCO = 2.5V
Z0 = 50
ds312-3_07_102105
Figure 72: External Termination Resistors for BLVDS I/Os
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Switching Characteristics
All Spartan-3E FPGAs ship in two speed grades: -4 and the higher performance -5. Switching characteristics in this document may be designated as Advance, Preliminary, or Production, as shown in Table 83. Each category is defined as follows: Advance: These specifications are based on simulations only and are typically available soon after establishing FPGA specifications. Although speed grades with this designation are considered relatively stable and conservative, some under-reporting might still occur. Preliminary: These specifications are based on complete early silicon characterization. Devices and speed grades with this designation are intended to give a better indication of the expected performance of production silicon. The probability of under-reporting preliminary delays is greatly reduced compared to Advance data. Production: These specifications are approved once enough production silicon of a particular device family member has been characterized to provide full correlation between speed files and devices over numerous production lots. There is no under-reporting of delays, and customers receive formal notification of any subsequent changes. Typically, the slowest speed grades transition to Production before faster speed grades. To create a Xilinx MySupport user account and sign up for automatic E-mail notification whenever this data sheet is updated: * Sign Up for Alerts on Xilinx MySupport
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Timing parameters and their representative values are selected for inclusion below either because they are important as general design requirements or they indicate fundamental device performance characteristics. The Spartan-3E speed files (v1.26), part of the Xilinx Development Software, are the original source for many but not all of the values. The speed grade designations for these files are shown in Table 83. For more complete, more precise, and worst-case data, use the values reported by the Xilinx static timing analyzer (TRACE in the Xilinx development software) and back-annotated to the simulation netlist. Table 83: Spartan-3E v1.26 Speed Grade Designations
Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Advance Preliminary Production
-0, -4, -5 -0, -4, -5 -0, -4, -5 -0, -4, -5 -0, -4, -5
Software Version Requirements
Production-quality systems must use FPGA designs compiled using a speed file designated as PRODUCTION status. FPGAs designs using a less mature speed file designation should only be used during system prototyping or pre-production qualification. FPGA designs with speed files designated as Preview, Advance, or Preliminary should not be used in a production-quality system. Whenever a speed file designation changes, as a device matures toward Production status, rerun the latest Xilinx ISE software on the FPGA design to ensure that the FPGA design incorporates the latest timing information and software updates. Production designs require the Xilinx ISE 8.1i, Service Pack 3 or later development software and the v1.21 or later speed files, indicated in Table 83. All parameter limits are representative of worst-case supply voltage and junction temperature conditions. Unless otherwise noted, the published parameter values apply to all SpartanTM-3E devices. AC and DC characteristics are specified using the same numbers for both commercial and industrial grades. Some specifications list different values for one or more device Steppings, indicated by the device top marking.
Table 84 provides the history of the Spartan-3E speed files since all devices reached Production status. Table 84: Spartan-3E Speed File Version History Version 1.26 1.25 ISE Release 8.2.02i 8.2.01i Description Added -0 speed grade, which includes minimum values. Added XA Automotive devices to speed file. Improved model for left and right DCMs. Updated input setup/hold values based on default IFD_DELAY_VALUE settings. All Spartan-3E FPGAs and all speed grades elevated to Production status.
1.23
8.2i
1.21
8.1.03i
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DC and Switching Characteristics
I/O Timing
Table 85: Pin-to-Pin Clock-to-Output Times for the IOB Output Path Speed Grade -0 Symbol Description Conditions Device
Abs. Min.
-5 Max
-4 Max Units
Clock-to-Output Times TICKOFDCM When reading from the Output Flip-Flop (OFF), the time from the active transition on the Global Clock pin to data appearing at the Output pin. The DCM is iuses. When reading from OFF, the time from the active transition on the Global Clock pin to data appearing at the Output pin. The DCM is not used. LVCMOS25(2), 12mA output drive, Fast slew rate, with DCM(3)
XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
0.92 1.14 1.14 1.15 1.14 1.96 1.79 1.82 1.96 2.0
2.66 3.00 3.01 3.01 3.00 5.60 4.91 4.98 5.36 5.45
2.79 3.45 3.46 3.46 3.45 5.92 5.43 5.51 5.94 6.05
ns ns ns ns ns ns ns ns ns ns
TICKOF
LVCMOS25(2), 12mA output drive, Fast slew rate, without DCM
XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
Notes:
1. 2. 3. The numbers in this table are tested using the methodology presented in Table 94 and are based on the operating conditions set forth in Table 76 and Table 79. This clock-to-output time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or a standard other than LVCMOS25 with 12 mA drive and Fast slew rate is assigned to the data Output. If the former is true, add the appropriate Input adjustment from Table 90. If the latter is true, add the appropriate Output adjustment from Table 93. DCM output jitter is included in all measurements.
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DC and Switching Characteristics Table 86: Pin-to-Pin Setup and Hold Times for the IOB Input Path (System Synchronous)
Speed Grade Symbol Setup Times TPSDCM When writing to the Input Flip-Flop (IFF), the time from the setup of data at the Input pin to the active transition at a Global Clock pin. The DCM is used. No Input Delay is programmed. When writing to IFF, the time from the setup of data at the Input pin to an active transition at the Global Clock pin. The DCM is not used. The Input Delay is programmed. LVCMOS25(2), IFD_DELAY_VALUE = 0, with DCM(4) Description Conditions
IFD_ DELAY_ VALUE=
-5 Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Min 2.65 2.25 2.25 2.25 2.25 2.24 3.19 3.91 2.57 3.20
-4 Min 2.98 2.59 2.59 2.58 2.59 2.31 3.33 4.61 3.28 3.56 Units ns ns ns ns ns ns ns ns ns ns
0
TPSFD
LVCMOS25(2), IFD_DELAY_VALUE = default software setting
2 3 3 3 3
XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
Hold Times TPHDCM When writing to IFF, the time from the active transition at the Global Clock pin to the point when data must be held at the Input pin. The DCM is used. No Input Delay is programmed. When writing to IFF, the time from the active transition at the Global Clock pin to the point when data must be held at the Input pin. The DCM is not used. The Input Delay is programmed. LVCMOS25(3), IFD_DELAY_VALUE = 0, with DCM(4)
0
XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
-0.54 0.06 0.07 0.07 0.06 0.00 -0.50 -0.77 0.32 -0.15
-0.52 0.14 0.14 0.15 0.14 0.07 -0.49 -0.75 0.37 -0.11
ns ns ns ns ns ns ns ns ns ns
TPHFD
LVCMOS25(3), IFD_DELAY_VALUE = default software setting
2 3 3 3 3
XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E
Notes:
1. 2. 3. The numbers in this table are tested using the methodology presented in Table 94 and are based on the operating conditions set forth in Table 76 and Table 79. This setup time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or the data Input. If this is true of the Global Clock Input, subtract the appropriate adjustment from Table 90. If this is true of the data Input, add the appropriate Input adjustment from the same table. This hold time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or the data Input. If this is true of the Global Clock Input, add the appropriate Input adjustment from Table 90. If this is true of the data Input, subtract the appropriate Input adjustment from the same table. When the hold time is negative, it is possible to change the data before the clock's active edge. DCM output jitter is included in all measurements.
4.
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DC and Switching Characteristics Table 87: Setup and Hold Times for the IOB Input Path
Speed Grade
IFD_ DELAY_ VALUE=
-5 Device Min
-4 Min Units
Symbol Setup Times TIOPICK
Description
Conditions LVCMOS25(2), IFD_DELAY_VALUE = 0
Time from the setup of data at the Input pin to the active transition at the ICLK input of the Input Flip-Flop (IFF). No Input Delay is programmed. Time from the setup of data at the Input pin to the active transition at the IFF's ICLK input. The Input Delay is programmed.
0
All
1.84
2.12
ns
TIOPICKD
LVCMOS25(2), IFD_DELAY_VALUE = default software setting
2 3
XC3S100E All Others
6.12 6.76
7.01 7.72
ns
Hold Times TIOICKP Time from the active transition at the IFF's ICLK input to the point where data must be held at the Input pin. No Input Delay is programmed. Time from the active transition at the IFF's ICLK input to the point where data must be held at the Input pin. The Input Delay is programmed. LVCMOS25(2), IFD_DELAY_VALUE = 0
0
All
-0.76
-0.76
ns
TIOICKPD
LVCMOS25(2), IFD_DELAY_VALUE = default software setting
2 3
XC3S100E All Others
-3.74 -4.32
-3.74 -4.32
ns
Set/Reset Pulse Width TRPW_IOB Notes:
1. 2. 3. The numbers in this table are tested using the methodology presented in Table 94 and are based on the operating conditions set forth in Table 76 and Table 79. This setup time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the data Input. If this is true, add the appropriate Input adjustment from Table 90. These hold times require adjustment whenever a signal standard other than LVCMOS25 is assigned to the data Input. If this is true, subtract the appropriate Input adjustment from Table 90. When the hold time is negative, it is possible to change the data before the clock's active edge.
Minimum pulse width to SR control input on IOB
All
1.00
1.15
ns
Table 88: Sample Window (Source Synchronous) Symbol TSAMP Description Setup and hold capture window of an IOB input flip-flop. Max The input capture sample window value is highly specific to a particular application, device, package, I/O standard, I/O placement, DCM usage, and clock buffer. Please consult the appropriate Xilinx application note for application-specific values. * XAPP485: 1:7 Deserialization in Spartan-3E FPGAs at Speeds Up to 666 Mbps www.xilinx.com/bvdocs/appnotes/xapp485.pdf Units ps
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DC and Switching Characteristics Table 89: Propagation Times for the IOB Input Path Speed Grade
IFD_ DELAY_ VALUE=
-5 Device Max
-4 Max Units
Symbol
Description
Conditions
Propagation Times TIOPLI The time it takes for data to travel from the Input pin through the IFF latch to the I output with no input delay programmed The time it takes for data to travel from the Input pin through the IFF latch to the I output with the input delay programmed LVCMOS25(2),
IFD_DELAY_VALUE = 0
0
All
1.96
2.25
ns
TIOPLID
LVCMOS25(2),
IFD_DELAY_VALUE = default software setting
2 3
XC3S100E All Others
5.40 6.30
5.97 7.20
ns
Notes:
1. 2. The numbers in this table are tested using the methodology presented in Table 94 and are based on the operating conditions set forth in Table 76 and Table 79. This propagation time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the data Input. When this is true, add the appropriate Input adjustment from Table 90.
Table 90: Input Timing Adjustments by IOSTANDARD Convert Input Time from LVCMOS25 to the Following Signal Standard (IOSTANDARD) Single-Ended Standards LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12 PCI33_3 PCI66_3 PCIX HSTL_I_18 HSTL_III_18 SSTL18_I SSTL2_I 0.42 0.42 0 0.96 0.62 0.26 0.41 0.41 0.22 0.12 0.17 0.30 0.15 0.43 0.43 0 0.98 0.63 0.27 0.42 0.42 0.22 0.12 0.17 0.30 0.15 ns ns ns ns ns ns ns ns ns ns ns ns Add the Adjustment Below Speed Grade -5 -4 Units
Table 90: Input Timing Adjustments by IOSTANDARD Convert Input Time from LVCMOS25 to the Following Signal Standard (IOSTANDARD) Differential Standards LVDS_25 BLVDS_25 MINI_LVDS_25 LVPECL_25 RSDS_25 DIFF_HSTL_I_18 DIFF_HSTL_III_18 DIFF_SSTL18_I DIFF_SSTL2_I Notes:
1. 2. The numbers in this table are tested using the methodology presented in Table 94 and are based on the operating conditions set forth in Table 76, Table 79, and Table 81. These adjustments are used to convert input path times originally specified for the LVCMOS25 standard to times that correspond to other signal standards.
Add the Adjustment Below Speed Grade -5 -4 Units
0.48 0.39 0.48 0.27 0.48 0.48 0.48 0.30 0.32
0.49 0.39 0.49 0.27 0.49 0.49 0.49 0.30 0.32
ns ns ns ns ns ns ns ns ns
ns
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DC and Switching Characteristics Table 91: Timing for the IOB Output Path Speed Grade -0 Symbol Clock-to-Output Times TIOCKP When reading from the Output Flip-Flop (OFF), the time from the active transition at the OCLK input to data appearing at the Output pin LVCMOS25(2), 12 mA output drive, Fast slew rate All 0.88 2.18 2.50 ns Description Conditions Device
Abs. Min.
-5 Max
-4 Max Units
Propagation Times TIOOP The time it takes for data to travel from the IOB's O input to the Output pin The time it takes for data to travel from the O input through the OFF latch to the Output pin LVCMOS25(2), 12 mA output drive, Fast slew rate All 0.90 2.24 2.58 ns
TIOOLP
0.94
2.32
2.67
ns
Set/Reset Times TIOSRP Time from asserting the OFF's SR input to setting/resetting data at the Output pin Time from asserting the Global Set Reset (GSR) input on the STARTUP_SPARTAN3E primitive to setting/resetting data at the Output pin LVCMOS25(2), 12 mA output drive, Fast slew rate All 1.32 3.27 3.76 ns
TIOGSRQ
3.38
8.40
9.65
ns
Notes:
1. 2. The numbers in this table are tested using the methodology presented in Table 94 and are based on the operating conditions set forth in Table 76 and Table 79. This time requires adjustment whenever a signal standard other than LVCMOS25 with 12 mA drive and Fast slew rate is assigned to the data Output. When this is true, add the appropriate Output adjustment from Table 93.
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DC and Switching Characteristics Table 92: Timing for the IOB Three-State Path Speed Grade -0 Symbol Description Conditions Device
Abs. Max.
-5 Max
-4 Max Units
Synchronous Output Enable/Disable Times TIOCKHZ Time from the active transition at the OTCLK input of the Three-state Flip-Flop (TFF) to when the Output pin enters the high-impedance state Time from the active transition at TFF's OTCLK input to when the Output pin drives valid data LVCMOS25, 12 mA output drive, Fast slew rate All 0.60 1.49 1.71 ns
TIOCKON(2)
All
1.09
2.70
3.10
ns
Asynchronous Output Enable/Disable Times TGTS Time from asserting the Global Three State (GTS) input on the STARTUP_SPARTAN3E primitive to when the Output pin enters the high-impedance state LVCMOS25, 12 mA output drive, Fast slew rate All 3.43 8.52 9.79 ns
Set/Reset Times TIOSRHZ Time from asserting TFF's SR input to when the Output pin enters a high-impedance state Time from asserting TFF's SR input at TFF to when the Output pin drives valid data LVCMOS25, 12 mA output drive, Fast slew rate All 0.85 2.11 2.43 ns
TIOSRON(2)
All
1.34
3.32
3.82
ns
Notes:
1. 2. The numbers in this table are tested using the methodology presented in Table 94 and are based on the operating conditions set forth in Table 76 and Table 79. This time requires adjustment whenever a signal standard other than LVCMOS25 with 12 mA drive and Fast slew rate is assigned to the data Output. When this is true, add the appropriate Output adjustment from Table 93.
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DC and Switching Characteristics Table 93: Output Timing Adjustments for IOB
Convert Output Time from LVCMOS25 with 12mA Drive and Fast Slew Rate to the Following Signal Standard (IOSTANDARD) Single-Ended Standards LVTTL Slow 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA Fast 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA LVCMOS33 Slow 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA Fast 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA LVCMOS25 Slow 2 mA 4 mA 6 mA 8 mA 12 mA Fast 2 mA 4 mA 6 mA 8 mA 12 mA 5.20 2.32 1.83 0.64 0.68 0.41 4.80 1.88 1.39 0.32 0.28 0.28 5.08 1.82 1.00 0.66 0.40 0.41 4.68 1.46 0.38 0.33 0.28 0.28 4.04 2.17 1.46 1.04 0.65 3.53 1.65 0.44 0.20 0 5.41 2.41 1.90 0.67 0.70 0.43 5.00 1.96 1.45 0.34 0.30 0.30 5.29 1.89 1.04 0.69 0.42 0.43 4.87 1.52 0.39 0.34 0.30 0.30 4.21 2.26 1.52 1.08 0.68 3.67 1.72 0.46 0.21 0 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns HSTL_I_18 HSTL_III_18 PCI33_3 PCI66_3 PCIX SSTL18_I SSTL2_I Differential Standards LVDS_25 BLVDS_25 MINI_LVDS_25 LVPECL_25 RSDS_25 DIFF_HSTL_I_18 DIFF_HSTL_III_18 DIFF_SSTL18_I DIFF_SSTL2_I Notes:
1. 2. The numbers in this table are tested using the methodology presented in Table 94 and are based on the operating conditions set forth in Table 76, Table 79, and Table 81. These adjustments are used to convert output- and three-state-path times originally specified for the LVCMOS25 standard with 12 mA drive and Fast slew rate to times that correspond to other signal standards. Do not adjust times that measure when outputs go into a high-impedance state.
Table 93: Output Timing Adjustments for IOB (Continued)
Convert Output Time from LVCMOS25 with 12mA Drive and Fast Slew Rate to the Following Signal Standard (IOSTANDARD) LVCMOS18 Slow 2 mA 4 mA 6 mA 8 mA Fast 2 mA 4 mA 6 mA 8 mA LVCMOS15 Slow 2 mA 4 mA 6 mA Fast 2 mA 4 mA 6 mA LVCMOS12 Slow Fast 2 mA 2 mA Add the Adjustment Below Speed Grade -5 5.03 3.08 2.39 1.83 3.98 2.04 1.09 0.72 4.49 3.81 2.99 3.25 2.59 1.47 6.36 4.26 0.33 0.53 0.44 0.44 0.82 0.24 -0.20 -0.55 0.04 -0.56 -0.48 0.42 0.53 0.40 0.44 -4 5.24 3.21 2.49 1.90 4.15 2.13 1.14 0.75 4.68 3.97 3.11 3.38 2.70 1.53 6.63 4.44 0.34 0.55 0.46 0.46 0.85 0.25 -0.20 -0.55 0.04 -0.56 -0.48 0.42 0.55 0.40 0.44 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Add the Adjustment Below Speed Grade -5 -4 Units
Input Only
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DC and Switching Characteristics
Timing Measurement Methodology
When measuring timing parameters at the programmable I/Os, different signal standards call for different test conditions. Table 94 lists the conditions to use for each standard. The method for measuring Input timing is as follows: A signal that swings between a Low logic level of VL and a High logic level of VH is applied to the Input under test. Some standards also require the application of a bias voltage to the VREF pins of a given bank to properly set the input-switching threshold. The measurement point of the Input signal (VM) is commonly located halfway between VL and VH. The Output test setup is shown in Figure 73. A termination voltage VT is applied to the termination resistor RT, the other end of which is connected to the Output. For each standard, RT and VT generally take on the standard values recommended for minimizing signal reflections. If the standard does not ordinarily use terminations (e.g., LVCMOS, LVTTL), then RT is set to 1M to indicate an open connecTable 94: Test Methods for Timing Measurement at I/Os
Signal Standard (IOSTANDARD) Single-Ended LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12 PCI33_3 Rising Falling PCI66_3 Rising Falling PCIX Rising Falling HSTL_I_18 HSTL_III_18 SSTL18_I SSTL2_I Differential LVDS_25 BLVDS_25 MINI_LVDS_25 LVPECL_25 RSDS_25 VICM - 0.125 VICM - 0.125 VICM - 0.125 VICM - 0.3 VICM - 0.1 VICM + 0.125 VICM + 0.125 VICM + 0.125 VICM + 0.3 VICM + 0.1 50 1M 50 1M 50 1.2 0 1.2 0 1.2 VICM VICM VICM VICM VICM 0.9 1.1 0.9 1.25 VREF - 0.5 VREF - 0.5 VREF - 0.5 VREF - 0.75 VREF + 0.5 VREF + 0.5 VREF + 0.5 VREF + 0.75 Note 3 Note 3 Note 3 Note 3 0 0 0 0 0 0 Note 3 3.3 3.3 2.5 1.8 1.5 1.2 Note 3 1M 1M 1M 1M 1M 1M 25 25 25 25 25 25 50 50 50 50 0 0 0 0 0 0 0 3.3 0 3.3 0 3.3 0.9 1.8 0.9 1.25 1.4 1.65 1.25 0.9 0.75 0.6 0.94 2.03 0.94 2.03 0.94 2.03 VREF VREF VREF VREF Inputs VREF (V) VL (V) VH (V) RT () Outputs VT (V) Inputs and Outputs VM (V)
tion, and VT is set to zero. The same measurement point (VM) that was used at the Input is also used at the Output.
VT (VREF) FPGA Output RT (RREF) VM (VMEAS) CL (CREF)
ds312-3_04_090105
Notes:
1. The names shown in parentheses are used in the IBIS file.
Figure 73: Output Test Setup
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DC and Switching Characteristics Table 94: Test Methods for Timing Measurement at I/Os (Continued)
Signal Standard (IOSTANDARD) DIFF_HSTL_I_18 DIFF_HSTL_III_18 DIFF_SSTL18_I DIFF_SSTL2_I Notes:
1. Descriptions of the relevant symbols are as follows: VREF - The reference voltage for setting the input switching threshold VICM - The common mode input voltage VM - Voltage of measurement point on signal transition VL - Low-level test voltage at Input pin VH - High-level test voltage at Input pin RT - Effective termination resistance, which takes on a value of 1M when no parallel termination is required VT - Termination voltage The load capacitance (CL) at the Output pin is 0 pF for all signal standards. According to the PCI specification.
Inputs VREF (V) 0.9 1.1 0.9 1.25 VL (V) VREF - 0.5 VREF - 0.5 VREF - 0.5 VREF - 0.5 VH (V) VREF + 0.5 VREF + 0.5 VREF + 0.5 VREF + 0.5 RT () 50 50 50 50
Outputs VT (V) 0.9 1.8 0.9 1.25
Inputs and Outputs VM (V) VREF VREF VREF VREF
2. 3.
The capacitive load (CL) is connected between the output and GND. The Output timing for all standards, as published in the speed files and the data sheet, is always based on a CL value of zero. High-impedance probes (less than 1 pF) are used for all measurements. Any delay that the test fixture might contribute to test measurements is subtracted from those measurements to produce the final timing numbers as published in the speed files and data sheet.
Delays for a given application are simulated according to its specific load conditions as follows: 1. Simulate the desired signal standard with the output driver connected to the test setup shown in Figure 73. Use parameter values VT, RT, and VM from Table 94. CREF is zero. 2. Record the time to VM. 3. Simulate the same signal standard with the output driver connected to the PCB trace with load. Use the appropriate IBIS model (including VREF, RREF, CREF, and VMEAS values) or capacitive value to represent the load. 4. Record the time to VMEAS. 5. Compare the results of steps 2 and 4. Add (or subtract) the increase (or decrease) in delay to (or from) the appropriate Output standard adjustment (Table 93) to yield the worst-case delay of the PCB trace.
Using IBIS Models to Simulate Load Conditions in Application
IBIS models permit the most accurate prediction of timing delays for a given application. The parameters found in the IBIS model (VREF, RREF, and VMEAS) correspond directly with the parameters used in Table 94 (VT, RT, and VM). Do not confuse VREF (the termination voltage) from the IBIS model with VREF (the input-switching threshold) from the table. A fourth parameter, CREF, is always zero. The four parameters describe all relevant output test conditions. IBIS models are found in the Xilinx development software as well as at the following link: http://www.xilinx.com/xlnx/xil_sw_updates_home.jsp
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DC and Switching Characteristics
Simultaneously Switching Output Guidelines
This section provides guidelines for the recommended maximum allowable number of Simultaneous Switching Outputs (SSOs). These guidelines describe the maximum number of user I/O pins of a given output signal standard that should simultaneously switch in the same direction, while maintaining a safe level of switching noise. Meeting these guidelines for the stated test conditions ensures that the FPGA operates free from the adverse effects of ground and power bounce. Ground or power bounce occurs when a large number of outputs simultaneously switch in the same direction. The output drive transistors all conduct current to a common voltage rail. Low-to-High transitions conduct to the VCCO rail; High-to-Low transitions conduct to the GND rail. The resulting cumulative current transient induces a voltage difference across the inductance that exists between the die pad and the power supply or ground return. The inductance is associated with bonding wires, the package lead frame, and any other signal routing inside the package. Other variables contribute to SSO noise levels, including stray inductance on the PCB as well as capacitive loading at receivers. Any SSO-induced voltage consequently affects internal switching noise margins and ultimately signal quality. Table 95 and Table 96 provide the essential SSO guidelines. For each device/package combination, Table 95 proTable 95: Equivalent VCCO/GND Pairs per Bank Package Style (including Pb-free) Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E VQ100 2 2 CP132 2 2 2 TQ144 2 2 PQ208 3 3 FT256 4 4 4 FG320 5 5 5 FG400 6 6 FG484 7 vides the number of equivalent VCCO/GND pairs. For each output signal standard and drive strength, Table 96 recommends the maximum number of SSOs, switching in the same direction, allowed per VCCO/GND pair within an I/O bank. The guidelines in Table 96 are categorized by package style. Multiply the appropriate numbers from Table 95 and Table 96 to calculate the maximum number of SSOs allowed within an I/O bank. Exceeding these SSO guidelines might result in increased power or ground bounce, degraded signal integrity, or increased system jitter. SSOMAX/IO Bank = Table 95 x Table 96 The recommended maximum SSO values assumes that the FPGA is soldered on the printed circuit board and that the board uses sound design practices. The SSO values do not apply for FPGAs mounted in sockets, due to the lead inductance introduced by the socket. The number of SSOs allowed for quad-flat packages (VQ, TQ, PQ) is lower than for ball grid array packages (FG) due to the larger lead inductance of the quad-flat packages. The results for chip-scale packaging (CP132) are better than quad-flat packaging but not as high as for ball grid array packaging. Ball grid array packages are recommended for applications with a large number of simultaneously switching outputs.
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DC and Switching Characteristics Table 96: Recommended Number of Simultaneously Switching Outputs per VCCO-GND Pair
Package Type FT256, FG320, FG400, FG484 60 41 29 22 13 11 34 20 15 12 10 9 76 46 27 20 13 10 44 26 16 12 10 8 76 46 33 24 18 42 20 15 13 11 64 34 22 18 36 21 13 10 PCI33_3 PCI66_3 PCIX HSTL_I_18 HSTL_III_18 SSTL18_I SSTL2_I LVCMOS12 Slow Fast Fast
Table 96: Recommended Number of Simultaneously Switching Outputs per VCCO-GND Pair (Continued)
Package Type FT256, FG320, FG400, FG484 55 31 18 25 16 13 55 31 16 13 11 17 16 15 18
Signal Standard (IOSTANDARD) Single-Ended Standards LVTTL Slow 2 4 6 8 12 16 Fast 2 4 6 8 12 16 LVCMOS33 Slow 2 4 6 8 12 16 Fast 2 4 6 8 12 16 LVCMOS25 Slow 2 4 6 8 12 Fast 2 4 6 8 12 LVCMOS18 Slow 2 4 6 8 Fast 2 4 6 8
VQ 100 34 17 17 8 8 5 17 9 7 6 5 5 34 17 17 8 8 5 17 8 8 6 5 8 28 13 13 6 6 17 9 9 6 5 19 13 6 6 13 8 4 4
TQ 144 20 10 10 6 6 5 17 9 7 6 5 5 20 10 10 6 6 5 17 8 6 6 5 8 16 10 7 6 6 16 9 7 6 5 11 7 5 4 8 5 4 4
PQ 208 19 10 7 6 5 5 17 9 7 6 5 5 20 10 7 6 5 5 17 8 6 6 5 5 16 10 7 6 6 16 9 7 6 5 8 6 5 4 8 5 4 4
CP 132 52 26 26 13 13 6 26 13 13 6 6 5 52 26 26 13 13 6 26 13 13 6 6 5 42 19 19 9 9 26 13 13 6 6 29 19 9 9 19 13 6 6
Signal Standard (IOSTANDARD) LVCMOS15 Slow 2 4 6 2 4 6 2 2
VQ 100 16 8 6 9 7 5 17 10 8 8 7 10 10 9 12
TQ 144 10 7 5 9 7 5 11 10 8 8 7 10 10 9 12
PQ 208 10 7 5 9 7 5 11 10 8 8 7 10 10 9 12
CP 132 19 9 9 13 7 5 16 10 16 13 11 16 16 15 18
Differential Standards (Number of I/O Pairs or Channels) LVDS_25 BLVDS_25 MINI_LVDS_25 LVPECL_25 RSDS_25 DIFF_HSTL_I_18 DIFF_HSTL_IIII_18 DIFF_SSTL18_I DIFF_SSTL2_I 6 5 5 4 6 6 5 5 4 6 6 4 6 6 4 6 6 4 6 Input Only 6 5 5 4 6 12 8 8 7 9 20 8 8 7 8 12 4 12 20 4 20
Notes: 1. The numbers in this table are recommendations that assume sound board layout practice. This table assumes the following parasitic factors: combined PCB trace and land inductance per VCCO and GND pin of 1.0 nH, receiver capacitive load of 15 pF. Test limits are the VIL/VIH voltage limits for the respective I/O standard. 2. The PQ208 results are based on physical measurements of a PQ208 package soldered to a typical printed circuit board. All other results are based on worst-case simulation and an interpolation of the PQ208 physical results. 3. If more than one signal standard is assigned to the I/Os of a given bank, refer to XAPP689: Managing Ground Bounce in Large FPGAs for information on how to perform weighted average SSO calculations.
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DC and Switching Characteristics
Configurable Logic Block (CLB) Timing
Table 97: CLB (SLICEM) Timing Speed Grade -5 Symbol Clock-to-Output Times TCKO When reading from the FFX (FFY) Flip-Flop, the time from the active transition at the CLK input to data appearing at the XQ (YQ) output 0.52 0.60 ns Description Min Max Min -4 Max Units
Setup Times TAS Time from the setup of data at the F or G input to the active transition at the CLK input of the CLB Time from the setup of data at the BX or BY input to the active transition at the CLK input of the CLB 0.46 0.52 ns
TDICK
0.32
-
0.36
-
ns
Hold Times TAH Time from the active transition at the CLK input to the point where data is last held at the F or G input Time from the active transition at the CLK input to the point where data is last held at the BX or BY input 0 0 ns
TCKDI
0
-
0
-
ns
Clock Timing TCH TCL FTOG The High pulse width of the CLB's CLK signal The Low pulse width of the CLK signal Toggle frequency (for export control) 0.70 0.70 0 657 0.80 0.80 0 572 ns ns MHz
Propagation Times TILO The time it takes for data to travel from the CLB's F (G) input to the X (Y) output 0.66 0.76 ns
Set/Reset Pulse Width TRPW_CLB
Notes:
1. The numbers in this table are based on the operating conditions set forth in Table 76.
The minimum allowable pulse width, High or Low, to the CLB's SR input
1.00
-
1.15
-
ns
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DC and Switching Characteristics Table 98: CLB Distributed RAM Switching Characteristics -5 Symbol Clock-to-Output Times TSHCKO Setup Times TDS TAS TWS Hold Times TDH TAH, TWH Hold time of the BX, BY data inputs after the active transition at the CLK input of the distributed RAM Hold time of the F/G address inputs or the write enable input after the active transition at the CLK input of the distributed RAM 0.13 0.15 ns Setup time of data at the BX or BY input before the active transition at the CLK input of the distributed RAM Setup time of the F/G address inputs before the active transition at the CLK input of the distributed RAM Setup time of the write enable input before the active transition at the CLK input of the distributed RAM 0.40 0.46 0.34 0.46 0.52 0.40 ns ns ns Time from the active edge at the CLK input to data appearing on the distributed RAM output 2.05 2.35 ns Description Min Max Min -4 Max Units
0
-
0
-
ns
Clock Pulse Width TWPH, TWPL Minimum High or Low pulse width at CLK input 0.88 1.01 ns
Table 99: CLB Shift Register Switching Characteristics -5 Symbol Clock-to-Output Times TREG Setup Times TSRLDS Hold Times TSRLDH Hold time of the BX or BY data input after the active transition at the CLK input of the shift register 0.14 0.16 ns Setup time of data at the BX or BY input before the active transition at the CLK input of the shift register 0.41 0.46 ns Time from the active edge at the CLK input to data appearing on the shift register output 3.62 4.16 ns Description Min Max Min -4 Max Units
Clock Pulse Width TWPH, TWPL Minimum High or Low pulse width at CLK input 0.88 1.01 ns
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Clock Buffer/Multiplexer Switching Characteristics
Table 100: Clock Distribution Switching Characteristics Minimum Maximum
Speed Grade Description Global clock buffer (BUFG, BUFGMUX, BUFGCE) I input to O-output delay Global clock multiplexer (BUFGMUX) select S-input setup to I0 and I1 inputs. Same as BUFGCE enable CE-input Frequency of signals distributed on global buffers (all sides) Symbol TGIO TGSI FBUFG -0 0 -5 1.46 0.55 333 -4 1.46 0.63 311 Units ns ns MHz
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DC and Switching Characteristics
18 x 18 Embedded Multiplier Timing
Table 101: 18 x 18 Embedded Multiplier Timing Speed Grade -5 Symbol Combinatorial Delay TMULT Combinatorial multiplier propagation delay from the A and B inputs to the P outputs, assuming 18-bit inputs and a 36-bit product (AREG, BREG, and PREG registers unused) 4.34(1) 4.88(1) ns Description Min Max Min -4 Max Units
Clock-to-Output Times TMSCKP_P Clock-to-output delay from the active transition of the CLK input to valid data appearing on the P outputs when using the PREG register(2) Clock-to-output delay from the active transition of the CLK input to valid data appearing on the P outputs when using either the AREG or BREG register(2,4) 0.98 1.10 ns
TMSCKP_A TMSCKP_B Setup Times TMSDCK_P
-
4.42
-
4.97
ns
Data setup time at the A or B input before the active transition at the CLK when using only the PREG output register (AREG, BREG registers unused) Data setup time at the A input before the active transition at the CLK when using the AREG input register(4) Data setup time at the B input before the active transition at the CLK when using the BREG input register(4)
3.54
-
3.98
-
ns
TMSDCK_A TMSDCK_B Hold Times TMULCKID
0.20 0.35
-
0.23 0.39
-
ns ns
Data hold time at the A and B inputs after the active transition at the CLK input
0
-
0
-
ns
Clock Frequency FMULT Internal operating frequency for a two-stage 18x18 multiplier using the AREG and BREG input registers and the PREG output register(1) 0 270 0 240 MHz
Notes:
1. 2. 3. 4. Combinatorial delay is less and pipelined performance is higher when multiplying input data with less than 18 bits. The PREG register is typically used in both single-stage and two-stage pipelined multiplier implementations. The PREG register is typically used when inferring a single-stage multiplier. Input registers AREG or BREG are typically used when inferring a two-stage multiplier.
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Block RAM Timing
Table 102: Block RAM Timing Speed Grade -5 Symbol Clock-to-Output Times TBCKO When reading from block RAM, the delay from the active transition at the CLK input to data appearing at the DOUT output 2.45 2.82 ns Description Min Max Min -4 Max Units
Setup Times TBACK TBDCK TBECK TBWCK Hold Times TBCKA TBCKD TBCKE TBCKW Hold time on the ADDR inputs after the active transition at the CLK input Hold time on the DIN inputs after the active transition at the CLK input Hold time on the EN input after the active transition at the CLK input Hold time on the WE input after the active transition at the CLK input 0.12 0.12 0 0 0.14 0.13 0 0 ns ns ns ns Setup time for the ADDR inputs before the active transition at the CLK input of the block RAM Setup time for data at the DIN inputs before the active transition at the CLK input of the block RAM Setup time for the EN input before the active transition at the CLK input of the block RAM Setup time for the WE input before the active transition at the CLK input of the block RAM 0.33 0.23 0.67 1.09 0.38 0.23 0.77 1.26 ns ns ns ns
Clock Timing TBPWH TBPWL High pulse width of the CLK signal Low pulse width of the CLK signal 1.39 1.39 1.59 1.59 ns ns
Clock Frequency FBRAM Block RAM clock frequency. RAM read output value written back into RAM, for shift-registers and circular buffers. Write-only or read-only performance is faster. 0 270 0 230 MHz
Notes:
1. The numbers in this table are based on the operating conditions set forth in Table 76.
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DC and Switching Characteristics
Digital Clock Manager (DCM) Timing
For specification purposes, the DCM consists of three key components: the Delay-Locked Loop (DLL), the Digital Frequency Synthesizer (DFS), and the Phase Shifter (PS). Aspects of DLL operation play a role in all DCM applications. All such applications inevitably use the CLKIN and the CLKFB inputs connected to either the CLK0 or the CLK2X feedback, respectively. Thus, specifications in the DLL tables (Table 103 and Table 104) apply to any application that only employs the DLL component. When the DFS and/or the PS components are used together with the DLL, then the specifications listed in the DFS and PS tables (Table 105 through Table 108) supersede any corresponding ones in the DLL tables. DLL specifications that do not change with the addition of DFS or PS functions are presented in Table 103 and Table 104. Period jitter and cycle-cycle jitter are two of many different ways of specifying clock jitter. Both specifications describe statistical variation from a mean value. Period jitter is the worst-case deviation from the ideal clock period over a collection of millions of samples. In a histogram of period jitter, the mean value is the clock period. Cycle-cycle jitter is the worst-case difference in clock period between adjacent clock cycles in the collection of clock periods sampled. In a histogram of cycle-cycle jitter, the mean value is zero.
Delay-Locked Loop (DLL)
Table 103: Recommended Operating Conditions for the DLL
Speed Grade -5 Symbol Input Frequency Ranges FCLKIN CLKIN_FREQ_DLL Frequency of the CLKIN clock input Stepping 0 XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E(3) Stepping 1 Input Pulse Requirements CLKIN_PULSE CLKIN pulse width as a percentage of the CLKIN period FCLKIN < 150 MHz FCLKIN > 150 MHz 40% 45% 60% 55% 40% 45% 60% 55% All 5(2) 90(3) 5(2) 90(3) MHz Description Min Max Min -4 Max Units
200(3) 275(3)
200(3) 240(3)
MHz MHz
Input Clock Jitter Tolerance and Delay Path Variation(4) CLKIN_CYC_JITT_DLL_LF CLKIN_CYC_JITT_DLL_HF CLKIN_PER_JITT_DLL CLKFB_DELAY_VAR_EXT Notes:
1. 2. 3. 4. DLL specifications apply when any of the DLL outputs (CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, or CLKDV) are in use. The DFS, when operating independently of the DLL, supports lower FCLKIN frequencies. See Table 105. To support double the maximum effective FCLKIN limit, set the CLKIN_DIVIDE_BY_2 attribute to TRUE. This attribute divides the incoming clock period by two as it enters the DCM. The CLK2X output reproduces the clock frequency provided on the CLKIN input. CLKIN input jitter beyond these limits might cause the DCM to lose lock.
Cycle-to-cycle jitter at the CLKIN input Period jitter at the CLKIN input
FCLKIN < 150 MHz FCLKIN > 150 MHz
-
300 150 1 1
-
300 150 1 1
ps ps ns ns
Allowable variation of off-chip feedback delay from the DCM output to the CLKFB input
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DC and Switching Characteristics Table 104: Switching Characteristics for the DLL
Speed Grade -5 Symbol Output Frequency Ranges CLKOUT_FREQ_CLK0 Frequency for the CLK0 and CLK180 outputs Stepping 0 XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E Stepping 1 CLKOUT_FREQ_CLK90 Frequency for the CLK90 and CLK270 outputs Stepping 0 All XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E Stepping 1 CLKOUT_FREQ_2X Frequency for the CLK2X and CLK2X180 outputs Stepping 0 All XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E Stepping 1 CLKOUT_FREQ_DV Frequency for the CLKDV output Stepping 0 All XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E Stepping 1 Output Clock Jitter(2,3,4) CLKOUT_PER_JITT_0 CLKOUT_PER_JITT_90 CLKOUT_PER_JITT_180 CLKOUT_PER_JITT_270 CLKOUT_PER_JITT_2X Period jitter at the CLK0 output Period jitter at the CLK90 output Period jitter at the CLK180 output Period jitter at the CLK270 output Period jitter at the CLK2X and CLK2X180 outputs All 100 150 150 150 [1% of CLKIN period + 150] 150 [1% of CLKIN period + 200] 100 150 150 150 [1% of CLKIN period + 150] 150 [1% of CLKIN period + 200] ps ps ps ps ps All 0.3125 10 5 5 90 5 90 MHz Description Device Min Max Min -4 Max Units
200 275 90 5
200 240 90
MHz MHz MHz
167 167 180 10
167 167 180
MHz MHz MHz
333 333 60 0.3125
311 311 60
MHz MHz MHz
133 183
133 160
MHz MHz
CLKOUT_PER_JITT_DV1 CLKOUT_PER_JITT_DV2
Period jitter at the CLKDV output when performing integer division Period jitter at the CLKDV output when performing non-integer division
-
-
ps ps
Duty Cycle(4) CLKOUT_DUTY_CYCLE_DLL Duty cycle variation for the CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV outputs, including the BUFGMUX and clock tree duty-cycle distortion All [1% of CLKIN period + 400] [1% of CLKIN period + 400] ps
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DC and Switching Characteristics Table 104: Switching Characteristics for the DLL (Continued)
Speed Grade -5 Symbol Phase Alignment(4) Phase offset between the CLKIN and CLKFB inputs Phase offset between DLL outputs CLK0 to CLK2X (not CLK2X180) All 200 [1% of CLKIN period + 100] [1% of CLKIN period + 200] 200 [1% of CLKIN period + 100] [1% of CLKIN period + 200] ps ps Description Device Min Max Min -4 Max Units
CLKIN_CLKFB_PHASE CLKOUT_PHASE_DLL
All others
-
-
ps
Lock Time LOCK_DLL(3) When using the DLL alone: The time from deassertion at the DCM's Reset input to the rising transition at its LOCKED output. When the DCM is locked, the CLKIN and CLKFB signals are in phase 5 MHz < FCLKIN < 15 MHz FCLKIN > 15 MHz All 5 600 5 600 ms s
Delay Lines DCM_DELAY_STEP Finest delay resolution All 20 40 20 40 ps
Notes: 1. The numbers in this table are based on the operating conditions set forth in Table 76 and Table 103. 2. Indicates the maximum amount of output jitter that the DCM adds to the jitter on the CLKIN input. 3. For optimal jitter tolerance and faster lock time, use the CLKIN_PERIOD attribute. 4. Some jitter and duty-cycle specifications include 1% of input clock period or 0.01 UI. Example: The data sheet specifies a maximum jitter of "[1% of CLKIN period + 150]". Assume the CLKIN frequency is 100 MHz. The equivalent CLKIN period is 10 ns and 1% of 10 ns is 0.1 ns or 100 ps. According to the data sheet, the maximum jitter is [100 ps + 150 ps] = 250ps.
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Digital Frequency Synthesizer (DFS)
Table 105: Recommended Operating Conditions for the DFS
Speed Grade -5 Symbol Input Frequency Ranges(2) FCLKIN CLKIN_FREQ_FX Frequency for the CLKIN input Cycle-to-cycle jitter at the CLKIN input, based on CLKFX output frequency Period jitter at the CLKIN input FCLKFX < 150 MHz FCLKFX > 150 MHz 0.200 333 300 150 1 0.200 333 300 150 1 MHz ps ps ns Input Clock Jitter Tolerance(3) CLKIN_CYC_JITT_FX_LF CLKIN_CYC_JITT_FX_HF CLKIN_PER_JITT_FX Notes:
1. 2. 3. DFS specifications apply when either of the DFS outputs (CLKFX or CLKFX180) are used. If both DFS and DLL outputs are used on the same DCM, follow the more restrictive CLKIN_FREQ_DLL specifications in Table 103. CLKIN input jitter beyond these limits may cause the DCM to lose lock.
-4 Max Min Max Units
Description
Min
Table 106: Switching Characteristics for the DFS
Speed Grade -5 Symbol Output Frequency Ranges CLKOUT_FREQ_FX_LF CLKOUT_FREQ_FX_HF CLKOUT_FREQ_FX Output Clock Jitter(2,3) CLKOUT_PER_JITT_FX CLKOUT_PER_JITT_FX_35 (TJ35) Period jitter at the CLKFX and CLKFX180 outputs Period jitter at the CLKFX and CLKFX180 outputs when CLKFX_MULTIPLY=7, CLKFX_DIVIDE=2 All All in FG or CP packages See Note 4 below [2% of CLKFX period + 400] [2% of CLKFX period + 400] ps ps Frequency for the CLKFX and CLKFX180 outputs, low frequencies Frequency for the CLKFX and CLKFX180 outputs, high frequencies Frequency for the CLKFX and CLKFX180 outputs Stepping 0 Stepping 1 Stepping 0 XC3S100E XC3S250E XC3S500E XC3S1600E XC3S1200E All 5 220 5 90 326 307 333 5 220 5 90 307 307 311 MHz MHz MHz MHz Description Device Min Max Min -4 Max Units
Duty Cycle(4,5) CLKOUT_DUTY_CYCLE_FX Duty cycle precision for the CLKFX and CLKFX180 outputs, including the BUFGMUX and clock tree duty-cycle distortion All [1% of CLKFX period + 400] [1% of CLKFX period + 400] ps
Phase Alignment(5) CLKOUT_PHASE_FX CLKOUT_PHASE_FX180 Phase offset between the DFS CLKFX output and the DLL CLK0 output when both the DFS and DLL are used Phase offset between the DFS CLKFX180 output and the DLL CLK0 output when both the DFS and DLL are used All All 200 [1% of CLKFX period + 300] 200 [1% of CLKFX period + 300] ps ps
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DC and Switching Characteristics Table 106: Switching Characteristics for the DFS (Continued)
Speed Grade -5 Symbol Lock Time LOCK_FX(2) The time from deassertion at the DCM's Reset input to the rising transition at its LOCKED output. The DFS asserts LOCKED when the CLKFX and CLKFX180 signals are valid. If using both the DLL and the DFS, use the longer locking time. 5 MHz < FCLKIN < 15 MHz FCLKIN > 15 MHz All 5 450 5 450 ms s Description Device Min Max Min -4 Max Units
Notes:
1. 2. 3. 4. 5.
The numbers in this table are based on the operating conditions set forth in Table 76 and Table 105. For optimal jitter tolerance and faster lock time, use the CLKIN_PERIOD attribute. Use the Virtex-II Jitter Calculator at http://www.xilinx.com/applications/web_ds_v2/jitter_calc.htm.or the jitter calculator included in Clock Wizard/DCM Wizard. Output jitter includes 150 ps of input clock jitter. The CLKFX and CLKFX180 outputs always have an approximate 50% duty cycle. Some duty-cycle and alignment specifications include 1% of the CLKFX output period or 0.01 UI. Example: The data sheet specifies a maximum jitter of "[1% of CLKFX period + 300]". Assume the CLKFX output frequency is 100 MHz. The equivalent CLKFX period is 10 ns and 1% of 10 ns is 0.1 ns or 100 ps. According to the data sheet, the maximum jitter is [100 ps + 300 ps] = 400 ps.
Phase Shifter (PS)
Table 107: Recommended Operating Conditions for the PS in Variable Phase Mode
Speed Grade -5 Symbol Operating Frequency Ranges PSCLK_FREQ (FPSCLK) Frequency for the PSCLK input 1 167 1 167 MHz Description Min Max Min -4 Max Units
Input Pulse Requirements PSCLK_PULSE PSCLK pulse width as a percentage of the PSCLK period 40% 60% 40% 60% -
Table 108: Switching Characteristics for the PS in Variable Phase Mode
Symbol Phase Shifting Range MAX_STEPS(2) Maximum allowed number of DCM_DELAY_STEP steps for a given CLKIN clock period, where T = CLKIN clock period in ns. If using CLKIN_DIVIDE_BY_2 = TRUE, double the clock effective clock period. Minimum guaranteed delay for variable phase shifting Maximum guaranteed delay for variable phase shifting [INTEGER(20 * (TCLKIN - 3 ns))] steps Description Units
FINE_SHIFT_RANGE_MIN FINE_SHIFT_RANGE_MAX
[MAX_STEPS * DCM_DELAY_STEP_MIN] [MAX_STEPS * DCM_DELAY_STEP_MAX]
ns ns
Notes: 1. The numbers in this table are based on the operating conditions set forth in Table 76 and Table 107. 2. The maximum variable phase shift range, MAX_STEPS, is only valid when the DCM is has no initial fixed phase shifting, i.e., the PHASE_SHIFT attribute is set to 0. 3. The DCM_DELAY_STEP values are provided at the bottom of Table 104.
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Miscellaneous DCM Timing
Table 109: Miscellaneous DCM Timing Symbol DCM_RST_PW_MIN DCM_RST_PW_MAX(2) Description Minimum duration of a RST pulse width Maximum duration of a RST pulse width Min 3 N/A N/A DCM_CONFIG_LAG_TIME(3) Maximum duration from VCCINT applied to FPGA configuration successfully completed (DONE pin goes High) and clocks applied to DCM DLL N/A N/A Max N/A N/A N/A N/A Units CLKIN cycles seconds seconds minutes minutes
Notes:
1. 2. 3. This limit only applies to applications that use the DCM DLL outputs (CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV). The DCM DFS outputs (CLKFX, CLKFX180) are unaffected. This specification is equivalent to the Virtex-4 DCM_RESET specfication.This specification does not apply for Spartan-3E FPGAs. This specification is equivalent to the Virtex-4 TCONFIG specification. This specification does not apply for Spartan-3E FPGAs.
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DC and Switching Characteristics
Configuration and JTAG Timing
General Configuration Power-On/Reconfigure Timing
VCCINT (Supply) VCCAUX (Supply) VCCO Bank 2 (Supply) PROG_B (Input) INIT_B (Open-Drain) CCLK (Output)
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1.2V 1.0V 2.5V 2.0V
1.0V TPOR
TPROG
TPL
TICCK
Notes:
1. 2. 3. The VCCINT, VCCAUX, and VCCO supplies may be applied in any order. The Low-going pulse on PROG_B is optional after power-on but necessary for reconfiguration without a power cycle. The rising edge of INIT_B samples the voltage levels applied to the mode pins (M0 - M2).
Figure 74: Waveforms for Power-On and the Beginning of Configuration Table 110: Power-On Timing and the Beginning of Configuration
All Speed Grades Symbol TPOR(2) Description The time from the application of VCCINT, VCCAUX, and VCCO Bank 2 supply voltage ramps (whichever occurs last) to the rising transition of the INIT_B pin Device XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E TPROG TPL(2) The width of the low-going pulse on the PROG_B pin The time from the rising edge of the PROG_B pin to the rising transition on the INIT_B pin All XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E TINIT TICCK(3) Minimum Low pulse width on INIT_B output The time from the rising edge of the INIT_B pin to the generation of the configuration clock signal at the CCLK output pin All All Min 0.5 250 0.5 Max 5 5 5 5 7 0.5 0.5 1 2 2 4.0 Units ms ms ms ms ms s ms ms ms ms ms ns s
Notes:
1. 2. 3. The numbers in this table are based on the operating conditions set forth in Table 76. This means power must be applied to all VCCINT, VCCO, and VCCAUX lines. Power-on reset and the clearing of configuration memory occurs during this period. This specification applies only to the Master Serial, SPI, BPI-Up, and BPI-Down modes.
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Configuration Clock (CCLK) Characteristics
Table 111: Master Mode CCLK Output Period by ConfigRate Option Setting Symbol TCCLK1 TCCLK3 TCCLK6 TCCLK12 TCCLK25 TCCLK50
Notes:
1. Set the ConfigRate option value when generating a configuration bitstream. See Bitstream Generator (BitGen) Options in Module 2.
Description CCLK clock period by ConfigRate setting
ConfigRate Setting 1 (power-on value) 3 6 12 25 50
Temperature Range Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial
Minimum 570 485 285 242 142 121 71.2 60.6 35.5 30.3 17.8 15.1
Maximum 1,250 625 313 157 78.2 39.1
Units ns ns ns ns ns ns ns ns ns ns ns ns
Table 112: Master Mode CCLK Output Frequency by ConfigRate Option Setting Symbol FCCLK1 FCCLK3 FCCLK6 FCCLK12 FCCLK25 FCCLK50 Description Equivalent CCLK clock frequency by ConfigRate setting ConfigRate Setting 1 (power-on value) 3 6 12 25 50 Temperature Range Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Minimum 0.8 1.6 3.2 6.4 12.8 25.6 Maximum 1.8 2.1 3.6 4.2 7.1 8.3 14.1 16.5 28.1 33.0 56.2 66.0 Units MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz
Table 113: Master Mode CCLK Output Minimum Low and High Time Symbol TMCCL, TMCCH Description Master mode CCLK minimum Low and High time Commercial Industrial ConfigRate Setting 1 276 235 3 138 117 6 69 58 12 34.5 29.3 25 17.1 14.5 50 8.5 7.3 Units ns ns
Table 114: Slave Mode CCLK Input Low and High Time Symbol TSCCL, TSCCH CCLK Low and High time Description Min 5 Max Units ns
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Master Serial and Slave Serial Mode Timing
PROG_B (Input)
INIT_B (Open-Drain)
TMCCL TSCCL
TMCCH TSCCH
CCLK (Input/Output) TDCC DIN (Input) TCCD Bit 0 Bit 1 1/FCCSER Bit n Bit n+1 TCCO DOUT (Output) Bit n-64 Bit n-63
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Figure 75: Waveforms for Master Serial and Slave Serial Configuration Table 115: Timing for the Master Serial and Slave Serial Configuration Modes Slave/ Master All Speed Grades Min Max Units
Symbol Clock-to-Output Times TCCO
Description
The time from the falling transition on the CCLK pin to data appearing at the DOUT pin
Both
1.5
10.0
ns
Setup Times TDCC The time from the setup of data at the DIN pin to the active edge of the CCLK pin Both 11.0 ns
Hold Times TCCD The time from the active edge of the CCLK pin to the point when data is last held at the DIN pin Both 0 ns
Clock Timing TCCH High pulse width at the CCLK input pin Master Slave TCCL Low pulse width at the CCLK input pin Master Slave FCCSER Frequency of the clock signal at the CCLK input pin No bitstream compression With bitstream compression Slave 0 0 See Table 113 See Table 114 See Table 113 See Table 114 66(2) 20 MHz MHz
Notes:
1. 2. The numbers in this table are based on the operating conditions set forth in Table 76. For serial configuration with a daisy-chain of multiple FPGAs, the maximum limit is 25 MHz.
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Slave Parallel Mode Timing
PROG_B (Input)
INIT_B (Open-Drain) TSMCSCC CSI_B (Input) TSMCCW RDWR_B (Input) TMCCH TSCCH CCLK (Input) TSMDCC D0 - D7 (Inputs) TSMCCD 1/FCCPAR TMCCL TSCCL TSMWCC TSMCCCS
Byte 0
Byte 1 TSMCKBY
Byte n TSMCKBY
Byte n+1
BUSY (Output)
High-Z BUSY
High-Z
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Notes:
1. It is possible to abort configuration by pulling CS_B Low in a given CCLK cycle, then switching RDWR_B Low or High in any subsequent cycle for which CSI_B remains Low. The RDWR_B pin asynchronously controls the driver impedance of the D0 - D7 bus. When RDWR_B switches High, be careful to avoid contention on the D0 - D7 bus.
Figure 76: Waveforms for Slave Parallel Configuration Table 116: Timing for the Slave Parallel Configuration Mode All Speed Grades Symbol Clock-to-Output Times TSMCKBY Setup Times TSMDCC TSMCSCC TSMCCW(2) The time from the setup of data at the D0-D7 pins to the active edge the CCLK pin Setup time on the CSI_B pin before the active edge of the CCLK pin Setup time on the RDWR_B pin before active edge of the CCLK pin 11.0 10.0 23.0 ns ns ns The time from the rising transition on the CCLK pin to a signal transition at the BUSY pin 12.0 ns Description Min Max Units
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DC and Switching Characteristics Table 116: Timing for the Slave Parallel Configuration Mode (Continued) All Speed Grades Symbol Hold Times TSMCCD TSMCCCS TSMWCC Clock Timing TCCH TCCL FCCPAR The High pulse width at the CCLK input pin The Low pulse width at the CCLK input pin Frequency of the clock signal at the CCLK input pin No bitstream compression Not using the BUSY pin(2) Using the BUSY pin 5 5 0 0 0 50 66 20 ns ns MHz MHz MHz The time from the active edge of the CCLK pin to the point when data is last held at the D0-D7 pins The time from the active edge of the CCLK pin to the point when a logic level is last held at the CSO_B pin The time from the active edge of the CCLK pin to the point when a logic level is last held at the RDWR_B pin 1.0 0 0 ns ns ns Description Min Max Units
With bitstream compression
Notes:
1. 2. 3.
The numbers in this table are based on the operating conditions set forth in Table 76. In the Slave Parallel mode, it is necessary to use the BUSY pin when the CCLK frequency exceeds this maximum specification. Some Xilinx documents refer to Parallel modes as "SelectMAP" modes.
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Serial Peripheral Interface (SPI) Configuration Timing
PROG_B
(Input)
HSWAP
(Input)
HSWAP must be stable before INIT_B goes High and constant throughout the configuration process.
VS[2:0]
(Input)
<1:1:1>
M[2:0]
(Input)
Mode input pins M[2:0] and variant select input pins VS[2:0] are sampled when INIT_B goes High. After this point, input values do not matter until DONE goes High, at which point these pins become user-I/O pins. TINITM New ConfigRate active TCCLKn TMCCHn
<0:0:1> TMINIT
INIT_B
(Open-Drain)
T CCLK1 CCLK
TMCCL1 TMCCH1
TMCCLn TCCLK1
TV DIN
(Input)
Data TCSS
Data TDCC
Data
Data
CSO_B TCCO MOSI Command (msb) TDSU Command (msb-1) T DH
TCCD
Pin initially pulled High by internal pull-up resistor if HSWAP input is Low. Pin initially high-impedance (Hi-Z) if HSWAP input is High. External pull-up resistor required on CSO_B.
Shaded values indicate specifications on attached SPI Flash PROM.
ds312-3_06_110206
Figure 77: Waveforms for Serial Peripheral Interface (SPI) Configuration Table 117: Timing for Serial Peripheral Interface (SPI) Configuration Mode Symbol TCCLK1 TCCLKn TMINIT TINITM TCCO TDCC TCCD Initial CCLK clock period CCLK clock period after FPGA loads ConfigRate setting Setup time on VS[2:0] and M[2:0] mode pins before the rising edge of INIT_B Hold time on VS[2:0] and M[2:0]mode pins after the rising edge of INIT_B MOSI output valid after CCLK edge Setup time on DIN data input before CCLK edge Hold time on DIN data input after CCLK edge 50 0 Description Minimum Maximum (see Table 111) (see Table 111) See Table 115 See Table 115 See Table 115 ns ns Units
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DC and Switching Characteristics Table 118: Configuration Timing Requirements for Attached SPI Serial Flash Symbol TCCS TDSU TDH TV fC or fR Description SPI serial Flash PROM chip-select time SPI serial Flash PROM data input setup time SPI serial Flash PROM data input hold time Requirement Units ns ns ns
T CCS T MCCL1 - T CCO T DSU T MCCL1 - T CCO T DH T MCCH1 T V T MCCLn - T DCC
SPI serial Flash PROM data clock-to-output time
ns
Maximum SPI serial Flash PROM clock frequency (also depends on specific read command used)
MHz
1 f C ----------------------------T CCLKn ( min )
Notes:
1. 2. These requirements are for successful FPGA configuration in SPI mode, where the FPGA provides the CCLK frequency. The post configuration timing can be different to support the specific needs of the application loaded into the FPGA and the resulting clock source. Subtract additional printed circuit board routing delay as required by the application.
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Byte Peripheral Interface (BPI) Configuration Timing
PROG_B (Input) HSWAP (Input) CSI_B (Input) RDWR_B (Input) M[2:0] (Input) TMINIT INIT_B (Open-Drain) <0:1:1> TINITM Mode input pins M[2:0] are sampled when INIT_B goes High. After this point, input values do not matter until DONE goes High, at which point the mode pins become user-I/O pins. HSWAP must be stable before INIT_B goes High and remain constant throughout configuration.
Pin initially pulled High by internal pull-up resistor if HSWAP input is Low. Pin initially high-impedance (Hi-Z) if HSWAP input is High.
LDC[2:0]
HDC
CSO_B T INITADDR
New ConfigRate active TCCLK1 TCCLKn
TCCLK1 CCLK
TCCO A[23:0] 0x00_0000 0x00_0001 TAVQV D[7:0] (Input) Byte 0 Byte 1 Data Address Address TDCC Data Data Address TCCD Data
Shaded values indicate specifications on attached parallel NOR Flash PROM.
UG332_c5_08_110206
Figure 78: Waveforms for Byte-wide Peripheral Interface (BPI) Configuration (BPI-DN mode shown) Table 119: Timing for Byte-wide Peripheral Interface (BPI) Configuration Mode Symbol TCCLK1 TCCLKn TMINIT TINITM TINITADDR Initial CCLK clock period CCLK clock period after FPGA loads ConfigRate setting Setup time on CSI_B, RDWR_B, and M[2:0] mode pins before the rising edge of INIT_B Hold time on CSI_B, RDWR_B, and M[2:0] mode pins after the rising edge of INIT_B Minimum period of initial A[23:0] address cycle; LDC[2:0] and HDC are asserted and valid
BPI-UP: (M[2:0]=<0:1:0>) BPI-DN: (M[2:0]=<0:1:1>)
Description
Minimum
Maximum
Units
(see Table 111) (see Table 111) 50 0 5 2 5 2 ns ns TCCLK1 cycles
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DC and Switching Characteristics Table 119: Timing for Byte-wide Peripheral Interface (BPI) Configuration Mode (Continued) Symbol TCCO TDCC TCCD Description Address A[23:0] outputs valid after CCLK falling edge Setup time on D[7:0] data inputs before CCLK falling edge Hold time on D[7:0] data inputs after CCLK falling edge Minimum Maximum Units
See Table 115 See Table 115 See Table 115
Table 120: Configuration Timing Requirements for Attached Parallel NOR Flash Symbol TCE (tELQV) TOE (tGLQV) TACC (tAVQV) TBYTE (tFLQV, tFHQV)
Notes:
1. 2. 3. These requirements are for successful FPGA configuration in BPI mode, where the FPGA provides the CCLK frequency. The post configuration timing can be different to support the specific needs of the application loaded into the FPGA and the resulting clock source. Subtract additional printed circuit board routing delay as required by the application. The initial BYTE# timing can be extended using an external, appropriately sized pull-down resistor on the FPGA's LDC2 pin. The resistor value also depends on whether the FPGA's HSWAP pin is High or Low.
Description Parallel NOR Flash PROM chip-select time
Requirement
Units ns
T CE T INITADDR T OE T INITADDR T ACC T CCLKn ( min ) - T CCO - T DCC - PCB T BYTE T INITADDR
Parallel NOR Flash PROM output-enable time
ns
Parallel NOR Flash PROM read access time
ns
For x8/x16 PROMs only: BYTE# to output valid time(3)
ns
Table 121: MultiBoot Trigger (MBT) Timing Symbol TMBT
Notes:
1. MultiBoot re-configuration starts on the rising edge after MBT is Low for at least the prescribed minimum period.
Description MultiBoot Trigger (MBT) Low pulse width required to initiate MultiBoot reconfiguration
Minimum 300
Maximum
Units ns
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IEEE 1149.1/1553 JTAG Test Access Port Timing
TCCH TCCL
TCK (Input)
TTMSTCK TTCKTMS 1/FTCK
TMS (Input)
TTDITCK TTCKTDI
TDI (Input)
TTCKTDO
TDO (Output)
DS099_06_040703
Figure 79: JTAG Waveforms
Table 122: Timing for the JTAG Test Access Port All Speed Grades Symbol Clock-to-Output Times TTCKTDO Setup Times TTDITCK TTMSTCK Hold Times TTCKTDI TTCKTMS The time from the rising transition at the TCK pin to the point when data is last held at the TDI pin The time from the rising transition at the TCK pin to the point when a logic level is last held at the TMS pin 0 0 ns ns The time from the setup of data at the TDI pin to the rising transition at the TCK pin The time from the setup of a logic level at the TMS pin to the rising transition at the TCK pin 7.0 7.0 ns ns The time from the falling transition on the TCK pin to data appearing at the TDO pin 1.0 11.0 ns Description Min Max Units
Clock Timing TCCH TCCL FTCK
Notes:
1. The numbers in this table are based on the operating conditions set forth in Table 76.
The High pulse width at the TCK pin The Low pulse width at the TCK pin Frequency of the TCK signal
5 5 -
30
ns ns MHz
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DC and Switching Characteristics
Revision History
The following table shows the revision history for this document. Date 03/01/05 11/23/05 03/22/06 Version 1.0 2.0 3.0 Initial Xilinx release. Added AC timing information and additional DC specifications. Upgraded data sheet status to Preliminary. Finalized production timing parameters. All speed grades for all Spartan-3E FPGAs are now Production status using the v1.21 speed files, as shown in Table 83. Expanded description in Note 2, Table 77. Updated pin-to-pin and clock-to-output timing based on final characterization, shown in Table 85. Updated system-synchronous input setup and hold times based on final characterization, shown in Table 86 and Table 87. Updated other I/O timing in Table 89. Provided input and output adjustments for LVPECL_25, DIFF_SSTL and DIFF_HSTL I/O standards that supersede the v1.21 speed file values, in Table 90 and Table 93. Reduced I/O three-state and set/reset delays in Table 92. Added XC3S100E FPGA in CP132 package to Table 95. Increased TAS slice flip-flop timing by 100 ps in Table 97. Updated distributed RAM timing in Table 98 and SRL16 timing in Table 99. Updated global clock timing, removed left/right clock buffer limits in Table 100. Updated block RAM timing in Table 102. Added DCM parameters for remainder of Step 0 device; added improved Step 1 DCM performance to Table 103, Table 104, Table 105, and Table 106. Added minimum INIT_B pulse width specification, TINIT, in Table 110. Increased data hold time for Slave Parallel mode to 1.0 ns (TSMCCD) in Table 116. Improved the DCM performance for the XC3S1200E, Stepping 0 in Table 103, Table 104, Table 105, and Table 106. Corrected links in Table 117 and Table 119. Added MultiBoot timing specifications to Table 121. Improved SSO limits for LVDS_25, MINI_LVDS_25, and RSDS_25 I/O standards in the QFP packages (Table 96). Removed potentially confusing Note 2 from Table 77. Clarified that 100 mV of hysteresis applies to LVCMOS33 and LVCMOS25 I/O standards (Note 4, Table 79). Other minor edits. Corrected various typos and incorrect links. Improved absolute maximum voltage specifications in Table 72, providing additional overshoot allowance. Widened the recommended voltage range for PCI and PCI-X standards in Table 79. Clarified Note 2, Table 82. Improved various timing specifications for v1.26 speed file. Added Table 84 to summarize the history of speed file releases after which time all devices became Production status. Added absolute minimum values for Table 85, Table 91, and Table 92. Updated pin-to-pin setup and hold timing based on default IFD_DELAY_VALUE settings in Table 86, Table 87, and Table 89. Added Table 88 about source-synchronous input capture sample window. Promoted Module 3 to Production status. Synchronized all modules to v3.4. Revision
04/07/06 05/19/06 05/30/06 11/09/06
3.1 3.2 3.2.1 3.4
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Spartan-3E FPGA Family: Pinout Descriptions
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Introduction
This section describes the various pins on a SpartanTM-3E FPGA and how they connect within the supported component packages.
Pin Types
Most pins on a Spartan-3E FPGA are general-purpose, user-defined I/O pins. There are, however, up to 11 different functional types of pins on Spartan-3E packages, as outlined in Table 123. In the package footprint drawings that follow, the individual pins are color-coded according to pin type as in the table.
Table 123: Types of Pins on Spartan-3E FPGAs Type / Color Code I/O INPUT DUAL Description Unrestricted, general-purpose user-I/O pin. Most pins can be paired together to form differential I/Os. Unrestricted, general-purpose input-only pin. This pin does not have an output structure. Dual-purpose pin used in some configuration modes during the configuration process and then usually available as a user I/O after configuration. If the pin is not used during configuration, this pin behaves as an I/O-type pin. Some of the dual-purpose pins are also shared with bottom-edge global (GCLK) or right-half (RHCLK) clock inputs. See the Configuration section in Module 2 for additional information on these signals. Pin Name(s) in Type IO IO_Lxxy_# IP IP_Lxxy_# M[2:0] HSWAP CCLK MOSI/CSI_B D[7:1] D0/DIN CSO_B RDWR_B BUSY/DOUT INIT_B A[23:20] A19/VS2 A18/VS1 A17/VS0 A[16:0] LDC[2:0] HDC IP/VREF_# IP_Lxx_#/VREF_# IO/VREF_# IO_Lxx_#/VREF_# IO_Lxx_#/GCLK[15:2], IP_Lxx_#/GCLK[1:0], IO_Lxx_#/LHCLK[7:0], IO_Lxx_#/RHCLK[7:0]
VREF
Dual-purpose pin that is either a user-I/O pin or Input-only pin, or, along with all other VREF pins in the same bank, provides a reference voltage input for certain I/O standards. If used for a reference voltage within a bank, all VREF pins within the bank must be connected. Either a user-I/O pin or an input to a specific clock buffer driver. Every package has 16 global clock inputs that optionally clock the entire device. The RHCLK inputs optionally clock the right-half of the device. The LHCLK inputs optionally clock the left-half of the device. Some of the clock pins are shared with the dual-purpose configuration pins and are considered DUAL-type. See the Clocking Infrastructure section in Module 2 for additional information on these signals.
CLK
(c) 2005-2006 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners.
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Pinout Descriptions Table 123: Types of Pins on Spartan-3E FPGAs (Continued) Type / Color Code CONFIG Description Dedicated configuration pin. Not available as a user-I/O pin. Every package has two dedicated configuration pins. These pins are powered by VCCAUX. See the Configuration section in Module 2 for additional information on these signals. Dedicated JTAG pin. Not available as a user-I/O pin. Every package has four dedicated JTAG pins. These pins are powered by VCCAUX. Dedicated ground pin. The number of GND pins depends on the package used. All must be connected. Dedicated auxiliary power supply pin. The number of VCCAUX pins depends on the package used. All must be connected to +2.5V. See the Powering Spartan-3E FPGAs section in Module 2 for additional information on this signal. Dedicated internal core logic power supply pin. The number of VCCINT pins depends on the package used. All must be connected to +1.2V. See the Powering Spartan-3E FPGAs section in Module 2 for additional information on this signal. Along with all the other VCCO pins in the same bank, this pin supplies power to the output buffers within the I/O bank and sets the input threshold voltage for some I/O standards. See the Powering Spartan-3E FPGAs section in Module 2 for additional information on these signals. This package pin is not connected in this specific device/package combination but may be connected in larger devices in the same package. Pin Name(s) in Type DONE, PROG_B
R
JTAG GND VCCAUX
TDI, TMS, TCK, TDO GND VCCAUX
VCCINT
VCCINT
VCCO
VCCO_#
N.C.
Notes:
1.
N.C.
# = I/O bank number, an integer between 0 and 3.
I/Os with Lxxy_# are part of a differential output pair. `L' indicates differential output capability. The "xx" field is a two-digit integer, unique to each bank that identifies a differential pin-pair. The `y' field is either `P' for the true signal or `N' for the inverted signal in the differential pair. The `#' field is the I/O bank number.
significance. Figure 80 provides a specific example showing a differential input to and a differential output from Bank 1. `L' indicates that the pin is part of a differentiaL pair. "xx" is a two-digit integer, unique for each bank, that identifies a differential pin-pair. `y' is replaced by `P' for the true signal or `N' for the inverted. These two pins form one differential pin-pair. `#' is an integer, 0 through 3, indicating the associated I/O bank.
Differential Pair Labeling
A pin supports differential standards if the pin is labeled in the format "Lxxy_#". The pin name suffix has the following
Pair Number
Bank 0 IO_L38P_1
Bank Number
Bank 1
Bank 3
IO_L38N_1 IO_L39P_1 IO_L39N_1
Positive Polarity, True Driver
Spartan-3E FPGA Bank 2
Negative Polarity, Inverted Driver
DS312-4_00_111105
Figure 80: Differential Pair Labeling
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Pinout Descriptions lar, as shown in the mechanical drawings provided in Table 126. Not all Spartan-3E densities are available in all packages. For a specific package, however, there is a common footprint that supports all the devices available in that package. See the footprint diagrams that follow. For additional package information, see UG112: Device Package User Guide.
Package Overview
Table 124 shows the eight low-cost, space-saving production package styles for the Spartan-3E family. Each package style is available as a standard and an environmentally friendly lead-free (Pb-free) option. The Pb-free packages include an extra `G' in the package style name. For example, the standard "VQ100" package becomes "VQG100" when ordered as the Pb-free option. The mechanical dimensions of the standard and Pb-free packages are simiTable 124: Spartan-3E Family Package Options
Package VQ100 / VQG100 CP132 / CPG132 TQ144 / TQG144 PQ208 / PQG208 FT256 / FTG256 FG320 / FGG320 FG400 / FGG400 FG484 / FGG484 Notes:
1.
Leads 100 132 144 208 256 320 400 484
Type Very-thin Quad Flat Pack (VQFP) Chip-Scale Package (CSP) Thin Quad Flat Pack (TQFP) Plastic Quad Flat Pack (PQFP) Fine-pitch, Thin Ball Grid Array (FBGA) Fine-pitch Ball Grid Array (FBGA) Fine-pitch Ball Grid Array (FBGA) Fine-pitch Ball Grid Array (FBGA)
Maximum I/O 66 92 108 158 190 250 304 376
Lead Pitch (mm) 0.5 0.5 0.5 0.5 1.0 1.0 1.0 1.0
Footprint Area (mm) 16 x 16 8.1 x 8.1 22 x 22 30.6 x 30.6 17 x 17 19 x 19 21 x 21 23 x 23
Height (mm) 1.20 1.10 1.60 4.10 1.55 2.00 2.43 2.60
Mass(1) (g) 0.6 0.1 1.4 5.3 0.9 1.4 2.2 2.2
Package mass is 10%.
Selecting the Right Package Option
Spartan-3E FPGAs are available in both quad-flat pack (QFP) and ball grid array (BGA) packaging options. While QFP packaging offers the lowest absolute cost, the BGA Table 125: QFP and BGA Comparison Characteristic Maximum User I/O Packing Density (Logic/Area) Signal Integrity Simultaneous Switching Output (SSO) Support Thermal Dissipation Minimum Printed Circuit Board (PCB) Layers Hand Assembly/Rework
packages are superior in almost every other aspect, as summarized in Table 125. Consequently, Xilinx recommends using BGA packaging whenever possible.
Quad Flat Pack (QFP) 158 Good Fair Fair Fair 4 Possible
Ball Grid Array (BGA) 376 Better Better Better Better 4-6 Difficult
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Mechanical Drawings
Detailed mechanical drawings for each package type are available from the Xilinx website at the specified location in Table 126. Table 126: Xilinx Package Mechanical Drawings Package VQ100 / VQG100 CP132 / CPG132 TQ144 / TQG144 PQ208 / PQG208 FT256 / FTG256 FG320 / FGG320 FG400 / FGG400 FG484 / FGG484 Web Link (URL) http://www.xilinx.com/bvdocs/packages/vq100.pdf http://www.xilinx.com/bvdocs/packages/cp132.pdf http://www.xilinx.com/bvdocs/packages/tq144.pdf http://www.xilinx.com/bvdocs/packages/pq208.pdf http://www.xilinx.com/bvdocs/packages/ft256.pdf http://www.xilinx.com/bvdocs/packages/fg320.pdf http://www.xilinx.com/bvdocs/packages/fg400.pdf http://www.xilinx.com/bvdocs/packages/fg484.pdf A majority of package pins are user-defined I/O or input pins. However, the numbers and characteristics of these I/O depend on the device type and the package in which it is available, as shown in Table 128. The table shows the maximum number of single-ended I/O pins available, assuming that all I/O-, INPUT-, DUAL-, VREF-, and CLK-type pins are used as general-purpose I/O. Likewise, the table shows the maximum number of differential pin-pairs available on the package. Finally, the table shows how the total maximum user-I/Os are distributed by pin type, including the number of unconnected--i.e., N.C.--pins on the device.
Package Pins by Type
Each package has three separate voltage supply inputs--VCCINT, VCCAUX, and VCCO--and a common ground return, GND. The numbers of pins dedicated to these functions vary by package, as shown in Table 127. Table 127: Power and Ground Supply Pins by Package Package VQ100 CP132 TQ144 PQ208 FT256 FG320 FG400 FG484 VCCINT 4 6 4 4 8 8 16 16 VCCAUX 4 4 4 8 8 8 8 10 VCCO 8 8 9 12 16 20 24 28 GND 12 16 13 20 28 28 42 48
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Table 128: Maximum User I/O by Package Maximum User I/Os and Input-Only 66 VQ100 XC3S250E XC3S100E XC3S250E XC3S500E XC3S100E TQ144 XC3S250E XC3S250E PQ208 XC3S500E XC3S250E XC3S500E XC3S1200E XC3S500E XC3S1200E XC3S1600E XC3S1200E FG400 XC3S1600E XC3S1600E
Notes:
1. All devices have 24 possible global clock and right- and left-half side clock inputs. The right-half and bottom-edge clock pins have shared functionality in some FPGA configuration modes. Consequently, some clock pins are counted in the DUAL column.
All Possible I/Os by Type Maximum InputOnly 7 7 11 7 7 28 28 32 32 40 41 40 56 56 56 72 72 82 Maximum Differential Pairs 30 30 35 41 41 40 40 65 65 68 77 77 92 99 99 124 124 156
Device XC3S100E
Package
I/O 16 16 16 22 22 22 20 58 58 62 76 78 102 120 120 156 156 214
INPUT 1 1 2 0 0 19 21 25 25 33 33 31 48 47 47 62 62 72
DUAL 21 21 42 46 46 42 42 46 46 46 46 46 46 46 46 46 46 46
VREF 4 4 7 8 8 9 9 13 13 15 19 19 20 21 21 24 24 28
CLK(1) 24 24 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16
N.C. 0 0 9 0 0 0 0 0 0 16 0 0 18 0 0 0 0 0
66 83 CP132 92 92 108 108 158 158 172 FT256 190 190 232 FG320 250 250 304 304 FG484 376
Electronic versions of the package pinout tables and footprints are available for download from the Xilinx website. Download the files from the following location: Using a spreadsheet program, the data can be sorted and reformat-
ted according to any specific needs. Similarly, the ASCII-text file is easily parsed by most scripting programs. http://www.xilinx.com/bvdocs/publications/s3e_pin.zip
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Package Thermal Characteristics
The power dissipated by an FPGA application has implications on package selection and system design. The power consumed by a Spartan-3E FPGA is reported using either the XPower Estimator or the XPower calculator integrated in the Xilinx ISE development software. Table 129 provides the thermal characteristics for the various Spartan-3E package offerings. The junction-to-case thermal resistance ( JC) indicates the difference between the temperature measured on the packTable 129: Spartan-3E Package Thermal Characteristics
age body (case) and the die junction temperature per watt of power consumption. The junction-to-board ( JB) value similarly reports the difference between the board and junction temperature. The junction-to-ambient (JA) value reports the temperature difference per watt between the ambient environment and the junction temperature. The JA value is reported at different air velocities, measured in linear feet per minute (LFM). The "Still Air (0 LFM)" column shows the JA value in a system without a fan. The thermal resistance drops with increasing air flow.
Junction-to-Ambient (JA) at Different Air Flows Package VQ100 Device XC3S100E XC3S250E CP132 XC3S100E XC3S250E XC3S500E TQ144 XC3S100E XC3S250E PQ208 XC3S250E XC3S500E FT256 XC3S250E XC3S500E XC3S1200E FG320 XC3S500E XC3S1200E XC3S1600E FG400 XC3S1200E XC3S1600E FG484 XC3S1600E Junction-to-Case (JC) 13.0 11.0 19.3 11.8 8.5 8.2 7.2 9.8 8.5 12.4 9.7 6.5 13.0 10.2 8.8 9.7 8.3 7.8 Junction-toBoard ( JB) 30.9 25.9 42.0 28.4 21.1 31.9 25.7 29.0 26.8 27.6 22.3 16.4 17.1 13.8 12.1 13.5 11.6 11.3 Still Air (0 LFM) 49.0 43.3 62.1 48.5 41.4 52.1 37.6 37.0 36.1 35.8 31.1 26.3 25.9 22.7 20.8 22.2 20.1 16.7 250 LFM 40.7 36.0 55.3 42.0 35.0 40.5 29.2 27.3 26.6 29.4 25.0 20.6 20.4 17.4 15.3 17.1 15.1 12.2 500 LFM 37.9 33.6 52.8 39.6 32.8 34.6 25.0 24.1 23.6 28.4 24.0 19.4 19.2 16.1 14.0 15.9 13.9 11.0 750 LFM 37.0 32.7 51.2 38.1 31.4 32.5 23.4 22.4 21.8 28.1 23.6 19.0 18.5 15.4 13.3 15.2 13.2 10.5 Units C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt C/Watt
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Pinout Descriptions
VQ100: 100-lead Very-thin Quad Flat Package
The XC3S100E and the XC3S250E devices are available in the 100-lead very-thin quad flat package, VQ100. Both devices share a common footprint for this package as shown in Table 130 and Figure 81. Table 130 lists all the package pins. They are sorted by bank number and then by pin name of the largest device. Pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. The VQ100 package does not support the Byte-wide Peripheral Interface (BPI) configuration mode. Consequently, the VQ100 footprint has fewer DUAL-type pins than other packages. An electronic version of this package pinout table and footprint diagram is available for download from the Xilinx web site at http://www.xilinx.com/bvdocs/publications/s3e_pin.zip. Table 130: VQ100 Package Pinout (Continued)
XC3S100E XC3S250E Pin Name IO_L03P_1/RHCLK0 IO_L04N_1/RHCLK3 IO_L04P_1/RHCLK2 IO_L05N_1/RHCLK5 IO_L05P_1/RHCLK4 IO_L06N_1/RHCLK7 IO_L06P_1/RHCLK6 IO_L07N_1 IO_L07P_1 IP/VREF_1 VCCO_1 VCCO_1 IO/D5 IO/M1 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L02N_2/MOSI/CSI_B IO_L02P_2/DOUT/BUSY IO_L03N_2/D6/GCLK13 IO_L03P_2/D7/GCLK12 IO_L04N_2/D3/GCLK15 IO_L04P_2/D4/GCLK14 IO_L06N_2/D1/GCLK3 IO_L06P_2/D2/GCLK2 IO_L07N_2/DIN/D0 IO_L07P_2/M0 IO_L08N_2/VS1 IO_L08P_2/VS2 IO_L09N_2/CCLK IO_L09P_2/VS0 IP/VREF_2 IP_L05N_2/M2/GCLK1 IP_L05P_2/RDWR_B/ GCLK0 VCCO_2 VCCO_2 IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 VQ100 Pin Number P60 P63 P62 P66 P65 P68 P67 P71 P70 P69 P55 P73 P34 P42 P25 P24 P27 P26 P33 P32 P36 P35 P41 P40 P44 P43 P48 P47 P50 P49 P30 P39 P38 P31 P45 P3 P2 P5
Bank 1 1 1 1 1 1 1 1 1 1 1 1 2 2
Type RHCLK RHCLK RHCLK RHCLK RHCLK RHCLK RHCLK I/O I/O VREF VCCO VCCO DUAL DUAL DUAL DUAL DUAL DUAL DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL DUAL DUAL DUAL DUAL DUAL VREF DUAL/GCLK DUAL/GCLK VCCO VCCO I/O I/O VREF
Pinout Table
Table 130 shows the pinout for production Spartan-3E FPGAs in the VQ100 package. Table 130: VQ100 Package Pinout
XC3S100E XC3S250E Pin Name IO IO_L01N_0 IO_L01P_0 IO_L02N_0/GCLK5 IO_L02P_0/GCLK4 IO_L03N_0/GCLK7 IO_L03P_0/GCLK6 IO_L05N_0/GCLK11 IO_L05P_0/GCLK10 IO_L06N_0/VREF_0 IO_L06P_0 IO_L07N_0/HSWAP IO_L07P_0 IP_L04N_0/GCLK9 IP_L04P_0/GCLK8 VCCO_0 VCCO_0 IO_L01N_1 IO_L01P_1 IO_L02N_1 IO_L02P_1 IO_L03N_1/RHCLK1 VQ100 Pin Number P92 P79 P78 P84 P83 P86 P85 P91 P90 P95 P94 P99 P98 P89 P88 P82 P97 P54 P53 P58 P57 P61
2 2 Type I/O I/O I/O GCLK GCLK GCLK GCLK GCLK GCLK VREF I/O DUAL I/O GCLK GCLK VCCO VCCO I/O I/O I/O I/O RHCLK 2 2 3 3 3 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1
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Pinout Descriptions Table 130: VQ100 Package Pinout (Continued)
XC3S100E XC3S250E Pin Name IO_L02P_3 IO_L03N_3/LHCLK1 IO_L03P_3/LHCLK0 IO_L04N_3/LHCLK3 IO_L04P_3/LHCLK2 IO_L05N_3/LHCLK5 IO_L05P_3/LHCLK4 IO_L06N_3/LHCLK7 IO_L06P_3/LHCLK6 IO_L07N_3 IO_L07P_3 IP VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND VQ100 Pin Number P4 P10 P9 P12 P11 P16 P15 P18 P17 P23 P22 P13 P8 P20 P7 P14 P19 P29 P37 P52 P59 P64 P72 P81 P87 P93 P51 P1 P77 P100 P76 P75 P21 P46 P74 P96 P6 P28 P56 P80
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Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 GND GND GND GND GND GND GND GND GND GND GND GND
Type I/O LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK I/O I/O INPUT VCCO VCCO GND GND GND GND GND GND GND GND GND GND GND GND CONFIG CONFIG JTAG JTAG JTAG JTAG VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT
VCCAUX DONE VCCAUX PROG_B VCCAUX TCK VCCAUX TDI VCCAUX TDO VCCAUX TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
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Pinout Descriptions
User I/Os by Bank
Table 131 indicates how the 66 available user-I/O pins are distributed between the four I/O banks on the VQ100 package. Table 131: User I/Os Per Bank for XC3S100E and XC3S250E in the VQ100 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 15 15 19 17 66
All Possible I/O Pins by Type I/O 5 6 0 5 16 INPUT 0 0 0 1 1 DUAL 1 0 18 2 21 VREF 1 1 1 1 4 CLK 8 8 0(1) 8 24
Footprint Migration Differences
The production XC3S100E and XC3S250E FPGAs have identical footprints in the VQ100 package. Designs can migrate between the XC3S100E and XC3S250E without further consideration.
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Pinout Descriptions
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VQ100 Footprint
In Figure 81, note pin 1 indicator in top-left corner and logo orientation.
TDI IO_L07N_0/HSWAP IO_L07P_0 VCCO_0 VCCAUX IO_L06N_0/VREF_0 IO_L06P_0 GND IO IO_L05N_0/GCLK11 IO_L05P_0/GCLK10 IP_L04N_0/GCLK9 IP_L04P_0/GCLK8 GND IO_L03N_0/GCLK7 IO_L03P_0/GCLK6 IO_L02N_0/GCLK5 IO_L02P_0/GCLK4 VCCO_0 GND VCCINT IO_L01N_0 IO_L01P_0 TCK TDO PROG_B IO_L01P_3 IO_L01N_3 IO_L02P_3 IO_L02N_3/VREF_3 VCCINT GND VCCO_3 IO_L03P_3/LHCLK0 IO_L03N_3/LHCLK1 IO_L04P_3/LHCLK2 IO_L04N_3/LHCLK3 IP GND IO_L05P_3/LHCLK4 IO_L05N_3/LHCLK5 IO_L06P_3/LHCLK6 IO_L06N_3/LHCLK7 GND VCCO_3 VCCAUX IO_L07P_3 IO_L07N_3 IO_L01P_2/CSO_B IO_L01N_2/INIT_B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
Bank 0
TMS VCCAUX VCCO_1 GND IO_L07N_1 IO_L07P_1 IP/VREF_1 IO_L06N_1/RHCLK7 IO_L06P_1/RHCLK6 IO_L05N_1/RHCLK5 IO_L05P_1/RHCLK4 GND IO_L04N_1/RHCLK3 IO_L04P_1/RHCLK2 IO_L03N_1/RHCLK1 IO_L03P_1/RHCLK0 GND IO_L02N_1 IO_L02P_1 VCCINT VCCO_1 IO_L01N_1 IO_L01P_1 GND DONE
Bank 3
Bank 2
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 IO_L02P_2/DOUT/BUSY IO_L02N_2/MOSI/CSI_B VCCINT GND IP/VREF_2 VCCO_2 IO_L03P_2/D7/GCLK12 IO_L03N_2/D6/GCLK13 IO/D5 IO_L04P_2/D4/GCLK14 IO_L04N_2/D3/GCLK15 GND IP_L05P_2/RDWR_B/GCLK0 IP_L05N_2/M2/GCLK1 IO_L06P_2/D2/GCLK2 IO_L06N_2/D1/GCLK3 IO/M1 IO_L07P_2/M0 IO_L07N_2/DIN/D0 VCCO_2 VCCAUX IO_L08P_2/VS2 IO_L08N_2/VS1 IO_L09P_2/VS0 IO_L09N_2/CCLK
Bank 1
DS312-4_02_030705
Figure 81: VQ100 Package Footprint (top view).
16 1 2 0
I/O: Unrestricted, general-purpose user I/O INPUT: Unrestricted, general-purpose input pin CONFIG: Dedicated configuration pins N.C.: Not connected
21 24 4 12
DUAL: Configuration pin, then possible user-I/O CLK: User I/O, input, or global buffer input JTAG: Dedicated JTAG port pins GND: Ground
4 8 4 4
VREF: User I/O or input voltage reference for bank VCCO: Output voltage supply for bank VCCINT: Internal core supply voltage (+1.2V) VCCAUX: Auxiliary supply voltage (+2.5V)
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Pinout Descriptions
CP132: 132-ball Chip-scale Package
The XC3S100E, XC3S250E and the XC3S500E FPGAs are available in the 132-ball chip-scale package, CP132. The devices share a common footprint for this package as shown in Table 132 and Figure 82. Table 132 lists all the CP132 package pins. They are sorted by bank number and then by pin name. Pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. Physically, the D14 and K2 balls on the XC3S100E and XC3S250E FPGAs are not connected but should be connected to VCCINT to maintain density migration compatibility. Similarly, the A4, C1, and P10 balls on the XC3S100E FPGA are not connected but should be connected to GND to maintain density migration compatibility. The XC3S100E FPGA has four fewer BPI address pins, A[19:0], whereas the XC3S250E and XC3S500E support A[23:0]. An electronic version of this package pinout table and footprint diagram is available for download from the Xilinx website at http://www.xilinx.com/bvdocs/publications/s3e_pin.zip.
Pinout Table
Table 132: CP132 Package Pinout
XC3S100E Pin Name IO_L01N_0 IO_L01P_0 N.C. ( ) N.C. ( ) N.C. ( ) IP IO_L04N_0/GCLK5 IO_L04P_0/GCLK4 IO_L05N_0/GCLK7 IO_L05P_0/GCLK6 IO_L07N_0/GCLK11 IO_L07P_0/GCLK10 IO_L08N_0/VREF_0 IO_L08P_0 IO_L09N_0 IO_L09P_0 N.C. ( ) IP IO_L11N_0/HSWAP IO_L11P_0 IP_L06N_0/GCLK9 IP_L06P_0/GCLK8 IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0/GCLK5 IO_L04P_0/GCLK4 IO_L05N_0/GCLK7 IO_L05P_0/GCLK6 IO_L07N_0/GCLK11 IO_L07P_0/GCLK10 IO_L08N_0/VREF_0 IO_L08P_0 IO_L09N_0 IO_L09P_0 IO_L10N_0 IO_L10P_0 IO_L11N_0/HSWAP IO_L11P_0 IP_L06N_0/GCLK9 IP_L06P_0/GCLK8 XC3S250E XC3S500E Pin Name
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
CP132 Ball C12 A13 A12 B12 B11 C11 C9 A10 A9 B9 B7 A7 C6 B6 C5 B5 C4 B4 B3 A3 C8 B8
Type I/O I/O 100E: N.C. Others: I/O 100E: N.C. Others: I/O 100E: N.C. Others: VREF (I/O) 100E: INPUT Others: I/O GCLK GCLK GCLK GCLK GCLK GCLK VREF I/O I/O I/O 100E: N.C. Others: I/O 100E: INPUT Others: I/O DUAL I/O GCLK GCLK
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Pinout Descriptions Table 132: CP132 Package Pinout (Continued)
XC3S100E Pin Name VCCO_0 VCCO_0 IO/A0 IO/VREF_1 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/A11 IO_L03P_1/A12 IO_L04N_1/A9/RHCLK1 IO_L04P_1/A10/RHCLK0 IO_L05N_1/A7/RHCLK3/TRDY1 IO_L05P_1/A8/RHCLK2 IO_L06N_1/A5/RHCLK5 IO_L06P_1/A6/RHCLK4/IRDY1 IO_L07N_1/A3/RHCLK7 IO_L07P_1/A4/RHCLK6 IO_L08N_1/A1 IO_L08P_1/A2 IO_L09N_1/LDC0 IO_L09P_1/HDC IO_L10N_1/LDC2 IO_L10P_1/LDC1 IP/VREF_1 VCCO_1 VCCO_1 IO/D5 IO/M1 IP/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L02N_2/MOSI/CSI_B IO_L02P_2/DOUT/BUSY IO_L03N_2/D6/GCLK13 IO_L03P_2/D7/GCLK12 IO_L04N_2/D3/GCLK15 IO_L04P_2/D4/GCLK14 IO_L06N_2/D1/GCLK3 VCCO_0 VCCO_0 IO/A0 IO/VREF_1 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/A11 IO_L03P_1/A12 IO_L04N_1/A9/RHCLK1 IO_L04P_1/A10/RHCLK0 IO_L05N_1/A7/RHCLK3/TRDY1 IO_L05P_1/A8/RHCLK2 IO_L06N_1/A5/RHCLK5 IO_L06P_1/A6/RHCLK4/IRDY1 IO_L07N_1/A3/RHCLK7 IO_L07P_1/A4/RHCLK6 IO_L08N_1/A1 IO_L08P_1/A2 IO_L09N_1/LDC0 IO_L09P_1/HDC IO_L10N_1/LDC2 IO_L10P_1/LDC1 IP/VREF_1 VCCO_1 VCCO_1 IO/D5 IO/M1 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L02N_2/MOSI/CSI_B IO_L02P_2/DOUT/BUSY IO_L03N_2/D6/GCLK13 IO_L03P_2/D7/GCLK12 IO_L04N_2/D3/GCLK15 IO_L04P_2/D4/GCLK14 IO_L06N_2/D1/GCLK3 XC3S250E XC3S500E Pin Name
R
Bank 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2
CP132 Ball A6 B10 F12 K13 N14 N13 M13 M12 L14 L13 J12 K14 J14 J13 H12 H13 G13 G14 F13 F14 D12 D13 C13 C14 G12 E13 M14 P4 N7 P11 N1 M2 N2 P1 N4 M4 N5 M5 P7
Type VCCO VCCO DUAL VREF DUAL DUAL DUAL DUAL DUAL DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL DUAL DUAL DUAL DUAL DUAL DUAL VREF VCCO VCCO DUAL DUAL 100E: VREF(INPUT) Others: VREF(I/O) DUAL DUAL DUAL DUAL DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK
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Pinout Descriptions
Table 132: CP132 Package Pinout (Continued)
XC3S100E Pin Name IO_L06P_2/D2/GCLK2 IO_L07N_2/DIN/D0 IO_L07P_2/M0 N.C. ( ) N.C. ( ) N.C. ( ) N.C. ( ) IO_L10N_2/VS1/A18 IO_L10P_2/VS2/A19 IO_L11N_2/CCLK IO_L11P_2/VS0/A17 IP/VREF_2 IP_L05N_2/M2/GCLK1 IP_L05P_2/RDWR_B/GCLK0 VCCO_2 VCCO_2 IO IP/VREF_3 IO_L01N_3 IO_L01P_3 IO_L02N_3 IO_L02P_3 N.C. ( ) IO IO_L04N_3/LHCLK1 IO_L04P_3/LHCLK0 IO_L05N_3/LHCLK3/IRDY2 IO_L05P_3/LHCLK2 IO_L06N_3/LHCLK5 IO_L06P_3/LHCLK4/TRDY2 IO_L07N_3/LHCLK7 IO_L07P_3/LHCLK6 IO_L08N_3 IO_L08P_3 IO_L09N_3 XC3S250E XC3S500E Pin Name IO_L06P_2/D2/GCLK2 IO_L07N_2/DIN/D0 IO_L07P_2/M0 IO_L08N_2/A22 IO_L08P_2/A23 IO_L09N_2/A20 IO_L09P_2/A21 IO_L10N_2/VS1/A18 IO_L10P_2/VS2/A19 IO_L11N_2/CCLK IO_L11P_2/VS0/A17 IP/VREF_2 IP_L05N_2/M2/GCLK1 IP_L05P_2/RDWR_B/GCLK0 VCCO_2 VCCO_2 IO IO/VREF_3 IO_L01N_3 IO_L01P_3 IO_L02N_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3/LHCLK1 IO_L04P_3/LHCLK0 IO_L05N_3/LHCLK3/IRDY2 IO_L05P_3/LHCLK2 IO_L06N_3/LHCLK5 IO_L06P_3/LHCLK4/TRDY2 IO_L07N_3/LHCLK7 IO_L07P_3/LHCLK6 IO_L08N_3 IO_L08P_3 IO_L09N_3
Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
CP132 Ball P6 N8 P8 M9 N9 M10 N10 M11 N11 N12 P12 N3 N6 M6 M8 P3 J3 K3 B1 B2 C2 C3 D1 D2 F2 F3 G1 F1 H1 G3 H3 H2 L2 L1 M1
Type DUAL/GCLK DUAL DUAL 100E: N.C. Others: DUAL 100E: N.C. Others: DUAL 100E: N.C. Others: DUAL 100E: N.C. Others: DUAL DUAL DUAL DUAL DUAL VREF DUAL/GCLK DUAL/GCLK VCCO VCCO I/O 100E: VREF(INPUT) Others: VREF(I/O) I/O I/O I/O I/O 100E: N.C. Others: I/O I/O LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK I/O I/O I/O
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Pinout Descriptions Table 132: CP132 Package Pinout (Continued)
XC3S100E Pin Name IO_L09P_3 IP/VREF_3 VCCO_3 VCCO_3 N.C. (GND) GND N.C. (GND) GND GND GND GND GND GND GND GND GND GND GND N.C. (GND) GND DONE PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT N.C. (VCCINT) N.C. (VCCINT) VCCINT VCCINT IO_L09P_3 IP/VREF_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DONE PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S250E XC3S500E Pin Name
R
Bank 3 3 3 3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
CP132 Ball L3 E2 E1 J2 A4 A8 C1 C7 C10 E3 E14 G2 H14 J1 K12 M3 M7 P5 P10 P14 P13 A1 B13 A2 A14 B14 A5 E12 K1 P9 A11 D3 D14 K2 L12 P2
Type I/O VREF VCCO VCCO GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND CONFIG CONFIG JTAG JTAG JTAG JTAG VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
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Pinout Descriptions
User I/Os by Bank
Table 133 shows how the 83 available user-I/O pins are distributed on the XC3S100E FPGA packaged in the CP132 package. Table 134 indicates how the 92 available user-I/O pins are distributed on the XC3S250E and the XC3S500E FPGAs in the CP132 package.
Table 133: User I/Os Per Bank for the XC3S100E in the CP132 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 18 23 22 20 83
All Possible I/O Pins by Type I/O 6 0 0 10 16 INPUT 2 0 0 0 2 DUAL 1 21 20 0 42 VREF 1 2 2 2 7 CLK 8 0(1) 0(1) 8 16
Table 134: User I/Os Per Bank for the XC3S250E and XC3S500E in the CP132 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 22 23 26 21 92
All Possible I/O Pins by Type I/O 11 0 0 11 22 INPUT 0 0 0 0 0 DUAL 1 21 24 0 46 VREF 2 2 2 2 8 CLK 8 0(1) 0(1) 8 16
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Pinout Descriptions
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Footprint Migration Differences
Table 135 summarizes any footprint and functionality differences between the XC3S100E, the XC3S250E, and the XC3S500E FPGAs that may affect easy migration between devices in the CP132 package. There are 14 such balls. All other pins not listed in Table 135 unconditionally migrate between Spartan-3E devices available in the CP132 package. The XC3S100E is duplicated on both the left and right sides of the table to show migrations to and from the XC3S250E and the XC3S500E. The arrows indicate the direction for easy migration. A double-ended arrow ( ) indicates that Table 135: CP132 Footprint Migration Differences CP132 Ball A12 B4 B11 B12 C4 C11 D1 D2 K3 M9 M10 N9 N10 P11 Bank 0 0 0 0 0 0 3 3 3 2 2 2 2 2 XC3S100E Type N.C. INPUT N.C. N.C. N.C. INPUT N.C. I/O VREF(INPUT) N.C. N.C. N.C. N.C. VREF(INPUT) 14 Migration XC3S250E Type I/O I/O I/O I/O I/O I/O I/O I/O (Diff) VREF(I/O) DUAL DUAL DUAL DUAL VREF(I/O) 0 Migration XC3S500E Type I/O I/O I/O I/O I/O I/O I/O I/O (Diff) VREF(I/O) DUAL DUAL DUAL DUAL VREF(I/O) 14 Migration XC3S100E Type N.C. INPUT N.C. N.C. N.C. INPUT N.C. I/O VREF(INPUT) N.C. N.C. N.C. N.C. VREF(INPUT) the two pins have identical functionality. A left-facing arrow ( ) indicates that the pin on the device on the right unconditionally migrates to the pin on the device on the left. It may be possible to migrate the opposite direction depending on the I/O configuration. For example, an I/O pin (Type = I/O) can migrate to an input-only pin (Type = INPUT) if the I/O pin is configured as an input. The XC3S100E FPGA in the CP132 package has four fewer BPI-mode address lines than the XC3S250E and XC3S500E.
DIFFERENCES
Legend:
This pin is identical on the device on the left and the right. This pin can unconditionally migrate from the device on the left to the device on the right. Migration in the other direction may be possible depending on how the pin is configured for the device on the right. This pin can unconditionally migrate from the device on the right to the device on the left. Migration in the other direction may be possible depending on how the pin is configured for the device on the left.
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Pinout Descriptions
CP132 Footprint
Bank 0
1 A
PROG_B
2
TDI
3
I/O
L11P_0
4
GND
5
VCCAUX
6
VCCO_0
7
I/O
L07P_0 GCLK10
8
GND INPUT
L06P_0 GCLK8
9
I/O
L05N_0 GCLK7
10
I/O
L04P_0 GCLK4
11
VCCINT
12
I/O
L02N_0
13
I/O
L01P_0
14
TDO
B
I/O
L01N_3
I/O
L01P_3
I/O
L11N_0 HSWAP
I/O
L10P_0
I/O
L09P_0
I/O
L08P_0
I/O
L07N_0 GCLK11
I/O
L05P_0 GCLK6
VCCO_0
I/O
L03N_0 VREF_0
I/O
L02P_0
TCK
TMS
C
GND
I/O
L02N_3
I/O
L02P_3
I/O
L10N_0
I/O
L09N_0
I/O
L08N_0 VREF_0
INPUT GND
L06N_0 GCLK9
I/O
L04N_0 GCLK5
I/O
GND
L03P_0
I/O
L01N_0
I/O
L10N_1 LDC2
I/O
L10P_1 LDC1
D
I/O
L03N_3
I/O
L03P_3
I/O
VCCINT
L09N_1 LDC0
I/O
L09P_1 HDC
VCCINT
E
VCCO_3
INPUT
VREF_3
GND
VCCAUX
VCCO_1
GND
I/O
I/O
L04N_3 LHCLK1
I/O
L04P_3 LHCLK0
F
Bank 3
L05P_3 LHCLK2
I/O
A0
I/O
L08N_1 A1
I/O
L08P_1 A2
I/O
I/O
GND
L06P_3 LHCLK4 TRDY2
G
L05N_3 LHCLK3 IRDY2
INPUT
VREF_1
I/O
L07N_1 A3 RHCLK7 L06P_1 A6 RHCLK4 IRDY1
I/O
L07P_1 A4 RHCLK6
I/O
I/O
L07P_3 LHCLK6
I/O
L07N_3 LHCLK7
I/O
L06N_1 A5 RHCLK5
I/O
H
L06N_3 LHCLK5
GND
I/O
I/O
L05P_1 A8 RHCLK2
J
GND
VCCO_3
I/O I/O
VREF_3
L04N_1 A9 RHCLK1
L05N_1 A7 RHCLK3 TRDY1
I/O
K
VCCAUX
VCCINT
GND
I/O
VREF_1
I/O
L04P_1 A10 RHCLK0
L
I/O
L08P_3
I/O
L08N_3
I/O
L09P_3
I/O
VCCINT
L03P_1 A12
I/O
L03N_1 A11
M
I/O
L09N_3
I/O
L01P_2 CSO_B
I/O
GND
L03P_2 D7 GCLK12
I/O
L04P_2 D4 GCLK14
INPUT
L05P_2 RDWR_B GCLK0
I/O
GND
VCCO_2
I/O
L09N_2 A20
L08N_2 A22
I/O
L10N_2 VS1 A18
I/O
L02P_1 A14
I/O
L02N_1 A13
VCCO_1
I/O
I/O
L02N_2 MOSI CSI_B
N
L01N_2 INIT_B
INPUT
VREF_2
I/O
L03N_2 D6 GCLK13
I/O
L04N_2 D3 GCLK15
INPUT
L05N_2 M2 GCLK1
I/O
M1
I/O
L07N_2 DIN D0
I/O
L08P_2 A23
I/O
L09P_2 A21
I/O
L10P_2 VS2 A19
I/O
L11N_2 CCLK
I/O
L01P_1 A16
I/O
L01N_1 A15
I/O
P
L02P_2 DOUT BUSY
VCCINT VCCO_2
I/O
D5
I/O
GND
L06P_2 D2 GCLK2
I/O
L06N_2 D1 GCLK3
I/O
L07P_2 M0
VCCAUX
I/O
GND
VREF_2
I/O
L11P_2 VS0 A17
DONE
GND
Bank 2
DS312-4_07_030206
Figure 82: CP132 Package Footprint (top view) 16 to 22 0 to 2 I/O: Unrestricted, general-purpose user I/O INPUT: Unrestricted, general-purpose input pin CONFIG: Dedicated configuration pins N.C.: Unconnected balls on the XC3S100E FPGA ( ) 42 to 46 DUAL: Configuration pin, then possible user I/O CLK: User I/O, input, or global buffer input JTAG: Dedicated JTAG port pins GND: Ground VREF: User I/O or input voltage reference for bank VCCO: Output voltage supply for bank VCCINT: Internal core supply voltage (+1.2V) VCCAUX: Auxiliary supply voltage (+2.5V)
7 to 8
16 4 16
8 6 4
2 9
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Pinout Descriptions
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TQ144: 144-lead Thin Quad Flat Package
The XC3S100E and the XC3S250E FPGAs are available in the 144-lead thin quad flat package, TQ144. Both devices share a common footprint for this package as shown in Table 136 and Figure 83. Table 136 lists all the package pins. They are sorted by bank number and then by pin name of the largest device. Pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. The TQ144 package only supports 20 address output pins in the Byte-wide Peripheral Interface (BPI) configuration mode. In larger packages, there are 24 BPI address outputs. An electronic version of this package pinout table and footprint diagram is available for download from the Xilinx web site at http://www.xilinx.com/bvdocs/publications/s3e_pin.zip.
Pinout Table
Table 136: TQ144 Package Pinout
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 IO IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L04N_0/GCLK5 IO_L04P_0/GCLK4 IO_L05N_0/GCLK7 IO_L05P_0/GCLK6 IO_L07N_0/GCLK11 IO_L07P_0/GCLK10 IO_L08N_0/VREF_0 IO_L08P_0 IO_L09N_0 IO_L09P_0 IO_L10N_0/HSWAP IO_L10P_0 IP IP IP IP IP_L03N_0 IP_L03P_0 IP_L06N_0/GCLK9 IP_L06P_0/GCLK8 VCCO_0 VCCO_0 IO/A0 IO/VREF_1 IO_L01N_1/A15 XC3S100E Pin Name IO IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L04N_0/GCLK5 IO_L04P_0/GCLK4 IO_L05N_0/GCLK7 IO_L05P_0/GCLK6 IO_L07N_0/GCLK11 IO_L07P_0/GCLK10 IO_L08N_0/VREF_0 IO_L08P_0 IO_L09N_0 IO_L09P_0 IO_L10N_0/HSWAP IO_L10P_0 IP IP IP IP IP_L03N_0 IP_L03P_0 IP_L06N_0/GCLK9 IP_L06P_0/GCLK8 VCCO_0 VCCO_0 IO/A0 IO/VREF_1 IO_L01N_1/A15 XC3S250E Pin Name TQ144 Pin P132 P124 P113 P112 P117 P116 P123 P122 P126 P125 P131 P130 P135 P134 P140 P139 P143 P142 P111 P114 P136 P141 P120 P119 P129 P128 P121 P138 P98 P83 P75 Type I/O VREF I/O I/O I/O I/O GCLK GCLK GCLK GCLK GCLK GCLK VREF I/O I/O I/O DUAL I/O INPUT INPUT INPUT INPUT INPUT INPUT GCLK GCLK VCCO VCCO DUAL VREF DUAL
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Pinout Descriptions
Table 136: TQ144 Package Pinout (Continued)
Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 XC3S100E Pin Name IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/A11 IO_L03P_1/A12 IO_L04N_1/A9/RHCLK1 IO_L04P_1/A10/RHCLK0 IO_L05N_1/A7/RHCLK3/TRDY1 IO_L05P_1/A8/RHCLK2 IO_L06N_1/A5/RHCLK5 IO_L06P_1/A6/RHCLK4/IRDY1 IO_L07N_1/A3/RHCLK7 IO_L07P_1/A4/RHCLK6 IO_L08N_1/A1 IO_L08P_1/A2 IO_L09N_1/LDC0 IO_L09P_1/HDC IO_L10N_1/LDC2 IO_L10P_1/LDC1 IP IP IP IP IP IP/VREF_1 VCCO_1 VCCO_1 IO/D5 IO/M1 IP/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L02N_2/MOSI/CSI_B IO_L02P_2/DOUT/BUSY IO_L04N_2/D6/GCLK13 IO_L04P_2/D7/GCLK12 IO_L05N_2/D3/GCLK15 IO_L05P_2/D4/GCLK14 IO_L07N_2/D1/GCLK3 IO_L07P_2/D2/GCLK2 IO_L08N_2/DIN/D0 XC3S250E Pin Name IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/A11 IO_L03P_1/A12 IO_L04N_1/A9/RHCLK1 IO_L04P_1/A10/RHCLK0 IO_L05N_1/A7/RHCLK3 IO_L05P_1/A8/RHCLK2 IO_L06N_1/A5/RHCLK5 IO_L06P_1/A6/RHCLK4 IO_L07N_1/A3/RHCLK7 IO_L07P_1/A4/RHCLK6 IO_L08N_1/A1 IO_L08P_1/A2 IO_L09N_1/LDC0 IO_L09P_1/HDC IO_L10N_1/LDC2 IO_L10P_1/LDC1 IP IP IP IP IP IP/VREF_1 VCCO_1 VCCO_1 IO/D5 IO/M1 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L02N_2/MOSI/CSI_B IO_L02P_2/DOUT/BUSY IO_L04N_2/D6/GCLK13 IO_L04P_2/D7/GCLK12 IO_L05N_2/D3/GCLK15 IO_L05P_2/D4/GCLK14 IO_L07N_2/D1/GCLK3 IO_L07P_2/D2/GCLK2 IO_L08N_2/DIN/D0 TQ144 Pin P74 P77 P76 P82 P81 P86 P85 P88 P87 P92 P91 P94 P93 P97 P96 P104 P103 P106 P105 P78 P84 P89 P101 P107 P95 P79 P100 P52 P60 P66 P40 P39 P44 P43 P51 P50 P54 P53 P59 P58 P63 Type DUAL DUAL DUAL DUAL DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL DUAL DUAL DUAL DUAL DUAL DUAL INPUT INPUT INPUT INPUT INPUT VREF VCCO VCCO DUAL DUAL 100E: VREF(INPUT) 250E: VREF(I/O) DUAL DUAL DUAL DUAL DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL
DS312-4 (v3.4) November 9, 2006 Product Specification
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Pinout Descriptions Table 136: TQ144 Package Pinout (Continued)
Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 XC3S100E Pin Name IO_L08P_2/M0 IO_L09N_2/VS1/A18 IO_L09P_2/VS2/A19 IO_L10N_2/CCLK IO_L10P_2/VS0/A17 IP IP IP IP_L03N_2/VREF_2 IP_L03P_2 IP_L06N_2/M2/GCLK1 IP_L06P_2/RDWR_B/GCLK0 VCCO_2 VCCO_2 VCCO_2 IP/VREF_3 IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3/LHCLK1 IO_L04P_3/LHCLK0 IO_L05N_3/LHCLK3/IRDY2 IO_L05P_3/LHCLK2 IO_L06N_3/LHCLK5 IO_L06P_3/LHCLK4/TRDY2 IO_L07N_3/LHCLK7 IO_L07P_3/LHCLK6 IO_L08N_3 IO_L08P_3 IO_L09N_3 IO_L09P_3 IO_L10N_3 IO_L10P_3 IP IO IP IP XC3S250E Pin Name IO_L08P_2/M0 IO_L09N_2/VS1/A18 IO_L09P_2/VS2/A19 IO_L10N_2/CCLK IO_L10P_2/VS0/A17 IP IP IP IP_L03N_2/VREF_2 IP_L03P_2 IP_L06N_2/M2/GCLK1 IP_L06P_2/RDWR_B/GCLK0 VCCO_2 VCCO_2 VCCO_2 IO/VREF_3 IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3/LHCLK1 IO_L04P_3/LHCLK0 IO_L05N_3/LHCLK3 IO_L05P_3/LHCLK2 IO_L06N_3/LHCLK5 IO_L06P_3/LHCLK4 IO_L07N_3/LHCLK7 IO_L07P_3/LHCLK6 IO_L08N_3 IO_L08P_3 IO_L09N_3 IO_L09P_3 IO_L10N_3 IO_L10P_3 IP IP IP IP TQ144 Pin P62 P68 P67 P71 P70 P38 P41 P69 P48 P47 P57 P56 P42 P49 P64 P31 P3 P2 P5 P4 P8 P7 P15 P14 P17 P16 P21 P20 P23 P22 P26 P25 P33 P32 P35 P34 P6 P10 P18 P24 Type DUAL DUAL DUAL DUAL DUAL INPUT INPUT INPUT VREF INPUT DUAL/GCLK DUAL/GCLK VCCO VCCO VCCO 100E: VREF(INPUT) 250E: VREF(I/O) I/O I/O VREF I/O I/O I/O LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK I/O I/O I/O I/O I/O I/O INPUT 100E: I/O 250E: INPUT INPUT INPUT
R
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Pinout Descriptions
Table 136: TQ144 Package Pinout (Continued)
Bank 3 3 3 3 3 GND GND GND GND GND GND GND GND GND GND GND GND GND VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT IO IP IP/VREF_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND DONE PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT XC3S100E Pin Name IP IP IP/VREF_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND DONE PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT XC3S250E Pin Name TQ144 Pin P29 P36 P12 P13 P28 P11 P19 P27 P37 P46 P55 P61 P73 P90 P99 P118 P127 P133 P72 P1 P110 P144 P109 P108 P30 P65 P102 P137 P9 P45 P80 P115 Type 100E: I/O 250E: INPUT INPUT VREF VCCO VCCO GND GND GND GND GND GND GND GND GND GND GND GND GND CONFIG CONFIG JTAG JTAG JTAG JTAG VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT
DS312-4 (v3.4) November 9, 2006 Product Specification
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Pinout Descriptions
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User I/Os by Bank
Table 137 and Table 138 indicate how the 108 available user-I/O pins are distributed between the four I/O banks on the TQ144 package. Table 137: User I/Os Per Bank for the XC3S100E in the TQ144 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 26 28 26 28 108
All Possible I/O Pins by Type I/O 9 0 0 13 22 INPUT 6 5 4 4 19 DUAL 1 21 20 0 42 VREF 2 2 2 3 9 CLK 8 0(1) 0(1) 8 16
Table 138: User I/Os Per Bank for the XC3S250E in TQ144 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 26 28 26 28 108
All Possible I/O Pins by Type I/O 9 0 0 11 20 INPUT 6 5 4 6 21 DUAL 1 21 20 0 42 VREF 2 2 2 3 9 CLK 8 0(1) 0(1) 8 16
Footprint Migration Differences
Table 139 summarizes any footprint and functionality differences between the XC3S100E and the XC3S250E FPGAs that may affect easy migration between devices. There are four such pins. All other pins not listed in Table 139 unconditionally migrate between Spartan-3E devices available in the TQ144 package. Table 139: TQ144 Footprint Migration Differences TQ144 Pin P10 P29 P31 P66
Legend:
The arrows indicate the direction for easy migration. For example, a left-facing arrow indicates that the pin on the XC3S250E unconditionally migrates to the pin on the XC3S100E. It may be possible to migrate the opposite direction depending on the I/O configuration. For example, an I/O pin (Type = I/O) can migrate to an input-only pin (Type = INPUT) if the I/O pin is configured as an input.
Bank 3 3 3 2 I/O I/O
XC3S100E Type
Migration
XC3S250E Type INPUT INPUT VREF(I/O) VREF(I/O)
VREF(INPUT) VREF(INPUT) 4
DIFFERENCES
This pin can unconditionally migrate from the device on the left to the device on the right. Migration in the other direction may be possible depending on how the pin is configured for the device on the right. This pin can unconditionally migrate from the device on the right to the device on the left. Migration in the other direction may be possible depending on how the pin is configured for the device on the left.
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DS312-4 (v3.4) November 9, 2006 Product Specification
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Pinout Descriptions
TQ144 Footprint
Note pin 1 indicator in top-left corner and logo orientation. Double arrows ( ) indicates a pinout migration difference between the XC3S100E and XC3S250E.
132 IO 131 IO_L07N_0/GCLK11 136 IP 135 IO_L08N_0/VREF_0 130 IO_L07P_0/GCLK10 129 IP_L06N_0/GCLK9 144 TDI 143 IO_L10N_0/HSWAP 126 IO_L05N_0/GCLK7 125 IO_L05P_0/GCLK6 124 IO/VREF_0 123 IO_L04N_0/GCLK5 122 IO_L04P_0/GCLK4 121 VCCO_0 128 IP_L06P_0/GCLK8 127 GND
140 IO_L09N_0 139 IO_L09P_0
118 GND 117 IO_L02N_0
114 IP 113 IO_L01N_0
142 IO_L10P_0 141 IP
134 IO_L08P_0 133 GND
116 IO_L02P_0 115 VCCINT
112 IO_L01P_0 111 IP
120 IP_L03N_0 119 IP_L03P_0
138 VCCO_0 137 VCCAUX
PROG_B IO_L01P_3 IO_L01N_3 IO_L02P_3 IO_L02N_3/VREF_3 IP IO_L03P_3 IO_L03N_3 VCCINT ( ) IP
1 2
110 TCK 109 TDO 108 TMS 107 IP 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 IO_L10N_1/LDC2 IO_L10P_1/LDC1 IO_L09N_1/LDC0 IO_L09P_1/HDC VCCAUX IP VCCO_1 GND IO/A0 IO_L08N_1/A1 IO_L08P_1/A2 IP/VREF_1 IO_L07N_1/A3/RHCLK7 IO_L07P_1/A4/RHCLK6 IO_L06N_1/A5/RHCLK5 IO_L06P_1/A6/RHCLK4 GND IP IO_L05N_1/A7/RHCLK3 IO_L05P_1/A8/RHCLK2 IO_L04N_1/A9/RHCLK1 IO_L04P_1/A10/RHCLK0 IP IO/VREF_1 IO_L03N_1/A11 IO_L03P_1/A12 VCCINT VCCO_1 IP IO_L02N_1/A13 IO_L02P_1/A14 IO_L01N_1/A15 IO_L01P_1/A16 GND IO_L10N_2/CCLK DONE 71 72
Bank 0
3 4 5 6 7 8 9 10 GND 11 IP/VREF_3 12 VCCO_3 13 IO_L04P_3/LHCLK0 14 IO_L04N_3/LHCLK1 15 IO_L05P_3/LHCLK2 16 IO_L05N_3/LHCLK3 17 IP 18 GND 19 IO_L06P_3/LHCLK4 20 IO_L06N_3/LHCLK5 21 IO_L07P_3/LHCLK6 22 IO_L07N_3/LHCLK7 23 IP 24 IO_L08P_3 25 IO_L08N_3 26 GND 27 VCCO_3 28 ( ) IP 29 VCCAUX 30 ( ) IO/VREF_3 31 IO_L09P_3 32 IO_L09N_3 33 IO_L10P_3 34 IO_L10N_3 35 IP 36
Bank 3
Bank 2
37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 IP IO_L10P_2/VS0/A17
VCCINT GND
GND IP
GND IP_L06P_2/RDWR_B/GCLK0
IP_L03P_2 IP_L03N_2/VREF_2
IP_L06N_2/M2/GCLK1 IO_L07P_2/D2/GCLK2
IO_L07N_2/D1/GCLK3 IO/M1
IO_L01P_2/CSO_B IO_L01N_2/INIT_B
GND IO_L08P_2/M0
IO_L02P_2/DOUT/BUSY IO_L02N_2/MOSI/CSI_B
VCCO_2 IO_L04P_2/D7/GCLK12
IO_L05P_2/D4/GCLK14 IO_L05N_2/D3/GCLK15
IO_L04N_2/D6/GCLK13 IO/D5
IO_L08N_2/DIN/D0 VCCO_2
VCCAUX ) IO/VREF_2
IP VCCO_2
IO_L09P_2/VS2/A19 IO_L09N_2/VS1/A18
(
Bank 1
DS312-4_01_102605
Figure 83: TQ144 Package Footprint (top view)
20 21 2 0
I/O: Unrestricted, general-purpose user I/O INPUT: Unrestricted, general-purpose input pin CONFIG: Dedicated configuration pins N.C.: Not connected
42 16 4 13
DUAL: Configuration pin, then possible user I/O CLK: User I/O, input, or global buffer input JTAG: Dedicated JTAG port pins GND: Ground
9 9 4 4
VREF: User I/O or input voltage reference for bank VCCO: Output voltage supply for bank VCCINT: Internal core supply voltage (+1.2V) VCCAUX: Auxiliary supply voltage (+2.5V)
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Pinout Descriptions
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PQ208: 208-pin Plastic Quad Flat Package
The 208-pin plastic quad flat package, PQ208, supports two different Spartan-3E FPGAs, including the XC3S250E and the XC3S500E. Table 140 lists all the PQ208 package pins. They are sorted by bank number and then by pin name. Pairs of pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. An electronic version of this package pinout table and footprint diagram is available for download from the Xilinx website at http://www.xilinx.com/bvdocs/publications/s3e_pin.zip. Table 140: PQ208 Package Pinout (Continued)
XC3S250E XC3S500E Pin Name IO_L16N_0/HSWAP IO_L16P_0 IP IP IP IP IP_L06N_0 IP_L06P_0 IP_L09N_0/GCLK9 IP_L09P_0/GCLK8 VCCO_0 VCCO_0 VCCO_0 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/VREF_1 IO_L03P_1 IO_L04N_1 IO_L04P_1 IO_L05N_1/A11 IO_L05P_1/A12 IO_L06N_1/VREF_1 IO_L06P_1 IO_L07N_1/A9/RHCLK1 IO_L07P_1/A10/RHCLK0 IO_L08N_1/A7/RHCLK3 IO_L08P_1/A8/RHCLK2 IO_L09N_1/A5/RHCLK5 IO_L09P_1/A6/RHCLK4 IO_L10N_1/A3/RHCLK7 IO_L10P_1/A4/RHCLK6 IO_L11N_1/A1 IO_L11P_1/A2 IO_L12N_1/A0 IO_L12P_1 IO_L13N_1 IO_L13P_1 PQ208 Pin P206 P205 P159 P169 P194 P204 P175 P174 P184 P183 P176 P191 P201 P107 P106 P109 P108 P113 P112 P116 P115 P120 P119 P123 P122 P127 P126 P129 P128 P133 P132 P135 P134 P138 P137 P140 P139 P145 P144
Bank 0 0 0 0 0 0 0 0
Type DUAL I/O INPUT INPUT INPUT INPUT INPUT INPUT GCLK GCLK VCCO VCCO VCCO DUAL DUAL DUAL DUAL VREF I/O I/O I/O DUAL DUAL VREF I/O RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL DUAL DUAL DUAL I/O I/O I/O
Pinout Table
Table 140: PQ208 Package Pinout
XC3S250E XC3S500E Pin Name IO IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L02N_0/VREF_0 IO_L02P_0 IO_L03N_0 IO_L03P_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L07N_0/GCLK5 IO_L07P_0/GCLK4 IO_L08N_0/GCLK7 IO_L08P_0/GCLK6 IO_L10N_0/GCLK11 IO_L10P_0/GCLK10 IO_L11N_0 IO_L11P_0 IO_L12N_0/VREF_0 IO_L12P_0 IO_L13N_0 IO_L13P_0 IO_L14N_0/VREF_0 IO_L14P_0 IO_L15N_0 IO_L15P_0 PQ208 Pin P187 P179 P161 P160 P163 P162 P165 P164 P168 P167 P172 P171 P178 P177 P181 P180 P186 P185 P190 P189 P193 P192 P197 P196 P200 P199 P203 P202
0 0 Type I/O VREF I/O I/O VREF I/O I/O I/O VREF I/O I/O I/O GCLK GCLK GCLK GCLK GCLK GCLK I/O I/O VREF I/O I/O I/O VREF I/O I/O I/O 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
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Pinout Descriptions Table 140: PQ208 Package Pinout (Continued)
XC3S250E XC3S500E Pin Name IO_L14N_2/A22 IO_L14P_2/A23 IO_L15N_2/A20 IO_L15P_2/A21 IO_L16N_2/VS1/A18 IO_L16P_2/VS2/A19 IO_L17N_2/CCLK IO_L17P_2/VS0/A17 IP IP IP IP_L02N_2 IP_L02P_2 IP_L07N_2/VREF_2 IP_L07P_2 IP_L10N_2/M2/GCLK1 IP_L10P_2/RDWR_B/ GCLK0 VCCO_2 VCCO_2 VCCO_2 IO/VREF_3 IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3 IO_L04P_3 IO_L05N_3 IO_L05P_3 IO_L06N_3 IO_L06P_3 IO_L07N_3/LHCLK1 IO_L07P_3/LHCLK0 IO_L08N_3/LHCLK3 IO_L08P_3/LHCLK2 IO_L09N_3/LHCLK5 IO_L09P_3/LHCLK4 IO_L10N_3/LHCLK7 PQ208 Pin P94 P93 P97 P96 P100 P99 P103 P102 P54 P91 P101 P58 P57 P72 P71 P81 P80 P59 P73 P88 P45 P3 P2 P5 P4 P9 P8 P12 P11 P16 P15 P19 P18 P23 P22 P25 P24 P29 P28 P31
Table 140: PQ208 Package Pinout (Continued)
XC3S250E XC3S500E Pin Name IO_L14N_1 IO_L14P_1 IO_L15N_1/LDC0 IO_L15P_1/HDC IO_L16N_1/LDC2 IO_L16P_1/LDC1 IP IP IP IP IP IP IP IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 IO/D5 IO/M1 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2 IO_L06P_2 IO_L08N_2/D6/GCLK13 IO_L08P_2/D7/GCLK12 IO_L09N_2/D3/GCLK15 IO_L09P_2/D4/GCLK14 IO_L11N_2/D1/GCLK3 IO_L11P_2/D2/GCLK2 IO_L12N_2/DIN/D0 IO_L12P_2/M0 IO_L13N_2 IO_L13P_2 PQ208 Pin P147 P146 P151 P150 P153 P152 P110 P118 P124 P130 P142 P148 P154 P136 P114 P125 P143 P76 P84 P98 P56 P55 P61 P60 P63 P62 P65 P64 P69 P68 P75 P74 P78 P77 P83 P82 P87 P86 P90 P89
Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
Type I/O I/O DUAL DUAL DUAL DUAL INPUT INPUT INPUT INPUT INPUT INPUT INPUT VREF VCCO VCCO VCCO DUAL DUAL VREF DUAL DUAL DUAL DUAL I/O I/O I/O I/O I/O I/O DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL DUAL I/O I/O
Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
Type DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL INPUT INPUT INPUT INPUT INPUT VREF INPUT DUAL/GCLK DUAL/GCLK VCCO VCCO VCCO VREF I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK
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Pinout Descriptions Table 140: PQ208 Package Pinout (Continued)
XC3S250E XC3S500E Pin Name IO_L10P_3/LHCLK6 IO_L11N_3 IO_L11P_3 IO_L12N_3 IO_L12P_3 IO_L13N_3 IO_L13P_3 IO_L14N_3 IO_L14P_3 IO_L15N_3 IO_L15P_3 IO_L16N_3 IO_L16P_3 IP IP IP IP IP IP IP/VREF_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND PQ208 Pin P30 P34 P33 P36 P35 P40 P39 P42 P41 P48 P47 P50 P49 P6 P14 P26 P32 P43 P51 P20 P21 P38 P46 P10 P17 P27 P37 P52 P53 P70 P79 P85 P95 P105 P121 P131 P141 P156 P173 P182
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Table 140: PQ208 Package Pinout (Continued)
XC3S250E XC3S500E Pin Name GND GND GND DONE PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT PQ208 Pin P188 P198 P208 P104 P1 P158 P207 P157 P155 P7 P44 P66 P92 P111 P149 P166 P195 P13 P67 P117 P170
Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND
Type LHCLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O INPUT INPUT INPUT INPUT INPUT INPUT VREF VCCO VCCO VCCO GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND
Bank GND GND GND VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT
Type GND GND GND CONFIG CONFIG JTAG JTAG JTAG JTAG VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT
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Pinout Descriptions
User I/Os by Bank
Table 141 indicates how the 158 available user-I/O pins are distributed between the four I/O banks on the PQ208 package.
Footprint Migration Differences
The XC3S250E and XC3S500E FPGAs have identical footprints in the PQ208 package. Designs can migrate between the XC3S250E and XC3S500E without further consideration.
Table 141: User I/Os Per Bank for the XC3S250E and XC3S500E in the PQ208 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 38 40 40 40 158
All Possible I/O Pins by Type I/O 18 9 8 23 58 INPUT 6 7 6 6 25 DUAL 1 21 24 0 46 VREF 5 3 2 3 13 CLK 8 0(1) 0(1) 8 16
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Pinout Descriptions
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PQ208 Footprint (Left)
187 IO 186 IO_L10N_0/GCLK11 185 IO_L10P_0/GCLK10 184 IP_L09N_0/GCLK9 74 75 76 77 IO_L08P_2/D7/GCLK12 IO_L08N_2/D6/GCLK13 IO/D5 IO_L09P_2/D4/GCLK14 203 IO_L15N_0 202 IO_L15P_0 201 VCCO_0 200 IO_L14N_0/VREF_0 199 IO_L14P_0 193 IO_L12N_0/VREF_0 192 IO_L12P_0 191 VCCO_0 GND TDI IO_L16N_0/HSWAP IO_L16P_0 IP 183 IP_L09P_0/GCLK8 182 GND 78 IO_L09N_2/D3/GCLK15 GND 79
198 GND 197 IO_L13N_0 196 IO_L13P_0 195 VCCAUX 194 IP
PROG_B IO_L01P_3 IO_L01N_3 IO_L02P_3 IO_L02N_3/VREF_3 IP VCCAUX IO_L03P_3 IO_L03N_3 GND IO_L04P_3 IO_L04N_3 VCCINT IP IO_L05P_3 IO_L05N_3 GND IO_L06P_3 IO_L06N_3 IP/VREF_3 VCCO_3 IO_L07P_3/LHCLK0 IO_L07N_3/LHCLK1 IO_L08P_3/LHCLK2 IO_L08N_3/LHCLK3 IP GND IO_L09P_3/LHCLK4 IO_L09N_3/LHCLK5 IO_L10P_3/LHCLK6 IO_L10N_3/LHCLK7 IP IO_L11P_3 IO_L11N_3 IO_L12P_3 IO_L12N_3 GND VCCO_3 IO_L13P_3 IO_L13N_3 IO_L14P_3 IO_L14N_3 IP VCCAUX IO/VREF_3 VCCO_3 IO_L15P_3 IO_L15N_3 IO_L16P_3 IO_L16N_3 IP GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52
Bank 0
Bank 3
Bank 2
53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 IP_L07P_2 IP_L07N_2/VREF_2 IP_L02N_2 VCCO_2 IO_L03P_2/DOUT/BUSY GND IP IO_L01P_2/CSO_B IO_L01N_2/INIT_B IP_L02P_2 IO_L03N_2/MOSI/CSI_B IO_L04P_2 IO_L04N_2 IO_L05P_2 IO_L05N_2 IO_L06P_2 IO_L06N_2 GND VCCAUX VCCINT VCCO_2 73
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Figure 84: PQ208 Footprint (Left)
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190 IO_L11N_0 189 IO_L11P_0 188 GND
208 207 206 205 204
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Pinout Descriptions
PQ208 Footprint (Right)
181 IO_L08N_0/GCLK7 180 IO_L08P_0/GCLK6 179 IO/VREF_0 178 IO_L07N_0/GCLK5 177 IO_L07P_0/GCLK4 176 VCCO_0 175 IP_L06N_0 174 IP_L06P_0 173 GND 172 IO_L05N_0 IO_L05P_0 VCCINT IP IO_L04N_0/VREF_0 IO_L04P_0 VCCAUX IO_L03N_0 IO_L03P_0 IO_L02N_0/VREF_0 IO_L02P_0 171 170 169 168 167 166 165 164 163 162
161 IO_L01N_0 160 IO_L01P_0 159 IP 158 TCK 157 TDO 156 GND 155 TMS 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 IP IO_L16N_1/LDC2 IO_L16P_1/LDC1 IO_L15N_1/LDC0 IO_L15P_1/HDC VCCAUX IP IO_L14N_1 IO_L14P_1 IO_L13N_1 IO_L13P_1 VCCO_1 IP GND IO_L12N_1/A0 IO_L12P_1 IO_L11N_1/A1 IO_L11P_1/A2 IP/VREF_1 IO_L10N_1/A3/RHCLK7 IO_L10P_1/A4/RHCLK6 IO_L09N_1/A5/RHCLK5 IO_L09P_1/A6/RHCLK4 GND IP IO_L08N_1/A7/RHCLK3 IO_L08P_1/A8/RHCLK2 IO_L07N_1/A9/RHCLK1 IO_L07P_1/A10/RHCLK VCCO_1 IP IO_L06N_1/VREF_1 IO_L06P_1 GND IO_L05N_1/A11 IO_L05P_1/A12 IP VCCINT IO_L04N_1 IO_L04P_1 VCCO_1 IO_L03N_1/VREF_1 IO_L03P_1 VCCAUX IP IO_L02N_1/A13 IO_L02P_1/A14 IO_L01N_1/A15 IO_L01P_1/A16 GND IO_L16N_2/VS1/A18 100 IP 101 IO_L17P_2/VS0/A17 102 IO_L17N_2/CCLK 103 DONE 104
Bank 0
Bank 2
80 81 82 83 84 85 86 87 IP_L10P_2/RDWR_B/GCLK0 IP_L10N_2/M2/GCLK1 IO_L11P_2/D2/GCLK2 IO_L11N_2/D1/GCLK3 IO/M1 IO_L13N_2 IP VCCAUX IO_L14P_2/A23 IO_L14N_2/A22 GND IO_L15P_2/A21 IO_L15N_2/A20 IO/VREF_2 IO_L16P_2/VS2/A19 IO_L12N_2/DIN/D0 VCCO_2 IO_L13P_2 GND IO_L12P_2/M0 88 89 90 91 92 93 94 95 96 97 98 99
Bank 1
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Figure 85: PQ208 Footprint (Right)
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Pinout Descriptions
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FT256: 256-ball Fine-pitch, Thin Ball Grid Array
The 256-ball fine-pitch, thin ball grid array package, FT256, supports three different Spartan-3E FPGAs, including the XC3S250E, the XC3S500E, and the XC3S1200E. Table 142 lists all the package pins. They are sorted by bank number and then by pin name of the largest device. Pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. The highlighted rows indicate pinout differences between the XC3S250E, the XC3S500E, and the XC3S1200E FPGAs. The XC3S250E has 18 unconnected balls, indicated as N.C. (No Connection) in Table 142 and with the black diamond character ( ) in Table 142 and Figure 86. If the table row is highlighted in tan, then this is an instance where an unconnected pin on the XC3S250E FPGA maps to a VREF pin on the XC3S500E and XC3S1200E FPGA. If the FPGA application uses an I/O standard that requires a VREF voltage reference, connect the highlighted pin to the VREF voltage supply, even though this does not actually connect to the XC3S250E FPGA. This VREF connection on the board allows future migration to the larger devices without modifying the printed-circuit board. All other balls have nearly identical functionality on all three devices. Table 146 summarizes the Spartan-3E footprint migration differences for the FT256 package. An electronic version of this package pinout table and footprint diagram is available for download from the Xilinx web site at http://www.xilinx.com/bvdocs/publications/s3e_pin.zip.
Pinout Table
Table 142: FT256 Package Pinout
Bank 0 0 0 0 IO IO IO IP XC3S250E Pin Name IO IO IO IP XC3S500E Pin Name IO IO IO IO XC3S1200E Pin Name FT256 Ball A7 A12 B4 B6 Type I/O I/O I/O 250E: INPUT 500E: INPUT 1200E: I/O 0 IP IP IO B10 250E: INPUT 500E: INPUT 1200E: I/O 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0 IO_L04P_0 IO_L05N_0/VREF_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L08N_0/GCLK5 IO_L08P_0/GCLK4 IO_L09N_0/GCLK7 IO_L09P_0/GCLK6 IO_L11N_0/GCLK11 IO_L11P_0/GCLK10 IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0 IO_L04P_0 IO_L05N_0/VREF_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L08N_0/GCLK5 IO_L08P_0/GCLK4 IO_L09N_0/GCLK7 IO_L09P_0/GCLK6 IO_L11N_0/GCLK11 IO_L11P_0/GCLK10 IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0 IO_L04P_0 IO_L05N_0/VREF_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L08N_0/GCLK5 IO_L08P_0/GCLK4 IO_L09N_0/GCLK7 IO_L09P_0/GCLK6 IO_L11N_0/GCLK11 IO_L11P_0/GCLK10 D9 A14 B14 A13 B13 E11 D11 B11 C11 E10 D10 F9 E9 A9 A10 D8 C8 VREF I/O I/O VREF I/O I/O I/O VREF I/O I/O I/O GCLK GCLK GCLK GCLK GCLK GCLK
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Pinout Descriptions
Table 142: FT256 Package Pinout (Continued)
Bank 0 0 0 XC3S250E Pin Name IO_L12N_0 IO_L12P_0 N.C. ( ) XC3S500E Pin Name IO_L12N_0 IO_L12P_0 IO_L13N_0 XC3S1200E Pin Name IO_L12N_0 IO_L12P_0 IO_L13N_0 FT256 Ball F8 E8 C7 Type I/O I/O 250E: N.C. 500E: I/O 1200E: I/O 0 N.C. ( ) IO_L13P_0 IO_L13P_0 B7 250E: N.C. 500E: I/O 1200E: I/O 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 IO_L14N_0/VREF_0 IO_L14P_0 IO_L15N_0 IO_L15P_0 IO_L17N_0/VREF_0 IO_L17P_0 IO_L18N_0 IO_L18P_0 IO_L19N_0/HSWAP IO_L19P_0 IP IP IP_L02N_0 IP_L02P_0 IP_L07N_0 IP_L07P_0 IP_L10N_0/GCLK9 IP_L10P_0/GCLK8 IP_L16N_0 IP_L16P_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 N.C. ( ) IO_L14N_0/VREF_0 IO_L14P_0 IO_L15N_0 IO_L15P_0 IO_L17N_0/VREF_0 IO_L17P_0 IO_L18N_0 IO_L18P_0 IO_L19N_0/HSWAP IO_L19P_0 IP IP IP_L02N_0 IP_L02P_0 IP_L07N_0 IP_L07P_0 IP_L10N_0/GCLK9 IP_L10P_0/GCLK8 IP_L16N_0 IP_L16P_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/VREF_1 IO_L14N_0/VREF_0 IO_L14P_0 IO_L15N_0 IO_L15P_0 IO_L17N_0/VREF_0 IO_L17P_0 IO_L18N_0 IO_L18P_0 IO_L19N_0/HSWAP IO_L19P_0 IP IP IP_L02N_0 IP_L02P_0 IP_L07N_0 IP_L07P_0 IP_L10N_0/GCLK9 IP_L10P_0/GCLK8 IP_L16N_0 IP_L16P_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/VREF_1 D7 E7 D6 C6 A4 A5 C4 C5 B3 C3 A3 C13 C12 D12 C9 C10 B8 A8 E6 D5 B5 B12 F7 F10 R15 R16 P15 P16 N15 VREF I/O I/O I/O VREF I/O I/O I/O DUAL I/O INPUT INPUT INPUT INPUT INPUT INPUT GCLK GCLK INPUT INPUT VCCO VCCO VCCO VCCO DUAL DUAL DUAL DUAL 250E: N.C. 500E: VREF 1200E: VREF 1 N.C. ( ) IO_L03P_1 IO_L03P_1 N14 250E: N.C. 500E: I/O 1200E: I/O
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Pinout Descriptions Table 142: FT256 Package Pinout (Continued)
Bank 1 1 1 XC3S250E Pin Name IO_L04N_1/VREF_1 IO_L04P_1 N.C. ( ) XC3S500E Pin Name IO_L04N_1/VREF_1 IO_L04P_1 IO_L05N_1 XC3S1200E Pin Name IO_L04N_1/VREF_1 IO_L04P_1 IO_L05N_1 FT256 Ball M16 N16 L13 Type VREF I/O 250E: N.C. 500E: I/O 1200E: I/O 1 N.C. ( ) IO_L05P_1 IO_L05P_1 L12 250E: N.C. 500E: I/O 1200E: I/O 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 IO_L06N_1 IO_L06P_1 IO_L07N_1/A11 IO_L07P_1/A12 IO_L08N_1/VREF_1 IO_L08P_1 IO_L09N_1/A9/RHCLK1 IO_L09P_1/A10/RHCLK0 IO_L10N_1/A7/RHCLK3/ TRDY1 IO_L10P_1/A8/RHCLK2 IO_L11N_1/A5/RHCLK5 IO_L11P_1/A6/RHCLK4/ IRDY1 IO_L12N_1/A3/RHCLK7 IO_L12P_1/A4/RHCLK6 IO_L13N_1/A1 IO_L13P_1/A2 IO_L14N_1/A0 IO_L14P_1 IO_L15N_1 IO_L15P_1 IO_L16N_1 IO_L16P_1 N.C. ( ) IO_L06N_1 IO_L06P_1 IO_L07N_1/A11 IO_L07P_1/A12 IO_L08N_1/VREF_1 IO_L08P_1 IO_L09N_1/A9/RHCLK1 IO_L09P_1/A10/RHCLK0 IO_L10N_1/A7/RHCLK3/ TRDY1 IO_L10P_1/A8/RHCLK2 IO_L11N_1/A5/RHCLK5 IO_L11P_1/A6/RHCLK4/ IRDY1 IO_L12N_1/A3/RHCLK7 IO_L12P_1/A4/RHCLK6 IO_L13N_1/A1 IO_L13P_1/A2 IO_L14N_1/A0 IO_L14P_1 IO_L15N_1 IO_L15P_1 IO_L16N_1 IO_L16P_1 IO_L17N_1 IO_L06N_1 IO_L06P_1 IO_L07N_1/A11 IO_L07P_1/A12 IO_L08N_1/VREF_1 IO_L08P_1 IO_L09N_1/A9/RHCLK1 IO_L09P_1/A10/RHCLK0 IO_L10N_1/A7/RHCLK3/ TRDY1 IO_L10P_1/A8/RHCLK2 IO_L11N_1/A5/RHCLK5 IO_L11P_1/A6/RHCLK4/ IRDY1 IO_L12N_1/A3/RHCLK7 IO_L12P_1/A4/RHCLK6 IO_L13N_1/A1 IO_L13P_1/A2 IO_L14N_1/A0 IO_L14P_1 IO_L15N_1 IO_L15P_1 IO_L16N_1 IO_L16P_1 IO_L17N_1 L15 L14 K12 K13 K14 K15 J16 K16 J13 J14 H14 H15 H11 H12 G16 G15 G14 G13 F15 F14 F12 F13 E16 I/O I/O DUAL DUAL VREF I/O RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL DUAL DUAL DUAL I/O I/O I/O I/O I/O 250E: N.C. 500E: I/O 1200E: I/O 1 N.C. ( ). IO_L17P_1 IO_L17P_1 E13 250E: N.C. 500E: I/O 1200E: I/O 1 1 1 1 IO_L18N_1/LDC0 IO_L18P_1/HDC IO_L19N_1/LDC2 IO_L19P_1/LDC1 IO_L18N_1/LDC0 IO_L18P_1/HDC IO_L19N_1/LDC2 IO_L19P_1/LDC1 IO_L18N_1/LDC0 IO_L18P_1/HDC IO_L19N_1/LDC2 IO_L19P_1/LDC1 D14 D15 C15 C16 DUAL DUAL DUAL DUAL
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Pinout Descriptions
Table 142: FT256 Package Pinout (Continued)
Bank 1 1 1 1 1 1 1 1 IP IP IP IP IP IP IP IO XC3S250E Pin Name IP IP IP IP IP IP IP IO XC3S500E Pin Name IP IP IP IP IP IP IP IP XC3S1200E Pin Name FT256 Ball B16 E14 G12 H16 J11 J12 M13 M14 Type INPUT INPUT INPUT INPUT INPUT INPUT INPUT 250E: I/O 500E: I/O 1200E: INPUT 1 IO/VREF_1 IP/VREF_1 IP/VREF_1 D16 250E: VREF(I/O) 500E: VREF(INPUT) 1200E: VREF(INPUT) 1 1 1 1 1 2 IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 IP IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 IP IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 IO H13 E15 G11 K11 M15 M7 VREF VCCO VCCO VCCO VCCO 250E: INPUT 500E: INPUT 1200E: I/O 2 IP IP IO T12 250E: INPUT 500E: INPUT 1200E: I/O 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 IO/D5 IO/M1 IO/VREF_2 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2 IO_L06P_2 N.C. ( ) IO/D5 IO/M1 IO/VREF_2 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2 IO_L06P_2 IO_L07N_2 IO/D5 IO/M1 IO/VREF_2 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2 IO_L06P_2 IO_L07N_2 T8 T10 P13 R4 P4 P3 N5 P5 T5 T4 N6 M6 P6 R6 P7 DUAL DUAL VREF VREF DUAL DUAL DUAL DUAL I/O I/O I/O I/O I/O I/O 250E: N.C. 500E: I/O 1200E: I/O
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Pinout Descriptions Table 142: FT256 Package Pinout (Continued)
Bank 2 XC3S250E Pin Name N.C. ( ) XC3S500E Pin Name IO_L07P_2 XC3S1200E Pin Name IO_L07P_2 FT256 Ball N7 Type 250E: N.C. 500E: I/O 1200E: I/O 2 2 2 2 2 2 2 2 2 IO_L09N_2/D6/GCLK13 IO_L09P_2/D7/GCLK12 IO_L10N_2/D3/GCLK15 IO_L10P_2/D4/GCLK14 IO_L12N_2/D1/GCLK3 IO_L12P_2/D2/GCLK2 IO_L13N_2/DIN/D0 IO_L13P_2/M0 N.C. ( ) IO_L09N_2/D6/GCLK13 IO_L09P_2/D7/GCLK12 IO_L10N_2/D3/GCLK15 IO_L10P_2/D4/GCLK14 IO_L12N_2/D1/GCLK3 IO_L12P_2/D2/GCLK2 IO_L13N_2/DIN/D0 IO_L13P_2/M0 IO_L14N_2/VREF_2 IO_L09N_2/D6/GCLK13 IO_L09P_2/D7/GCLK12 IO_L10N_2/D3/GCLK15 IO_L10P_2/D4/GCLK14 IO_L12N_2/D1/GCLK3 IO_L12P_2/D2/GCLK2 IO_L13N_2/DIN/D0 IO_L13P_2/M0 IO_L14N_2/VREF_2 L8 M8 P8 N8 N9 P9 M9 L9 R10 DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL DUAL 250E: N.C. 500E: VREF 1200E: VREF 2 N.C. ( ) IO_L14P_2 IO_L14P_2 P10 250E: N.C. 500E: I/O 1200E: I/O 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 IO_L15N_2 IO_L15P_2 IO_L16N_2/A22 IO_L16P_2/A23 IO_L18N_2/A20 IO_L18P_2/A21 IO_L19N_2/VS1/A18 IO_L19P_2/VS2/A19 IO_L20N_2/CCLK IO_L20P_2/VS0/A17 IP IP IP_L02N_2 IP_L02P_2 IP_L08N_2/VREF_2 IP_L08P_2 IP_L11N_2/M2/GCLK1 IP_L11P_2/RDWR_B/ GCLK0 IP_L17N_2 IP_L17P_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 IO_L15N_2 IO_L15P_2 IO_L16N_2/A22 IO_L16P_2/A23 IO_L18N_2/A20 IO_L18P_2/A21 IO_L19N_2/VS1/A18 IO_L19P_2/VS2/A19 IO_L20N_2/CCLK IO_L20P_2/VS0/A17 IP IP IP_L02N_2 IP_L02P_2 IP_L08N_2/VREF_2 IP_L08P_2 IP_L11N_2/M2/GCLK1 IP_L11P_2/RDWR_B/ GCLK0 IP_L17N_2 IP_L17P_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 IO_L15N_2 IO_L15P_2 IO_L16N_2/A22 IO_L16P_2/A23 IO_L18N_2/A20 IO_L18P_2/A21 IO_L19N_2/VS1/A18 IO_L19P_2/VS2/A19 IO_L20N_2/CCLK IO_L20P_2/VS0/A17 IP IP IP_L02N_2 IP_L02P_2 IP_L08N_2/VREF_2 IP_L08P_2 IP_L11N_2/M2/GCLK1 IP_L11P_2/RDWR_B/ GCLK0 IP_L17N_2 IP_L17P_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 M10 N10 P11 R11 N12 P12 R13 T13 R14 P14 T2 T14 R3 T3 T7 R7 R9 T9 M11 N11 L7 L10 R5 R12 I/O I/O DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL INPUT INPUT INPUT INPUT VREF INPUT DUAL/GCLK DUAL/GCLK INPUT INPUT VCCO VCCO VCCO VCCO
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Table 142: FT256 Package Pinout (Continued)
Bank 3 3 3 3 3 3 3 XC3S250E Pin Name IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 N.C. ( ) XC3S500E Pin Name IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3/VREF_3 XC3S1200E Pin Name IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3/VREF_3 FT256 Ball B2 B1 C2 C1 E4 E3 F4 Type I/O I/O VREF I/O I/O I/O 250E: N.C. 500E: VREF 1200E: VREF 3 N.C. ( ) IO_L04P_3 IO_L04P_3 F3 250E: N.C. 500E: I/O 1200E: I/O 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 IO_L05N_3 IO_L05P_3 IO_L06N_3 IO_L06P_3 IO_L07N_3 IO_L07P_3 IO_L08N_3/LHCLK1 IO_L08P_3/LHCLK0 IO_L09N_3/LHCLK3/ IRDY2 IO_L09P_3/LHCLK2 IO_L10N_3/LHCLK5 IO_L10P_3/LHCLK4/ TRDY2 IO_L11N_3/LHCLK7 IO_L11P_3/LHCLK6 IO_L12N_3 IO_L12P_3 IO_L13N_3 IO_L13P_3 N.C. ( ) IO_L05N_3 IO_L05P_3 IO_L06N_3 IO_L06P_3 IO_L07N_3 IO_L07P_3 IO_L08N_3/LHCLK1 IO_L08P_3/LHCLK0 IO_L09N_3/LHCLK3/ IRDY2 IO_L09P_3/LHCLK2 IO_L10N_3/LHCLK5 IO_L10P_3/LHCLK4/ TRDY2 IO_L11N_3/LHCLK7 IO_L11P_3/LHCLK6 IO_L12N_3 IO_L12P_3 IO_L13N_3 IO_L13P_3 IO_L14N_3/VREF_3 IO_L05N_3 IO_L05P_3 IO_L06N_3 IO_L06P_3 IO_L07N_3 IO_L07P_3 IO_L08N_3/LHCLK1 IO_L08P_3/LHCLK0 IO_L09N_3/LHCLK3/ IRDY2 IO_L09P_3/LHCLK2 IO_L10N_3/LHCLK5 IO_L10P_3/LHCLK4/ TRDY2 IO_L11N_3/LHCLK7 IO_L11P_3/LHCLK6 IO_L12N_3 IO_L12P_3 IO_L13N_3 IO_L13P_3 IO_L14N_3/VREF_3 E1 D1 G4 G5 G2 G3 H6 H5 H4 H3 J3 J2 J4 J5 K1 J1 K3 K2 L2 I/O I/O I/O I/O I/O I/O LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK I/O I/O I/O I/O 250E: N.C. 500E: VREF 1200E: VREF 3 N.C. ( ) IO_L14P_3 IO_L14P_3 L3 250E: N.C. 500E: I/O 1200E: I/O 3 3 3 3 IO_L15N_3 IO_L15P_3 IO_L16N_3 IO_L16P_3 IO_L15N_3 IO_L15P_3 IO_L16N_3 IO_L16P_3 IO_L15N_3 IO_L15P_3 IO_L16N_3 IO_L16P_3 L5 K5 N1 M1 I/O I/O I/O I/O
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Pinout Descriptions Table 142: FT256 Package Pinout (Continued)
Bank 3 XC3S250E Pin Name N.C. ( ) XC3S500E Pin Name IO_L17N_3 XC3S1200E Pin Name IO_L17N_3 FT256 Ball L4 Type 250E: N.C. 500E: I/O 1200E: I/O 3 N.C. ( ) IO_L17P_3 IO_L17P_3 M4 250E: N.C. 500E: I/O 1200E: I/O 3 3 3 3 3 3 3 IO_L18N_3 IO_L18P_3 IO_L19N_3 IO_L19P_3 IP IP IO IO_L18N_3 IO_L18P_3 IO_L19N_3 IO_L19P_3 IP IP IO IO_L18N_3 IO_L18P_3 IO_L19N_3 IO_L19P_3 IP IP IP P1 P2 R1 R2 D2 F2 F5 I/O I/O I/O I/O INPUT INPUT 250E: I/O 500E: I/O 1200E: INPUT 3 3 3 3 3 3 3 IP IP IP IP IP IP/VREF_3 IO/VREF_3 IP IP IP IP IP IP/VREF_3 IO/VREF_3 IP IP IP IP IP IP/VREF_3 IP/VREF_3 H1 J6 K4 M3 N3 G1 N2 INPUT INPUT INPUT INPUT INPUT VREF 250E: VREF(I/O) 500E: VREF(I/O) 1200E: VREF(INPUT) 3 3 3 3 GND GND GND GND GND GND GND GND GND GND GND GND GND VCCO_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND VCCO_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND VCCO_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND E2 G6 K6 M2 A1 A16 B9 F6 F11 G7 G8 G9 G10 H2 H7 H8 H9 VCCO VCCO VCCO VCCO GND GND GND GND GND GND GND GND GND GND GND GND GND
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Pinout Descriptions
Table 142: FT256 Package Pinout (Continued)
Bank GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S250E Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DONE PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S500E Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DONE PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S1200E Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DONE PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT FT256 Ball H10 J7 J8 J9 J10 J15 K7 K8 K9 K10 L6 L11 R8 T1 T16 T15 D3 A15 A2 C14 B15 A6 A11 F1 F16 L1 L16 T6 T11 D4 D13 E5 E12 M5 M12 N4 N13 Type GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND CONFIG CONFIG JTAG JTAG JTAG JTAG VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
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Pinout Descriptions
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User I/Os by Bank
Table 143, Table 144, and Table 145 indicate how the available user-I/O pins are distributed between the four I/O banks on the FT256 package.
The XC3S250E FPGA in the FT256 package has 18 unconnected balls, labeled with an "N.C." type. These pins are also indicated with the black diamond ( ) symbol in Figure 86.
Table 143: User I/Os Per Bank on XC3S250E in the FT256 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 44 42 44 42 172
All Possible I/O Pins by Type I/O 20 10 8 24 62 INPUT 10 7 9 7 33 DUAL 1 21 24 0 46 VREF 5 4 3 3 15 CLK 8 0(1) 0(1) 8 16
Table 144: User I/Os Per Bank on XC3S500E in the FT256 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1.
.
I/O Bank 0 1 2 3
Maximum I/O 46 48 48 48 190
All Possible I/O Pins by Type I/O 22 15 11 28 76 INPUT 10 7 9 7 33 DUAL 1 21 24 0 46 VREF 5 5 4 5 19 CLK 8 0(1) 0(1) 8 16
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
Table 145: User I/Os Per Bank on XC3S1200E in the FT256 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 46 48 48 48 190
All Possible I/O Pins by Type I/O 24 14 13 27 78 INPUT 8 8 7 8 31 DUAL 1 21 24 0 46 VREF 5 5 4 5 19 CLK 8 0(1) 0(1) 8 16
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Pinout Descriptions
Footprint Migration Differences
Table 146 summarizes any footprint and functionality differences between the XC3S250E, the XC3S500E, and the XC3S1200E FPGAs that may affect easy migration between devices in the FG256 package. There are 26 such balls. All other pins not listed in Table 146 unconditionally migrate between Spartan-3E devices available in the FT256 package. The XC3S250E is duplicated on both the left and right sides of the table to show migrations to and from the XC3S500E Table 146: FT256 Footprint Migration Differences FT256 Ball B6 B7 B10 C7 D16 E13 E16 F3 F4 F5 L2 L3 L4 L12 L13 M4 M7 M14 N2 N7 N14 N15 P7 P10 R10 T12
Legend:
This pin is identical on the device on the left and the right. This pin can unconditionally migrate from the device on the left to the device on the right. Migration in the other direction may be possible depending on how the pin is configured for the device on the right. This pin can unconditionally migrate from the device on the right to the device on the left. Migration in the other direction may be possible depending on how the pin is configured for the device on the left.
and the XC3S1200E. The arrows indicate the direction for easy migration. A double-ended arrow ( ) indicates that the two pins have identical functionality. A left-facing arrow ( ) indicates that the pin on the device on the right unconditionally migrates to the pin on the device on the left. It may be possible to migrate the opposite direction depending on the I/O configuration. For example, an I/O pin (Type = I/O) can migrate to an input-only pin (Type = INPUT) if the I/O pin is configured as an input.
Bank 0 0 0 0 1 1 1 3 3 3 3 3 3 1 1 3 2 1 3 2 1 1 2 2 2 2
XC3S250E Type INPUT N.C. INPUT N.C. VREF(I/O) N.C. N.C. N.C. N.C. I/O N.C. N.C. N.C. N.C. N.C. N.C. INPUT I/O VREF(I/O) N.C. N.C. N.C. N.C. N.C. N.C. INPUT
Migration
XC3S500E Type INPUT I/O INPUT I/O VREF(INPUT) I/O I/O I/O VREF I/O VREF I/O I/O I/O I/O I/O INPUT I/O VREF(I/O) I/O I/O VREF I/O I/O VREF INPUT
Migration
XC3S1200E Type I/O I/O I/O I/O VREF(INPUT) I/O I/O I/O VREF INPUT VREF I/O I/O I/O I/O I/O I/O INPUT VREF(INPUT) I/O I/O VREF I/O I/O VREF I/O
Migration
XC3S250E Type INPUT N.C. INPUT N.C. VREF(I/O) N.C. N.C. N.C. N.C. I/O N.C. N.C. N.C. N.C. N.C. N.C. INPUT I/O VREF(I/O) N.C. N.C. N.C. N.C. N.C. N.C. INPUT
DIFFERENCES
19
7
26
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Pinout Descriptions
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FT256 Footprint
Bank 0 8 9
INPUT
VCCAUX
1 A
GND
2
TDI
3
INPUT I/O
L19N_0 HSWAP
4
I/O
L17N_0 VREF_0
5
I/O
L17P_0
6
7
I/O I/O
L13P_0
10
I/O
L09P_0 GCLK6
11
VCCAUX
12
I/O
13
I/O
L03N_0 VREF_0
14
I/O
L01N_0
15
TCK
16
GND
I/O
L09N_0 GCLK7
L10P_0 GCLK8
B
I/O
L01P_3
I/O
L01N_3
I/O
VCCO_0
INPUT
INPUT
L10N_0 GCLK9
GND
INPUT
I/O
L05N_0 VREF_0 VCCO_0
I/O
L03P_0
I/O
L01P_0
TMS I/O
INPUT I/O
L19P_1 LDC1
C
I/O
L02P_3
I/O
L02N_3 VREF_3
I/O
L19P_0
I/O
L18N_0
I/O
L18P_0
I/O
L15P_0
I/O
L13N_0
I/O
L11P_0 GCLK10
INPUT
L07N_0
INPUT
L07P_0
I/O
L05P_0
INPUT
L02N_0
INPUT
TDO
L19N_1 LDC2
D
I/O
L05P_3
INPUT INPUT PROG_B VCCINT
L16P_0
I/O
L15N_0
I/O
L14N_0 VREF_0
I/O
L11N_0 GCLK11
I/O
VREF_0
I/O
L06P_0
I/O
L04P_0
INPUT
L02P_0
I/O VCCINT L18N_1
LDC0
I/O
L18P_1 HDC
INPUT
VREF_1
E
I/O
L05N_3
VCCO_3
I/O
L03P_3
I/O
L03N_3
VCCINT INPUT
INPUT
L16N_0
I/O
L14P_0
I/O
L12P_0
I/O
L08P_0 GCLK4
I/O
L06N_0
I/O
L04N_0
I/O VCCINT L17P_1 INPUT
VCCO_1
I/O
L17N_1
I/O
I/O
L04N_3 VREF_3
F
VCCAUX
INPUT
L04P_3
GND
VCCO_0
I/O
L12N_0
I/O
L08N_0 GCLK5 VCCO_0
GND
I/O
L16N_1
I/O
L16P_1
I/O
L15P_1
I/O
L15N_1
VCCAUX
G
INPUT
VREF_3
I/O
L07N_3
I/O
L07P_3
I/O
L06N_3
I/O
L06P_3
VCCO_3
GND
GND
GND
GND
VCCO_1
INPUT I/O
L12P_1 A4 RHCLK6
I/O
L14P_1
I/O
L14N_1 A0
I/O
L13P_1 A2 L11P_1 A6 RHCLK4 IRDY1
I/O
L13N_1 A1
I/O
I/O
L09N_3 LHCLK3 IRDY2
I/O
L08P_3 LHCLK0
I/O
L08N_3 LHCLK1
I/O GND GND GND GND
L12N_1 A3 RHCLK7
Bank 3
VREF_1
J
I/O
L12P_3
I/O
L10P_3 LHCLK4 TRDY2
I/O
L10N_3 LHCLK5
I/O
L11N_3 LHCLK7
I/O
L11P_3 LHCLK6
I/O INPUT GND GND GND GND INPUT INPUT I/O
VCCO_3 L10N_1 A7 RHCLK3 TRDY1
I/O
L10P_1 A8 RHCLK2
I/O GND
L09N_1 A9 RHCLK1
K
I/O
L12N_3
I/O
L13P_3
I/O
L13N_3
INPUT I/O
L17N_3
I/O
L15P_3
I/O
L07P_1 A12
I/O
L08N_1 VREF_1
GND
GND I/O
GND I/O
L13P_2 M0
GND
VCCO_1
L07N_1 A11
I/O
L08P_1
I/O
L09P_1 A10 RHCLK0 VCCAUX
I/O
I/O
L14P_3
L
VCCAUX
L14N_3 VREF_3
I/O
L15N_3
I/O
VCCO_2
I/O
L05N_1
GND
VCCO_2
L09N_2 D6 GCLK13
GND
L05P_1
I/O
L06P_1
I/O
L06N_1
M
I/O
L16P_3
I/O
VCCO_3
INPUT
L17P_3
VCCINT
I/O
L05P_2
INPUT
I/O
L09P_2 D7 GCLK12
I/O
L13N_2 DIN D0
I/O
L15N_2
INPUT
L17N_2
VCCINT INPUT I/O
L18N_2 A20
INPUT
I/O
VCCO_1 L04N_1 VREF_1
N
I/O
L16N_3
INPUT
VREF_3
I/O INPUT VCCINT L03N_2
MOSI CSI_B
I/O
L05N_2
I/O
L07P_2
I/O
L10P_2 D4 GCLK14
I/O
L12N_2 D1 GCLK3
I/O
L15P_2
INPUT
L17P_2
I/O VCCINT L03P_1 I/O
L20P_2 VS0 A17
I/O
L03N_1 VREF_1
I/O
L04P_1
P
I/O
L18N_3
I/O
L18P_3
I/O
L01P_2 CSO_B
I/O
L01N_2 INIT_B
I/O
L03P_2 DOUT BUSY VCCO_2
I/O
L06N_2
I/O
L07N_2
I/O
L10N_2 D3 GCLK15
I/O
L12P_2 D2 GCLK2
I/O
L14P_2
I/O
L16N_2 A22
I/O
L18P_2 A21
I/O
VREF_2
I/O
L02N_1 A13
I/O
L02P_1 A14
R
I/O
L19N_3
I/O
L19P_3
INPUT
L02N_2
I/O
VREF_2
I/O
L06P_2
INPUT
L08P_2
INPUT GND
L11N_2 M2 GCLK1
I/O
L14N_2 VREF_2
I/O
L16P_2 A23 VCCO_2
I/O
L19N_2 VS1 A18
I/O
L20N_2 CCLK
I/O
L01N_1 A15
I/O
L01P_1 A16
T
GND
INPUT
INPUT
L02P_2
I/O
L04P_2
I/O
L04N_2
INPUT
VCCAUX L08N_2 VREF_2
I/O
D5
INPUT
L11P_2 RDWR_B GCLK0
I/O
M1
VCCAUX
INPUT
I/O
L19P_2 VS2 A19
INPUT
DONE
GND
Bank 2
DS312-4_05_101805
Figure 86: FT256 Package Footprint (top view)
2 28 6
CONFIG: Dedicated configuration pins GND: Ground
4 16 18
()
JTAG: Dedicated JTAG port pins VCCO: Output voltage supply for bank Unconnected pins on XC3S250E
8 8
VCCINT: Internal core supply voltage (+1.2V) VCCAUX: Auxiliary supply voltage (+2.5V)
Migration Difference: For flexible package migration, use these pins as inputs.
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DS312-4 (v3.4) November 9, 2006 Product Specification
Bank 1
H INPUT
GND
L09P_3 LHCLK2
INPUT
I/O
L11N_1 A5 RHCLK5
I/O
INPUT
R
Pinout Descriptions
FG320: 320-ball Fine-pitch Ball Grid Array
The 320-ball fine-pitch ball grid array package, FG320, supports three different Spartan-3E FPGAs, including the XC3S500E, the XC3S1200E, and the XC3S1600E, as shown in Table 147 and Figure 87. The FG320 package is an 18 x 18 array of solder balls minus the four center balls. Table 147 lists all the package pins. They are sorted by bank number and then by pin name of the largest device. Pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. The highlighted rows indicate pinout differences between the XC3S500E, the XC3S1200E, and the XC3S1600E FPGAs. The XC3S500E has 18 unconnected balls, indicated as N.C. (No Connection) in Table 147 and with the black diamond character ( ) in Table 147 and Figure 87. If the table row is highlighted in tan, then this is an instance where an unconnected pin on the XC3S500E FPGA maps to a VREF pin on the XC3S1200E and XC3S1600E FPGA. If the FPGA application uses an I/O standard that requires a VREF voltage reference, connect the highlighted pin to the VREF voltage supply, even though this does not actually connect to the XC3S500E FPGA. This VREF connection on the board allows future migration to the larger devices without modifying the printed-circuit board. All other balls have nearly identical functionality on all three devices. Table 146 summarizes the Spartan-3E footprint migration differences for the FG320 package. An electronic version of this package pinout table and footprint diagram is available for download from the Xilinx web site at http://www.xilinx.com/bvdocs/publications/s3e_pin.zip.
Pinout Table
Table 147: FG320 Package Pinout
Bank 0 IP XC3S500E Pin Name IO XC3S1200E Pin Name IO XC3S1600E Pin Name FG320 Ball A7 Type 500E: INPUT 1200E: I/O 1600E: I/O 0 0 0 IO IO N.C. ( ) IO IO IO IO IO IO A8 A11 A12 I/O I/O 500E: N.C. 1200E: I/O 1600E: I/O 0 0 IO IP IO IO IO IO C4 D13 I/O 500E: INPUT 1200E: I/O 1600E: I/O 0 0 0 0 0 0 0 0 0 0 0 0 0 IO IO IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0 IO_L04P_0 IO_L05N_0/VREF_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO IO IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0 IO_L04P_0 IO_L05N_0/VREF_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO IO IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0 IO_L04P_0 IO_L05N_0/VREF_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 E13 G9 B11 A16 B16 C14 D14 A14 B14 B13 A13 E12 F12 I/O I/O VREF I/O I/O VREF I/O I/O I/O VREF I/O I/O I/O
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Pinout Descriptions Table 147: FG320 Package Pinout (Continued)
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 XC3S500E Pin Name IO_L08N_0 IO_L08P_0 IO_L09N_0 IO_L09P_0 IO_L11N_0/GCLK5 IO_L11P_0/GCLK4 IO_L12N_0/GCLK7 IO_L12P_0/GCLK6 IO_L14N_0/GCLK11 IO_L14P_0/GCLK10 IO_L15N_0 IO_L15P_0 IO_L17N_0 IO_L17P_0 IO_L18N_0/VREF_0 IO_L18P_0 IO_L19N_0/VREF_0 IO_L19P_0 IO_L20N_0 IO_L20P_0 N.C. ( ) XC3S1200E Pin Name IO_L08N_0 IO_L08P_0 IO_L09N_0 IO_L09P_0 IO_L11N_0/GCLK5 IO_L11P_0/GCLK4 IO_L12N_0/GCLK7 IO_L12P_0/GCLK6 IO_L14N_0/GCLK11 IO_L14P_0/GCLK10 IO_L15N_0 IO_L15P_0 IO_L17N_0 IO_L17P_0 IO_L18N_0/VREF_0 IO_L18P_0 IO_L19N_0/VREF_0 IO_L19P_0 IO_L20N_0 IO_L20P_0 IO_L21N_0 XC3S1600E Pin Name IO_L08N_0 IO_L08P_0 IO_L09N_0 IO_L09P_0 IO_L11N_0/GCLK5 IO_L11P_0/GCLK4 IO_L12N_0/GCLK7 IO_L12P_0/GCLK6 IO_L14N_0/GCLK11 IO_L14P_0/GCLK10 IO_L15N_0 IO_L15P_0 IO_L17N_0 IO_L17P_0 IO_L18N_0/VREF_0 IO_L18P_0 IO_L19N_0/VREF_0 IO_L19P_0 IO_L20N_0 IO_L20P_0 IO_L21N_0 FG320 Ball F11 E11 D11 C11 E10 D10 A10 B10 D9 C9 F9 E9 F8 E8 D7 C7 E7 F7 A6 B6 E6 Type I/O I/O I/O I/O GCLK GCLK GCLK GCLK GCLK GCLK I/O I/O I/O I/O VREF I/O VREF I/O I/O I/O 500E: N.C. 1200E: I/O 1600E: I/O 0 N.C. ( ) IO_L21P_0 IO_L21P_0 D6 500E: N.C. 1200E: I/O 1600E: I/O 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 IO_L23N_0/VREF_0 IO_L23P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0/HSWAP IO_L25P_0 IP IP IP_L02N_0 IP_L02P_0 IP_L07N_0 IP_L07P_0 IP_L10N_0 IP_L10P_0 IP_L13N_0/GCLK9 IO_L23N_0/VREF_0 IO_L23P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0/HSWAP IO_L25P_0 IP IP IP_L02N_0 IP_L02P_0 IP_L07N_0 IP_L07P_0 IP_L10N_0 IP_L10P_0 IP_L13N_0/GCLK9 IO_L23N_0/VREF_0 IO_L23P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0/HSWAP IO_L25P_0 IP IP IP_L02N_0 IP_L02P_0 IP_L07N_0 IP_L07P_0 IP_L10N_0 IP_L10P_0 IP_L13N_0/GCLK9 D5 C5 B4 A4 B3 C3 A3 C15 A15 B15 D12 C12 G10 F10 B9 VREF I/O I/O I/O DUAL I/O INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT GCLK
R
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Pinout Descriptions
Table 147: FG320 Package Pinout (Continued)
Bank 0 0 0 0 0 0 0 0 0 0 1 XC3S500E Pin Name IP_L13P_0/GCLK8 IP_L16N_0 IP_L16P_0 IP_L22N_0 IP_L22P_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 N.C. ( ) XC3S1200E Pin Name IP_L13P_0/GCLK8 IP_L16N_0 IP_L16P_0 IP_L22N_0 IP_L22P_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 IO XC3S1600E Pin Name IP_L13P_0/GCLK8 IP_L16N_0 IP_L16P_0 IP_L22N_0 IP_L22P_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 IO FG320 Ball B8 D8 C8 B5 A5 A9 C6 C13 G8 G11 P16 Type GCLK INPUT INPUT INPUT INPUT VCCO VCCO VCCO VCCO VCCO 500E: N.C. 1200E: I/O 1600E: I/O 1 1 1 1 1 1 1 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/VREF_1 IO_L03P_1 N.C. ( ) IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/VREF_1 IO_L03P_1 IO_L04N_1 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/VREF_1 IO_L03P_1 IO_L04N_1 T17 U18 T18 R18 R16 R15 N14 DUAL DUAL DUAL DUAL VREF I/O 500E: N.C. 1200E: I/O 1600E: I/O 1 N.C. ( ) IO_L04P_1 IO_L04P_1 N15 500E: N.C. 1200E: I/O 1600E: I/O 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 IO_L05N_1/VREF_1 IO_L05P_1 IO_L06N_1 IO_L06P_1 IO_L07N_1 IO_L07P_1 IO_L08N_1 IO_L08P_1 IO_L09N_1/A11 IO_L09P_1/A12 IO_L10N_1/VREF_1 IO_L10P_1 IO_L11N_1/A9/RHCLK1 IO_L11P_1/A10/RHCLK0 IO_L12N_1/A7/RHCLK3/ TRDY1 IO_L12P_1/A8/RHCLK2 IO_L05N_1/VREF_1 IO_L05P_1 IO_L06N_1 IO_L06P_1 IO_L07N_1 IO_L07P_1 IO_L08N_1 IO_L08P_1 IO_L09N_1/A11 IO_L09P_1/A12 IO_L10N_1/VREF_1 IO_L10P_1 IO_L11N_1/A9/RHCLK1 IO_L11P_1/A10/RHCLK0 IO_L12N_1/A7/RHCLK3/ TRDY1 IO_L12P_1/A8/RHCLK2 IO_L05N_1/VREF_1 IO_L05P_1 IO_L06N_1 IO_L06P_1 IO_L07N_1 IO_L07P_1 IO_L08N_1 IO_L08P_1 IO_L09N_1/A11 IO_L09P_1/A12 IO_L10N_1/VREF_1 IO_L10P_1 IO_L11N_1/A9/RHCLK1 IO_L11P_1/A10/RHCLK0 IO_L12N_1/A7/RHCLK3/ TRDY1 IO_L12P_1/A8/RHCLK2 M13 M14 P18 P17 M16 M15 M18 N18 L15 L16 L17 L18 K12 K13 K14 K15 VREF I/O I/O I/O I/O I/O I/O I/O DUAL DUAL VREF I/O RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL
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Pinout Descriptions Table 147: FG320 Package Pinout (Continued)
Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 XC3S500E Pin Name IO_L13N_1/A5/RHCLK5 IO_L13P_1/A6/RHCLK4/ IRDY1 IO_L14N_1/A3/RHCLK7 IO_L14P_1/A4/RHCLK6 IO_L15N_1/A1 IO_L15P_1/A2 IO_L16N_1/A0 IO_L16P_1 IO_L17N_1 IO_L17P_1 IO_L18N_1 IO_L18P_1 IO_L19N_1 IO_L19P_1 IO_L20N_1 IO_L20P_1 IO_L21N_1 IO_L21P_1 N.C. ( ) XC3S1200E Pin Name IO_L13N_1/A5/RHCLK5 IO_L13P_1/A6/RHCLK4/ IRDY1 IO_L14N_1/A3/RHCLK7 IO_L14P_1/A4/RHCLK6 IO_L15N_1/A1 IO_L15P_1/A2 IO_L16N_1/A0 IO_L16P_1 IO_L17N_1 IO_L17P_1 IO_L18N_1 IO_L18P_1 IO_L19N_1 IO_L19P_1 IO_L20N_1 IO_L20P_1 IO_L21N_1 IO_L21P_1 IO_L22N_1 XC3S1600E Pin Name IO_L13N_1/A5/RHCLK5 IO_L13P_1/A6/RHCLK4/ IRDY1 IO_L14N_1/A3/RHCLK7 IO_L14P_1/A4/RHCLK6 IO_L15N_1/A1 IO_L15P_1/A2 IO_L16N_1/A0 IO_L16P_1 IO_L17N_1 IO_L17P_1 IO_L18N_1 IO_L18P_1 IO_L19N_1 IO_L19P_1 IO_L20N_1 IO_L20P_1 IO_L21N_1 IO_L21P_1 IO_L22N_1 FG320 Ball J16 J17 J14 J15 J13 J12 H17 H16 H15 H14 G16 G15 F17 F18 G13 G14 F14 F15 E16 Type RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL RHCLK/DUAL DUAL DUAL DUAL I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 500E: N.C. 1200E: I/O 1600E: I/O 1 N.C. ( ) IO_L22P_1 IO_L22P_1 E15 500E: N.C. 1200E: I/O 1600E: I/O 1 1 1 1 1 1 IO_L23N_1/LDC0 IO_L23P_1/HDC IO_L24N_1/LDC2 IO_L24P_1/LDC1 IP IO IO_L23N_1/LDC0 IO_L23P_1/HDC IO_L24N_1/LDC2 IO_L24P_1/LDC1 IP IP IO_L23N_1/LDC0 IO_L23P_1/HDC IO_L24N_1/LDC2 IO_L24P_1/LDC1 IP IP D16 D17 C17 C18 B18 E17 DUAL DUAL DUAL DUAL INPUT 500E: I/O 1200E: INPUT 1600E: INPUT 1 1 1 1 1 1 1 1 IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP E18 G18 H13 K17 K18 L13 L14 N17 INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT
R
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R
Pinout Descriptions
Table 147: FG320 Package Pinout (Continued)
Bank 1 IO XC3S500E Pin Name IP XC3S1200E Pin Name IP XC3S1600E Pin Name FG320 Ball P15 Type 500E: I/O 1200E: INPUT 1600E: INPUT 1 1 1 1 1 1 1 1 2 2 2 IP IP/VREF_1 IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 IO IO IP IP IP/VREF_1 IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 IO IO IO IP IP/VREF_1 IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 IO IO IO R17 D18 H18 F16 H12 J18 L12 N16 P9 R11 U6 INPUT VREF VREF VCCO VCCO VCCO VCCO VCCO I/O I/O 500E: INPUT 1200E: I/O 1600E: I/O 2 IP IO IO U13 500E: INPUT 1200E: I/O 1600E: I/O 2 N.C. ( ) IO IO V7 500E: N.C. 1200E: I/O 1600E: I/O 2 2 2 2 2 2 2 2 2 2 2 2 2 IO/D5 IO/M1 IO/VREF_2 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 N.C. ( ) IO/D5 IO/M1 IO/VREF_2 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2/VREF_2 IO/D5 IO/M1 IO/VREF_2 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2/VREF_2 R9 V11 T15 U5 T3 U3 T4 U4 T5 R5 P6 R6 V6 DUAL DUAL VREF VREF DUAL DUAL DUAL DUAL I/O I/O I/O I/O 500E: N.C. 1200E: VREF 1600E: VREF 2 N.C. ( ) IO_L06P_2 IO_L06P_2 V5 500E: N.C. 1200E: I/O 1600E: I/O 2 2 IO_L07N_2 IO_L07P_2 IO_L07N_2 IO_L07P_2 IO_L07N_2 IO_L07P_2 P7 N7 I/O I/O
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Pinout Descriptions Table 147: FG320 Package Pinout (Continued)
Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 XC3S500E Pin Name IO_L09N_2 IO_L09P_2 IO_L10N_2 IO_L10P_2 IO_L12N_2/D6/GCLK13 IO_L12P_2/D7/GCLK12 IO_L13N_2/D3/GCLK15 IO_L13P_2/D4/GCLK14 IO_L15N_2/D1/GCLK3 IO_L15P_2/D2/GCLK2 IO_L16N_2/DIN/D0 IO_L16P_2/M0 IO_L18N_2 IO_L18P_2 IO_L19N_2/VREF_2 IO_L19P_2 IO_L20N_2 IO_L20P_2 N.C. ( ) XC3S1200E Pin Name IO_L09N_2 IO_L09P_2 IO_L10N_2 IO_L10P_2 IO_L12N_2/D6/GCLK13 IO_L12P_2/D7/GCLK12 IO_L13N_2/D3/GCLK15 IO_L13P_2/D4/GCLK14 IO_L15N_2/D1/GCLK3 IO_L15P_2/D2/GCLK2 IO_L16N_2/DIN/D0 IO_L16P_2/M0 IO_L18N_2 IO_L18P_2 IO_L19N_2/VREF_2 IO_L19P_2 IO_L20N_2 IO_L20P_2 IO_L21N_2 XC3S1600E Pin Name IO_L09N_2 IO_L09P_2 IO_L10N_2 IO_L10P_2 IO_L12N_2/D6/GCLK13 IO_L12P_2/D7/GCLK12 IO_L13N_2/D3/GCLK15 IO_L13P_2/D4/GCLK14 IO_L15N_2/D1/GCLK3 IO_L15P_2/D2/GCLK2 IO_L16N_2/DIN/D0 IO_L16P_2/M0 IO_L18N_2 IO_L18P_2 IO_L19N_2/VREF_2 IO_L19P_2 IO_L20N_2 IO_L20P_2 IO_L21N_2 FG320 Ball N8 P8 T8 R8 M9 N9 V9 U9 P10 R10 N10 M10 N11 P11 V13 V12 R12 T12 P12 Type I/O I/O I/O I/O DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL/GCLK DUAL DUAL I/O I/O VREF I/O I/O I/O 500E: N.C. 1200E: I/O 1600E: I/O 2 N.C. ( ) IO_L21P_2 IO_L21P_2 N12 500E: N.C. 1200E: I/O 1600E: I/O 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 IO_L22N_2/A22 IO_L22P_2/A23 IO_L24N_2/A20 IO_L24P_2/A21 IO_L25N_2/VS1/A18 IO_L25P_2/VS2/A19 IO_L26N_2/CCLK IO_L26P_2/VS0/A17 IP IP IP_L02N_2 IP_L02P_2 IP_L08N_2 IP_L08P_2 IP_L11N_2/VREF_2 IP_L11P_2 IP_L14N_2/M2/GCLK1 IO_L22N_2/A22 IO_L22P_2/A23 IO_L24N_2/A20 IO_L24P_2/A21 IO_L25N_2/VS1/A18 IO_L25P_2/VS2/A19 IO_L26N_2/CCLK IO_L26P_2/VS0/A17 IP IP IP_L02N_2 IP_L02P_2 IP_L08N_2 IP_L08P_2 IP_L11N_2/VREF_2 IP_L11P_2 IP_L14N_2/M2/GCLK1 IO_L22N_2/A22 IO_L22P_2/A23 IO_L24N_2/A20 IO_L24P_2/A21 IO_L25N_2/VS1/A18 IO_L25P_2/VS2/A19 IO_L26N_2/CCLK IO_L26P_2/VS0/A17 IP IP IP_L02N_2 IP_L02P_2 IP_L08N_2 IP_L08P_2 IP_L11N_2/VREF_2 IP_L11P_2 IP_L14N_2/M2/GCLK1 R13 P13 R14 T14 U15 V15 U16 T16 V2 V16 V3 V4 R7 T7 V8 U8 T10 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL INPUT INPUT INPUT INPUT INPUT INPUT VREF INPUT DUAL/GCLK
R
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Pinout Descriptions
Table 147: FG320 Package Pinout (Continued)
Bank 2 2 2 2 2 2 2 2 2 2 3 XC3S500E Pin Name IP_L14P_2/RDWR_B/ GCLK0 IP_L17N_2 IP_L17P_2 IP_L23N_2 IP_L23P_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 N.C. ( ) XC3S1200E Pin Name IP_L14P_2/RDWR_B/ GCLK0 IP_L17N_2 IP_L17P_2 IP_L23N_2 IP_L23P_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 IO XC3S1600E Pin Name IP_L14P_2/RDWR_B/ GCLK0 IP_L17N_2 IP_L17P_2 IP_L23N_2 IP_L23P_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 IO FG320 Ball U10 U11 T11 U14 V14 M8 M11 T6 T13 V10 D4 Type DUAL/GCLK INPUT INPUT INPUT INPUT VCCO VCCO VCCO VCCO VCCO 500E: N.C. 1200E: I/O 1600E: I/O 3 3 3 3 3 3 3 IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 N.C. ( ) IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3 IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3 C2 C1 D2 D1 E1 E2 E3 I/O I/O VREF I/O I/O I/O 500E: N.C. 1200E: I/O 1600E: I/O 3 N.C. ( ) IO_L04P_3 IO_L04P_3 E4 500E: N.C. 1200E: I/O 1600E: I/O 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 IO_L05N_3 IO_L05P_3 IO_L06N_3/VREF_3 IO_L06P_3 IO_L07N_3 IO_L07P_3 IO_L08N_3 IO_L08P_3 IO_L09N_3 IO_L09P_3 IO_L10N_3 IO_L10P_3 IO_L11N_3/LHCLK1 IO_L11P_3/LHCLK0 IO_L12N_3/LHCLK3/ IRDY2 IO_L05N_3 IO_L05P_3 IO_L06N_3/VREF_3 IO_L06P_3 IO_L07N_3 IO_L07P_3 IO_L08N_3 IO_L08P_3 IO_L09N_3 IO_L09P_3 IO_L10N_3 IO_L10P_3 IO_L11N_3/LHCLK1 IO_L11P_3/LHCLK0 IO_L12N_3/LHCLK3/ IRDY2 IO_L05N_3 IO_L05P_3 IO_L06N_3/VREF_3 IO_L06P_3 IO_L07N_3 IO_L07P_3 IO_L08N_3 IO_L08P_3 IO_L09N_3 IO_L09P_3 IO_L10N_3 IO_L10P_3 IO_L11N_3/LHCLK1 IO_L11P_3/LHCLK0 IO_L12N_3/LHCLK3/ IRDY2 F2 F1 G4 G3 G5 G6 H5 H6 H3 H4 H1 H2 J4 J5 J2 I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O LHCLK LHCLK LHCLK
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Pinout Descriptions Table 147: FG320 Package Pinout (Continued)
Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 XC3S500E Pin Name IO_L12P_3/LHCLK2 IO_L13N_3/LHCLK5 IO_L13P_3/LHCLK4/ TRDY2 IO_L14N_3/LHCLK7 IO_L14P_3/LHCLK6 IO_L15N_3 IO_L15P_3 IO_L16N_3 IO_L16P_3 IO_L17N_3/VREF_3 IO_L17P_3 IO_L18N_3 IO_L18P_3 IO_L19N_3 IO_L19P_3 IO_L20N_3 IO_L20P_3 IO_L21N_3 IO_L21P_3 N.C. ( ) XC3S1200E Pin Name IO_L12P_3/LHCLK2 IO_L13N_3/LHCLK5 IO_L13P_3/LHCLK4/ TRDY2 IO_L14N_3/LHCLK7 IO_L14P_3/LHCLK6 IO_L15N_3 IO_L15P_3 IO_L16N_3 IO_L16P_3 IO_L17N_3/VREF_3 IO_L17P_3 IO_L18N_3 IO_L18P_3 IO_L19N_3 IO_L19P_3 IO_L20N_3 IO_L20P_3 IO_L21N_3 IO_L21P_3 IO_L22N_3 XC3S1600E Pin Name IO_L12P_3/LHCLK2 IO_L13N_3/LHCLK5 IO_L13P_3/LHCLK4/ TRDY2 IO_L14N_3/LHCLK7 IO_L14P_3/LHCLK6 IO_L15N_3 IO_L15P_3 IO_L16N_3 IO_L16P_3 IO_L17N_3/VREF_3 IO_L17P_3 IO_L18N_3 IO_L18P_3 IO_L19N_3 IO_L19P_3 IO_L20N_3 IO_L20P_3 IO_L21N_3 IO_L21P_3 IO_L22N_3 FG320 Ball J1 K4 K3 K5 K6 L2 L1 L4 L3 L5 L6 M3 M4 M6 M5 N5 N4 P1 P2 P4 Type LHCLK LHCLK LHCLK LHCLK LHCLK I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O 500E: N.C. 1200E: I/O 1600E: I/O 3 N.C. ( ) IO_L22P_3 IO_L22P_3 P3 500E: N.C. 1200E: I/O 1600E: I/O 3 3 3 3 3 3 IO_L23N_3 IO_L23P_3 IO_L24N_3 IO_L24P_3 IP IO IO_L23N_3 IO_L23P_3 IO_L24N_3 IO_L24P_3 IP IP IO_L23N_3 IO_L23P_3 IO_L24N_3 IO_L24P_3 IP IP R2 R3 T1 T2 D3 F4 I/O I/O I/O I/O INPUT 500E: I/O 1200E: INPUT 1600E: INPUT 3 3 3 3 3 3 3 3 IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP IP F5 G1 J7 K2 K7 M1 N1 N2 INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT
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Pinout Descriptions
Table 147: FG320 Package Pinout (Continued)
Bank 3 3 3 3 IP IP IP/VREF_3 IO/VREF_3 XC3S500E Pin Name IP IP IP/VREF_3 IP/VREF_3 XC3S1200E Pin Name IP IP IP/VREF_3 IP/VREF_3 XC3S1600E Pin Name FG320 Ball R1 U1 J6 R4 Type INPUT INPUT VREF 500E: VREF(I/O) 1200E: VREF(INPUT) 1600E: VREF(INPUT) 3 3 3 3 3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND VCCAUX VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DONE VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DONE VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DONE F3 H7 K1 L7 N3 A1 A18 B2 B17 C10 G7 G12 H8 H9 H10 H11 J3 J8 J11 K8 K11 K16 L8 L9 L10 L11 M7 M12 T9 U2 U17 V1 V18 V17 VCCO VCCO VCCO VCCO VCCO GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND CONFIG
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Pinout Descriptions Table 147: FG320 Package Pinout (Continued)
Bank VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S500E Pin Name PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S1200E Pin Name PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S1600E Pin Name PROG_B TCK TDI TDO TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT FG320 Ball B1 A17 A2 C16 D15 B7 B12 G2 G17 M2 M17 U7 U12 E5 E14 F6 F13 N6 N13 P5 P14 Type CONFIG JTAG JTAG JTAG JTAG VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
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Pinout Descriptions
User I/Os by Bank
Table 148 and Table 149 indicate how the available user-I/O pins are distributed between the four I/O banks on the FG320 package. Table 148: User I/Os Per Bank for XC3S500E in the FG320 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 58 58 58 58 232
All Possible I/O Pins by Type I/O 29 22 17 34 102 INPUT 14 10 13 11 48 DUAL 1 21 24 0 46 VREF 6 5 4 5 20 CLK 8 0(1) 0(1) 8 16
Table 149: User I/Os Per Bank for XC3S1200E and XC3S1600E in the FG320 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 61 63 63 63 250
All Possible I/O Pins by Type I/O 34 25 23 38 120 INPUT 12 12 11 12 47 DUAL 1 21 24 0 46 VREF 6 5 5 5 21 CLK 8 0(1) 0(1) 8 16
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Pinout Descriptions
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Footprint Migration Differences
Table 150 summarizes any footprint and functionality differences between the XC3S500E, the XC3S1200E, and the XC3S1600E FPGAs that may affect easy migration between devices available in the FG320 package. There are 26 such balls. All other pins not listed in Table 150 unconditionally migrate between Spartan-3E devices available in the FG320 package. The XC3S500E is duplicated on both the left and right sides of the table to show migrations to and from the XC3S1200E Table 150: FG320 Footprint Migration Differences
Pin A7 A12 D4 D6 D13 E3 E4 E6 E15 E16 E17 F4 N12 N14 N15 P3 P4 P12 P15 P16 R4 U6 U13 V5 V6 V7 Bank 0 0 3 0 0 3 3 0 1 1 1 3 2 1 1 3 3 2 1 1 3 2 2 2 2 2 XC3S500E INPUT N.C. N.C. N.C. INPUT N.C. N.C. N.C. N.C. N.C. I/O I/O N.C. N.C. N.C. N.C. N.C. N.C. I/O N.C. VREF(I/O) INPUT INPUT N.C. N.C. N.C. Migration XC3S1200E I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O INPUT INPUT I/O I/O I/O I/O I/O I/O INPUT I/O VREF(INPUT) I/O I/O I/O VREF I/O Migration XC3S1600E I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O INPUT INPUT I/O I/O I/O I/O I/O I/O INPUT I/O VREF(INPUT) I/O I/O I/O VREF I/O Migration XC3S500E INPUT N.C. N.C. N.C. INPUT N.C. N.C. N.C. N.C. N.C. I/O I/O N.C. N.C. N.C. N.C. N.C. N.C. I/O N.C. VREF(I/O) INPUT INPUT N.C. N.C. N.C.
and the XC3S1600E. The arrows indicate the direction for easy migration. A double-ended arrow ( ) indicates that the two pins have identical functionality. A left-facing arrow ( ) indicates that the pin on the device on the right unconditionally migrates to the pin on the device on the left. It may be possible to migrate the opposite direction depending on the I/O configuration. For example, an I/O pin (Type = I/O) can migrate to an input-only pin (Type = INPUT) if the I/O pin is configured as an input.
DIFFERENCES
Legend:
26
0
26
This pin is identical on the device on the left and the right. This pin can unconditionally migrate from the device on the left to the device on the right. Migration in the other direction may be possible depending on how the pin is configured for the device on the right. This pin can unconditionally migrate from the device on the right to the device on the left. Migration in the other direction may be possible depending on how the pin is configured for the device on the left.
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DS312-4 (v3.4) November 9, 2006 Product Specification
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Pinout Descriptions
FG320 Footprint
Bank 0
1 A
GND
2
TDI
3
INPUT I/O
4
I/O
L24P_0
5
INPUT
L22P_0
6
I/O
L20N_0
7
INPUT
8
I/O INPUT
9
VCCO_0
10
I/O
L12N_0 GCLK7
11
I/O
12
I/O
13
I/O
L05P_0
14
I/O
L04N_0
15
INPUT
L02N_0
16
I/O
L01N_0
17
TCK
18
GND
B
PROG_B
GND
L25N_0 HSWAP
I/O
L24N_0
INPUT
L22N_0
I/O
L20P_0
INPUT
L13N_0 GCLK9
I/O
L12P_0 GCLK6
VCCAUX
L13P_0 GCLK8
I/O
VREF_0
I/O
VCCAUX L05N_0 VREF_0
I/O
L04P_0
INPUT
L02P_0
I/O
L01P_0
GND I/O
INPUT I/O
L24P_1 LDC1
C
I/O
L01P_3
I/O
L01N_3
I/O
L25P_0
I/O
I/O
L23P_0
VCCO_0
I/O
L18P_0
INPUT
L16P_0
I/O
L14P_0 GCLK10
GND I/O
L11P_0 GCLK4
I/O
L09P_0
INPUT
L07P_0
I/O
VCCO_0 L03N_0 VREF_0
INPUT
TDO I/O
L24N_1 LDC2
D
I/O
L02P_3
I/O
L02N_3 VREF_3
INPUT I/O
L04N_3
I/O
I/O
L23N_0 VREF_0
I/O
L21P_0
I/O
L18N_0 VREF_0
INPUT
L16N_0
I/O
L14N_0 GCLK11
I/O
L09N_0
INPUT
L07N_0
INPUT
I/O
L03P_0
I/O
L23P_1 HDC
TMS
L23N_1 LDC0
INPUT
VREF_1
E
I/O
L03N_3
I/O
L03P_3
I/O
L04P_3
I/O VCCINT L21N_0
I/O
L19N_0 VREF_0
I/O
L17P_0
I/O
L15P_0
I/O
L11N_0 GCLK5
I/O
L08P_0
I/O
L06N_0
I/O
I/O VCCINT L22P_1
I/O
L22N_1
INPUT
INPUT
F
I/O
L05P_3
I/O
L05N_3
VCCO_3
INPUT
INPUT VCCINT
I/O
L19P_0
I/O
L17N_0
I/O
L15N_0
INPUT
L10P_0
I/O
L08N_0
I/O
L06P_0
VCCINT
I/O
L21N_1
I/O
L21P_1
VCCO_1
I/O
L19N_1
I/O
L19P_1
G
INPUT
VCCAUX
I/O
L06P_3
I/O
L06N_3 VREF_3
I/O
L07N_3
I/O
L07P_3
GND
VCCO_0
I/O
INPUT
L10N_0
VCCO_0
GND
I/O
L20N_1
I/O
L20P_1
I/O
L18P_1
I/O
L18N_1
VCCAUX
INPUT
H
I/O
L10N_3
I/O
L10P_3
I/O
L09N_3
I/O
L09P_3
I/O
L08N_3
I/O
L08P_3
VCCO_3
GND
GND
GND
GND
VCCO_1
INPUT I/O
L15N_1 A1
I/O
L17P_1
I/O
L17N_1
I/O
L16P_1
I/O
L16N_1 A0 L13P_1 A6 RHCLK4 IRDY1
INPUT
VREF_1
I/O
I/O
L12N_3 LHCLK3 IRDY2
I/O GND I/O
L11N_3 LHCLK1
I/O
L11P_3 LHCLK0
J
Bank 3
L12P_3 LHCLK2
VREF_3
INPUT
GND
GND
L15P_1 A2
VCCO_1
I/O
L13N_3 LHCLK5
I/O
L14N_3 LHCLK7
I/O
L14P_3 LHCLK6
I/O INPUT GND GND
L11N_1 A9 RHCLK1 VCCO_1
I/O
L11P_1 A10 RHCLK0
K
VCCO_3
INPUT
L13P_3 LHCLK4 TRDY2
L12N_1 A7 RHCLK3 TRDY1
I/O
I/O
L12P_1 A8 RHCLK2
GND I/O
L09P_1 A12
INPUT I/O
L10N_1 VREF_1
INPUT
L
I/O
L15P_3
I/O
L15N_3
I/O
L16P_3
I/O
L16N_3
I/O
L17N_3 VREF_3
I/O
L17P_3
I/O
VCCO_3
GND
GND I/O
GND I/O
L16P_2 M0
GND
INPUT I/O
INPUT
L09N_1 A11
I/O
L10P_1
M INPUT
VCCAUX
I/O
L18N_3
I/O
L18P_3
I/O
L19P_3
I/O
L19N_3
GND
VCCO_2
L12N_2 D6 GCLK13
VCCO_2
GND I/O
L21P_2
L05N_1 VREF_1
I/O
L05P_1
I/O
L07P_1
I/O
L07N_1
VCCAUX
I/O
L08N_1
N
INPUT
INPUT
VCCO_3
I/O
L20P_3
I/O
L20N_3
VCCINT
I/O
L07P_2
I/O
L09N_2
I/O
L12P_2 D7 GCLK12
I/O
L16N_2 DIN D0
I/O
L18N_2
I/O VCCINT L04N_1 I/O
L22P_2 A23
I/O
L04P_1 VCCO_1
INPUT
I/O
L08P_1
P
I/O
L21N_3
I/O
L21P_3
I/O
L22P_3
I/O
L22N_3
VCCINT
I/O
L05N_2
I/O
L07N_2
I/O
L09P_2
I/O I/O
L15N_2 D1 GCLK3
I/O
L18P_2
I/O
L21N_2
VCCINT I/O
L24N_2 A20
INPUT
I/O
I/O
L06P_1
I/O
L06N_1
R
INPUT
I/O
L23N_3
I/O
L23P_3
INPUT
VREF_3
I/O
L04P_2
I/O
L05P_2
INPUT
L08N_2
I/O
L10P_2
I/O
D5
I/O
L15P_2 D2 GCLK2
I/O
I/O
L20N_2
I/O
L22N_2 A22
I/O
L03P_1
I/O
L03N_1 VREF_1
I/O INPUT I/O
L01N_1 A15 L02P_1 A14
T
I/O
L24N_3
I/O
L24P_3
I/O
L01N_2 INIT_B
I/O
L03N_2 MOSI CSI_B
I/O
L04N_2
VCCO_2
INPUT
L08P_2
I/O
L10N_2
INPUT GND I/O
L13P_2 D4 GCLK14 L14N_2 M2 GCLK1
INPUT
L17P_2
I/O
L20P_2
I/O
VCCO_2 L24P_2 A21
I/O
VREF_2
I/O
L26P_2 VS0 A17
I/O
L02N_1 A13
I/O
I/O
L03P_2 DOUT BUSY
U
INPUT
GND
L01P_2 CSO_B
I/O
VREF_2
INPUT
VCCAUX
INPUT
L11P_2
INPUT
L14P_2 RDWR_B GCLK0 VCCO_2
INPUT
L17N_2
VCCAUX
INPUT
INPUT
L23N_2
I/O
L25N_2 VS1 A18
I/O
L26N_2 CCLK
I/O GND
L01P_1 A16
V
GND
INPUT
INPUT
L02N_2
INPUT
L02P_2
I/O
L06P_2
I/O
L06N_2 VREF_2
I/O
INPUT
L11N_2 VREF_2
I/O
L13N_2 D3 GCLK15
I/O
M1
I/O
L19P_2
I/O
L19N_2 VREF_2
INPUT
L23P_2
I/O
L25P_2 VS2 A19
INPUT
DONE
GND
Bank 2
DS312-4_06_022106
Figure 87: FG320 Package Footprint (top view)
102- I/O: Unrestricted, 120 general-purpose user I/O 4748 2 18
INPUT: Unrestricted, general-purpose input pin CONFIG: Dedicated configuration pins N.C.: Not connected. Only the XC3S500E has these pins ( ).
46 16 4 28
DUAL: Configuration pin, then possible user-I/O CLK: User I/O, input, or global buffer input JTAG: Dedicated JTAG port pins GND: Ground
2021 20 8 8
VREF: User I/O or input voltage reference for bank VCCO: Output voltage supply for bank VCCINT: Internal core supply voltage (+1.2V) VCCAUX: Auxiliary supply voltage (+2.5V)
DS312-4 (v3.4) November 9, 2006 Product Specification
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Bank 1
INPUT
I/O
I/O
L14N_1 A3 RHCLK7
I/O
L14P_1 A4 4 RHCLK6
I/O
L13N_1 A5 RHCLK5
I/O
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Pinout Descriptions
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FG400: 400-ball Fine-pitch Ball Grid Array
The 400-ball fine-pitch ball grid array, FG400, supports two different Spartan-3E FPGAs, including the XC3S1200E and the XC3S1600E. Both devices share a common footprint for this package as shown in Table 151 and Figure 88. Table 151 lists all the FG400 package pins. They are sorted by bank number and then by pin name. Pairs of pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. An electronic version of this package pinout table and footprint diagram is available for download from the Xilinx website at http://www.xilinx.com/bvdocs/publications/s3e_pin.zip. Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name IO_L12P_0 IO_L13N_0 IO_L13P_0 IO_L15N_0/GCLK5 IO_L15P_0/GCLK4 IO_L16N_0/GCLK7 IO_L16P_0/GCLK6 IO_L18N_0/GCLK11 IO_L18P_0/GCLK10 IO_L19N_0 IO_L19P_0 IO_L21N_0 IO_L21P_0 IO_L22N_0/VREF_0 IO_L22P_0 IO_L24N_0/VREF_0 IO_L24P_0 IO_L25N_0 IO_L25P_0 IO_L27N_0 IO_L27P_0 IO_L28N_0 IO_L28P_0 IO_L30N_0/VREF_0 IO_L30P_0 IO_L31N_0 IO_L31P_0 IO_L32N_0/HSWAP IO_L32P_0 IP IP IP_L02N_0 IP_L02P_0 IP_L05N_0 IP_L05P_0 IP_L08N_0 IP_L08P_0 IP_L11N_0 IP_L11P_0 FG400 Ball D12 E12 F12 G11 F11 E10 E11 A9 A10 F9 E9 C9 D9 B8 B9 F7 F8 A6 A7 B5 B6 D6 C6 C5 D5 A2 B2 D4 C4 B18 E5 C16 D16 D15 C15 E14 E15 G14 G13
Bank 0 0 0 0 0 0 0 0 0
Type I/O I/O I/O GCLK GCLK GCLK GCLK GCLK GCLK I/O I/O I/O I/O VREF I/O VREF I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O DUAL I/O INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT
Pinout Table
Table 151: FG400 Package Pinout
XC3S1200E XC3S1600E Pin Name IO IO IO IO IO IO IO IO IO IO IO IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0 IO_L04P_0 IO_L06N_0 IO_L06P_0 IO_L07N_0 IO_L07P_0 IO_L09N_0/VREF_0 IO_L09P_0 IO_L10N_0 IO_L10P_0 IO_L12N_0 FG400 Ball A3 A8 A12 C7 C10 E8 E13 E16 F13 F14 G7 C11 B17 C17 A18 A19 A17 A16 A15 B15 C14 D14 A13 A14 B13 C13 C12
0 0 Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
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Pinout Descriptions Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name IO_L12N_1/A11 IO_L12P_1/A12 IO_L13N_1/VREF_1 IO_L13P_1 IO_L14N_1/A9/RHCLK1 IO_L14P_1/A10/RHCLK0 IO_L15N_1/A7/RHCLK3/ TRDY1 IO_L15P_1/A8/RHCLK2 IO_L16N_1/A5/RHCLK5 IO_L16P_1/A6/RHCLK4/ IRDY1 IO_L17N_1/A3/RHCLK7 IO_L17P_1/A4/RHCLK6 IO_L18N_1/A1 IO_L18P_1/A2 IO_L19N_1/A0 IO_L19P_1 IO_L20N_1 IO_L20P_1 IO_L21N_1 IO_L21P_1 IO_L22N_1 IO_L22P_1 IO_L23N_1 IO_L23P_1 IO_L24N_1/VREF_1 IO_L24P_1 IO_L25N_1 IO_L25P_1 IO_L26N_1 IO_L26P_1 IO_L27N_1 IO_L27P_1 IO_L28N_1 IO_L28P_1 IO_L29N_1/LDC0 FG400 Ball M18 M17 L19 M19 L16 M16 L14 L15 K14 K13 J20 K20 K16 J16 J13 J14 J17 J18 H19 J19 H15 H16 H18 H17 H20 G20 G16 F16 F19 F20 F18 F17 D20 E20 D18
Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name IP_L14N_0 IP_L14P_0 IP_L17N_0/GCLK9 IP_L17P_0/GCLK8 IP_L20N_0 IP_L20P_0 IP_L23N_0 IP_L23P_0 IP_L26N_0 IP_L26P_0 IP_L29N_0 IP_L29P_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/VREF_1 IO_L03P_1 IO_L04N_1 IO_L04P_1 IO_L05N_1 IO_L05P_1 IO_L06N_1 IO_L06P_1 IO_L07N_1 IO_L07P_1 IO_L08N_1/VREF_1 IO_L08P_1 IO_L09N_1 IO_L09P_1 IO_L10N_1 IO_L10P_1 IO_L11N_1 IO_L11P_1 FG400 Ball B11 B12 G10 H10 G9 G8 C8 D8 E6 E7 A4 A5 B4 B10 B16 D7 D13 F10 U18 U17 T18 T17 V19 U19 W20 V20 R18 R17 T20 U20 P18 P17 P20 R20 P16 N16 N19 N18 N15 M15
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Type INPUT INPUT GCLK GCLK INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT VCCO VCCO VCCO VCCO VCCO VCCO DUAL DUAL DUAL DUAL VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O
Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Type DUAL DUAL VREF I/O RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL DUAL DUAL DUAL I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O DUAL
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Pinout Descriptions Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name IO_L29P_1/HDC IO_L30N_1/LDC2 IO_L30P_1/LDC1 IP IP IP IP IP IP IP IP IP IP IP IP IP/VREF_1 IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 IO IO IO IO IO IO IO IO IO/D5 IO/M1 IO/VREF_2 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 FG400 Ball E18 C19 C20 B20 G15 G18 H14 J15 L18 M20 N14 N20 P15 R16 R19 E19 K18 D19 G17 K15 K19 N17 T19 P8 P13 R9 R13 W15 Y5 Y7 Y13 N11 T11 Y3 Y17 V4 U4 V5 U5 Y4
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Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name IO_L04P_2 IO_L06N_2 IO_L06P_2 IO_L07N_2 IO_L07P_2 IO_L09N_2/VREF_2 IO_L09P_2 IO_L10N_2 IO_L10P_2 IO_L12N_2 IO_L12P_2 IO_L13N_2 IO_L13P_2 IO_L15N_2/D6/GCLK13 IO_L15P_2/D7/GCLK12 IO_L16N_2/D3/GCLK15 IO_L16P_2/D4/GCLK14 IO_L18N_2/D1/GCLK3 IO_L18P_2/D2/GCLK2 IO_L19N_2/DIN/D0 IO_L19P_2/M0 IO_L21N_2 IO_L21P_2 IO_L22N_2/VREF_2 IO_L22P_2 IO_L24N_2 IO_L24P_2 IO_L25N_2 IO_L25P_2 IO_L27N_2/A22 IO_L27P_2/A23 IO_L28N_2 IO_L28P_2 IO_L30N_2/A20 IO_L30P_2/A21 IO_L31N_2/VS1/A18 FG400 Ball W4 T6 T5 U7 V7 R7 T7 V8 W8 U9 V9 Y8 Y9 W10 W9 P10 R10 V11 V10 Y12 Y11 U12 V12 W12 W13 U13 V13 P14 R14 Y14 Y15 T15 U15 V16 U16 Y18
Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
Type DUAL DUAL DUAL INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT VREF VREF VCCO VCCO VCCO VCCO VCCO VCCO I/O I/O I/O I/O I/O I/O I/O I/O DUAL DUAL VREF VREF DUAL DUAL DUAL DUAL I/O
Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
Type I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O DUAL/ GCLK DUAL/ GCLK DUAL/ GCLK DUAL/ GCLK DUAL/ GCLK DUAL/ GCLK DUAL DUAL I/O I/O VREF I/O I/O I/O I/O I/O DUAL DUAL I/O I/O DUAL DUAL DUAL
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Pinout Descriptions Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name IO_L05N_3 IO_L05P_3 IO_L06N_3 IO_L06P_3 IO_L07N_3 IO_L07P_3 IO_L08N_3 IO_L08P_3 IO_L09N_3/VREF_3 IO_L09P_3 IO_L10N_3 IO_L10P_3 IO_L11N_3 IO_L11P_3 IO_L12N_3 IO_L12P_3 IO_L13N_3 IO_L13P_3 IO_L14N_3/LHCLK1 IO_L14P_3/LHCLK0 IO_L15N_3/LHCLK3/IRDY2 IO_L15P_3/LHCLK2 IO_L16N_3/LHCLK5 IO_L16P_3/LHCLK4/TRDY2 IO_L17N_3/LHCLK7 IO_L17P_3/LHCLK6 IO_L18N_3 IO_L18P_3 IO_L19N_3 IO_L19P_3 IO_L20N_3/VREF_3 IO_L20P_3 IO_L21N_3 IO_L21P_3 IO_L22N_3 IO_L22P_3 IO_L23N_3 IO_L23P_3 IO_L24N_3 IO_L24P_3 FG400 Ball F3 F4 F1 F2 G4 G3 G5 H5 H3 H2 H7 H6 J4 J3 J1 J2 J6 K6 K2 K3 L7 K7 L1 M1 L3 M3 M7 M8 M4 M5 N6 M6 N2 N1 P7 N7 N4 N3 R1 P1
Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name IO_L31P_2/VS2/A19 IO_L32N_2/CCLK IO_L32P_2/VS0/A17 IP IP IP_L02N_2 IP_L02P_2 IP_L05N_2 IP_L05P_2 IP_L08N_2 IP_L08P_2 IP_L11N_2 IP_L11P_2 IP_L14N_2/VREF_2 IP_L14P_2 IP_L17N_2/M2/GCLK1 IP_L17P_2/RDWR_B/ GCLK0 IP_L20N_2 IP_L20P_2 IP_L23N_2/VREF_2 IP_L23P_2 IP_L26N_2 IP_L26P_2 IP_L29N_2 IP_L29P_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 IO_L01N_3 IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3 IO_L04P_3 FG400 Ball W18 W19 Y19 T16 W3 Y2 W2 V6 U6 Y6 W6 R8 T8 T10 T9 P12 P11 T12 R12 T13 T14 V14 V15 W16 Y16 R11 U8 U14 W5 W11 W17 D2 D3 E3 E4 C1 B1 E1 D1
Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3
Type DUAL DUAL DUAL INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT VREF INPUT DUAL/ GCLK DUAL/ GCLK INPUT INPUT VREF INPUT INPUT INPUT INPUT INPUT VCCO VCCO VCCO VCCO VCCO VCCO I/O I/O VREF I/O I/O I/O I/O I/O
Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
Type I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O
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Pinout Descriptions Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name IO_L25N_3 IO_L25P_3 IO_L26N_3 IO_L26P_3 IO_L27N_3 IO_L27P_3 IO_L28N_3/VREF_3 IO_L28P_3 IO_L29N_3 IO_L29P_3 IO_L30N_3 IO_L30P_3 IP IP IP IP IP IP IP IP IP IP IP IP IP/VREF_3 IP/VREF_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND FG400 Ball R5 P5 T2 R2 R4 R3 T1 U1 T3 U3 V1 V2 F5 G1 G6 H1 J5 L5 L8 M2 N5 P3 T4 W1 K5 P6 E2 H4 L2 L6 P4 U2 A1 A11 A20 B7 B14 C3 C18 D10
R
Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DONE PROG_B TCK TDI TDO TMS FG400 Ball F6 F15 G2 G12 G19 H8 J9 J11 K1 K8 K10 K12 K17 L4 L9 L11 L13 L20 M10 M12 N13 P2 P9 P19 R6 R15 U11 V3 V18 W7 W14 Y1 Y10 Y20 V17 C2 D17 B3 B19 E17
Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 GND GND GND GND GND GND GND GND
Type I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT VREF VREF VCCO VCCO VCCO VCCO VCCO VCCO GND GND GND GND GND GND GND GND
Bank GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX
Type GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND CONFIG CONFIG JTAG JTAG JTAG JTAG
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Pinout Descriptions Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT FG400 Ball J12 K9 K11 L10 L12 M9 M11 M13 N8 N10 N12
Table 151: FG400 Package Pinout (Continued)
XC3S1200E XC3S1600E Pin Name VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT FG400 Ball D11 H12 J7 K4 L17 M14 N9 U10 H9 H11 H13 J8 J10
Bank VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT
Type VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT
Bank VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
Type VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
User I/Os by Bank
Table 152 indicates how the 304 available user-I/O pins are distributed between the four I/O banks on the FG400 package. Table 152: User I/Os Per Bank for the XC3S1200E and XC3S1600E in the FG400 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 78 74 78 74 304
All Possible I/O Pins by Type I/O 43 35 30 48 156 INPUT 20 12 18 12 62 DUAL 1 21 24 0 46 VREF 6 6 6 6 24 CLK 8 0(1) 0(1) 8 16
Footprint Migration Differences
The XC3S1200E and XC3S1600E FPGAs have identical footprints in the FG400 package. Designs can migrate between the XC3S1200E and XC3S1600E FPGAs without further consideration.
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Pinout Descriptions
R
FG400 Footprint
Left Half of Package (top view)
1 A
GND
Bank 0
2
I/O
L31N_0
3
I/O
4
INPUT
L29N_0
5
INPUT
L29P_0
6
I/O
L25N_0
7
I/O
L25P_0
8
I/O I/O
9
I/O
L18N_0 GCLK11
10
I/O
L18P_0 GCLK10
156 62 46
I/O: Unrestricted, general-purpose user I/O INPUT: Unrestricted, general-purpose input pin DUAL: Configuration pin, then possible user I/O VREF: User I/O or input
B
I/O
L03P_3
I/O
L31P_0
TDI
VCCO_0
I/O
L27N_0
I/O
L27P_0
GND
L22N_0 VREF_0
I/O
L22P_0
VCCO_0
C
I/O
L03N_3
PROG_B
GND
I/O
L32P_0
I/O
L30N_0 VREF_0
I/O
L28P_0
I/O
INPUT
L23N_0
I/O
L21N_0
I/O
D
I/O
L04P_3
I/O
L01N_3
I/O
L01P_3
I/O
L32N_0 HSWAP
I/O
L30P_0
I/O
L28N_0
VCCO_0
INPUT
L23P_0
I/O
L21P_0
GND I/O
L16N_0 GCLK7
E
I/O
L04N_3
I/O
VCCO_3 L02N_3 VREF_3
I/O
L02P_3
INPUT
INPUT
L26N_0
INPUT
L26P_0
I/O
I/O
L19P_0
24 voltage reference for bank 16
CLK: User I/O, input, or clock buffer input CONFIG: Dedicated
F
I/O
L06N_3
I/O
L06P_3
I/O
L05N_3
I/O
L05P_3
I/O INPUT GND
L24N_0 VREF_0
I/O
L24P_0
I/O
L19N_0
VCCO_0
G
INPUT
GND
I/O
L07P_3
I/O
L07N_3
I/O
L08N_3
INPUT
I/O
INPUT
L20P_0
INPUT
L20N_0
INPUT
L17N_0 GCLK9
2 configuration pins 4 port pins 42
H
JTAG: Dedicated JTAG
INPUT
I/O
L09P_3
I/O
L09N_3 VREF_3 VCCO_3
I/O
L08P_3
I/O
L10P_3
I/O
L10N_3
INPUT GND VCCINT
L17P_0 GCLK8
J
GND: Ground
I/O
L12N_3
I/O
L12P_3
I/O
L11P_3
I/O
L11N_3
INPUT
I/O
L13N_3
VCCAUX
VCCINT
GND
VCCINT
I/O
I/O
L14P_3 LHCLK0 VCCAUX
Bank 3
K
GND I/O
24 supply for bank 16 8 0
VCCO: Output voltage
L14N_3 LHCLK1
INPUT
VREF_3
I/O
L13P_3
I/O
L15P_3 LHCLK2
GND
VCCINT
GND
I/O
VCCO_3 L17N_3 LHCLK7
I/O GND INPUT
VCCO_3 L15N_3 LHCLK3 IRDY2
L
VCCINT: Internal core supply voltage (+1.2V)
L16N_3 LHCLK5
INPUT
GND
VCCINT
I/O
I/O INPUT
L17P_3 LHCLK6
M
VCCAUX: Auxiliary supply voltage (+2.5V)
L16P_3 LHCLK4 TRDY2
I/O
L19N_3
I/O
L19P_3
I/O
L20P_3
I/O
L18N_3
I/O
L18P_3
VCCINT
GND
N
N.C.: Not connected
I/O
L21P_3
I/O
L21N_3
I/O
L23P_3
I/O
L23N_3
I/O INPUT
L20N_3 VREF_3
I/O
L22P_3
VCCINT VCCAUX VCCINT I/O I/O GND
L16N_2 D3 GCLK15
P
I/O
L24P_3
GND
INPUT
VCCO_3
I/O
L25P_3
INPUT
VREF_3
I/O
L22N_3
R
I/O
L24N_3
I/O
L26P_3
I/O
L27P_3
I/O
L27N_3
I/O
L25N_3
I/O GND
L09N_2 VREF_2
INPUT
L11N_2
I/O I/O
L16P_2 D4 GCLK14
I/O
T
L28N_3 VREF_3
I/O
L26N_3
I/O
L29N_3
INPUT I/O
L01P_2 CSO_B
I/O
L06P_2
I/O
L06N_2
I/O
L09P_2
INPUT
L11P_2
INPUT
L14P_2
INPUT
L14N_2 VREF_2
U
I/O
L28P_3
VCCO_3
I/O
L29P_3
I/O
L03P_2 DOUT BUSY
INPUT
L05P_2
I/O
L07N_2
VCCO_2
I/O
L12N_2
VCCAUX
V
I/O
L30N_3
I/O
L30P_3
I/O GND
L01N_2 INIT_B
I/O
L03N_2 MOSI CSI_B VCCO_2
INPUT
L05N_2
I/O
L07P_2
I/O
L10N_2
I/O
L12P_2
I/O
L18P_2 D2 GCLK2
W
INPUT
INPUT
L02P_2
INPUT
I/O
L04P_2
INPUT
L08P_2
GND
I/O
L10P_2
I/O
L15P_2 D7 GCLK12
I/O
L15N_2 D6 GCLK13
Y
GND
INPUT
L02N_2
I/O
VREF_2
I/O
L04N_2
I/O
INPUT
L08N_2
I/O
I/O
L13N_2
I/O
L13P_2
GND
Bank 2
Figure 88: FG400 Package Footprint (top view)
DS312-4_08_101905
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DS312-4 (v3.4) November 9, 2006 Product Specification
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Pinout Descriptions
Bank 0
11
GND
12
I/O
13
I/O
L09N_0 VREF_0
14
I/O
L09P_0
15
I/O
L06N_0
16
I/O
L04P_0
17
I/O
L04N_0
18
I/O
L03N_0 VREF_0
19
I/O
L03P_0
20
GND
A
Right Half of Package (top view)
INPUT
L14N_0
INPUT
L14P_0
I/O
L10N_0
GND
I/O
L06P_0
VCCO_0
I/O
L01N_0
INPUT
TDO I/O
INPUT I/O
L30P_1 LDC1
B
I/O
VREF_0
I/O
L12N_0
I/O
L10P_0
I/O
L07N_0
INPUT
L05P_0
INPUT
L02N_0
I/O
L01P_0
GND I/O
L30N_1 LDC2
C
VCCAUX
I/O
L12P_0
VCCO_0
I/O
L07P_0
INPUT
L05N_0
INPUT
L02P_0
TCK
L29N_1 LDC0
VCCO_1
I/O
L28N_1
D
I/O
L16P_0 GCLK6
I/O
L13N_0
I/O
INPUT
L08N_0
INPUT
L08P_0
I/O I/O TMS
L29P_1 HDC
INPUT
VREF_1
I/O
L28P_1
E
I/O
L15P_0 GCLK4
I/O
L13P_0
I/O
I/O
GND
I/O
L25P_1
I/O
L27P_1
I/O
L27N_1
I/O
L26N_1
I/O
L26P_1
F
I/O
L15N_0 GCLK5
GND
INPUT
L11P_0
INPUT
L11N_0
INPUT
I/O
L25N_1
VCCO_1
INPUT
GND
I/O
L24P_1
G
VCCINT VCCAUX VCCINT I/O GND VCCINT
L19N_1 A0 L16P_1 A6 RHCLK4 IRDY1
INPUT
I/O
L22N_1
I/O
L22P_1
I/O
L23P_1
I/O
L23N_1
I/O
L21N_1
I/O
L24N_1 VREF_1
H
I/O
L19P_1
I/O INPUT
L18P_1 A2
I/O
L20N_1
I/O
L20P_1
I/O
L21P_1
I/O
L17N_1 A3 RHCLK7
J
I/O
I/O
L16N_1 A5 RHCLK5 L15N_1 A7 RHCLK3 TRDY1 VCCO_1
I/O
L18N_1 A1
VCCINT
GND
GND
VREF_1
VCCO_1
I/O
I/O
L15P_1 A8 RHCLK2
I/O
L14N_1 A9 RHCLK1 VCCAUX
I/O INPUT I/O
L12N_1 A11 L13N_1 VREF_1
GND
VCCINT
GND
GND
L
VCCINT
GND
VCCINT VCCAUX
I/O
L11P_1
I/O
L14P_1 A10 RHCLK0
I/O
L12P_1 A12
I/O
L13P_1
INPUT
M
I/O
D5
VCCINT INPUT
L17N_2 M2 GCLK1
GND
INPUT
I/O
L11N_1
I/O
L09P_1
VCCO_1
I/O
L10P_1
I/O
L10N_1
INPUT I/O
N
INPUT
L17P_2 RDWR_B GCLK0 VCCO_2
I/O
I/O
L25N_2
INPUT
I/O
L09N_1
I/O
L07P_1
I/O
L07N_1
GND
L08N_1 VREF_1
P
INPUT
L20P_2
I/O INPUT
L23N_2 VREF_2
I/O
L25P_2
GND
INPUT
I/O
L05P_1
I/O
L05N_1
INPUT
I/O
L08P_1
R
I/O
M1
INPUT
L20N_2
INPUT
L23P_2
I/O
L28N_2
I/O INPUT I/O
L30P_2 A21 L02P_1 A14
I/O
L02N_1 A13 VCCO_1
I/O
L06N_1
T
GND I/O
L18N_2 D1 GCLK3 VCCO_2
I/O
L21N_2
I/O
L24N_2
VCCO_2
I/O
L28P_2
I/O
L01P_1 A16
I/O
L01N_1 A15
I/O
L03P_1
I/O
L06P_1
U
I/O
L21P_2
I/O
L24P_2
INPUT
L26N_2
INPUT
L26P_2
I/O
L30N_2 A20
I/O DONE GND I/O
VCCO_2 L31P_2 VS2 A19 L03N_1 VREF_1
I/O
L04P_1
V
I/O
L22N_2 VREF_2
I/O
L22P_2
GND I/O
I/O I/O
L27P_2 A23
INPUT
L29N_2
I/O
L32N_2 CCLK
I/O
L04N_1
W
I/O
L19P_2 M0
I/O
L19N_2 DIN D0
I/O
L27N_2 A22
INPUT
L29P_2
I/O
VREF_2
I/O
L31N_2 VS1 A18
I/O
L32P_2 VS0 A17
GND
Y
Bank 2
DS312-4_09_101905
DS312-4 (v3.4) November 9, 2006 Product Specification
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Bank 1
INPUT
I/O
L17P_1 A4 RHCLK6
K
221
Pinout Descriptions
R
FG484: 484-ball Fine-pitch Ball Grid Array
The 484-ball fine-pitch ball grid array, FG484, supports the XC3S1600E FPGA. Table 153 lists all the FG484 package pins. They are sorted by bank number and then by pin name. Pairs of pins that form a differential I/O pair appear together in the table. The table also shows the pin number for each pin and the pin type, as defined earlier. An electronic version of this package pinout table and footprint diagram is available for download from the Xilinx website at http://www.xilinx.com/bvdocs/publications/s3e_pin.zip. Table 153: FG484 Package Pinout (Continued)
Bank 0 0 0 0 0 0 0 0 XC3S1600E Pin Name IO_L12P_0 IO_L13N_0 IO_L13P_0 IO_L15N_0 IO_L15P_0 IO_L16N_0 IO_L16P_0 IO_L18N_0/GCLK5 IO_L18P_0/GCLK4 IO_L19N_0/GCLK7 IO_L19P_0/GCLK6 IO_L21N_0/GCLK11 IO_L21P_0/GCLK10 IO_L22N_0 IO_L22P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0/VREF_0 IO_L25P_0 IO_L27N_0 IO_L27P_0 IO_L28N_0 IO_L28P_0 IO_L29N_0 IO_L29P_0 IO_L30N_0 IO_L30P_0 IO_L32N_0/VREF_0 IO_L32P_0 IO_L33N_0 IO_L33P_0 IO_L35N_0 IO_L35P_0 IO_L36N_0 IO_L36P_0 IO_L38N_0/VREF_0 IO_L38P_0 IO_L39N_0 IO_L39P_0 IO_L40N_0/HSWAP FG484 Ball A15 H14 G14 G13 F13 J13 H13 E12 F12 C12 B12 B11 C11 D11 E11 A9 A10 D10 C10 H8 H9 C9 B9 E9 D9 B8 A8 F7 F8 A6 A7 A4 A5 E7 D7 D6 D5 B4 B3 D4 Type I/O I/O I/O I/O I/O I/O I/O GCLK GCLK GCLK GCLK GCLK GCLK I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O DUAL
Pinout Table
Table 153: FG484 Package Pinout
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 IO IO IO IO IO IO IO IO IO IO IO IO/VREF_0 IO_L01N_0 IO_L01P_0 IO_L03N_0/VREF_0 IO_L03P_0 IO_L04N_0 IO_L04P_0 IO_L06N_0 IO_L06P_0 IO_L07N_0 IO_L07P_0 IO_L09N_0/VREF_0 IO_L09P_0 IO_L10N_0 IO_L10P_0 IO_L11N_0 IO_L11P_0 IO_L12N_0/VREF_0 XC3S1600E Pin Name FG484 Ball B6 B13 C5 C14 E16 F9 F16 G8 H10 H15 J11 G12 C18 C19 A20 A21 A19 A18 C16 D16 A16 A17 B15 C15 G15 F15 D14 E14 A14 Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O VREF
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
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Pinout Descriptions Table 153: FG484 Package Pinout (Continued)
Type I/O INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT GCLK GCLK INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT VCCO VCCO VCCO VCCO VCCO VCCO VCCO DUAL DUAL DUAL DUAL VREF I/O I/O I/O I/O 1 1 IO_L22N_1/A1 IO_L22P_1/A2 K22 L22 1 IO_L21P_1/A4/RHCLK6 L18 1 1 IO_L20P_1/A6/RHCLK4/ IRDY1 IO_L21N_1/A3/RHCLK7 L20 L19 1 IO_L20N_1/A5/RHCLK5 L21 1 1 1 IO_L18P_1/A10/RHCLK0 IO_L19N_1/A7/RHCLK3/ TRDY1 IO_L19P_1/A8/RHCLK2 N22 M16 M15 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 XC3S1600E Pin Name IO_L05P_1 IO_L06N_1 IO_L06P_1 IO_L07N_1/VREF_1 IO_L07P_1 IO_L08N_1 IO_L08P_1 IO_L09N_1 IO_L09P_1 IO_L10N_1 IO_L10P_1 IO_L11N_1 IO_L11P_1 IO_L12N_1/VREF_1 IO_L12P_1 IO_L13N_1 IO_L13P_1 IO_L14N_1 IO_L14P_1 IO_L15N_1 IO_L15P_1 IO_L16N_1/A11 IO_L16P_1/A12 IO_L17N_1/VREF_1 IO_L17P_1 IO_L18N_1/A9/RHCLK1 FG484 Ball W22 T19 T18 U20 U21 T22 U22 R19 R18 R16 T16 R21 R20 P18 P17 P22 R22 P15 P16 N18 N19 N16 N17 M20 N20 M22 Type I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O DUAL DUAL VREF I/O RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL RHCLK/ DUAL DUAL DUAL
Table 153: FG484 Package Pinout (Continued)
Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 XC3S1600E Pin Name IO_L40P_0 IP IP IP_L02N_0 IP_L02P_0 IP_L05N_0 IP_L05P_0 IP_L08N_0 IP_L08P_0 IP_L14N_0 IP_L14P_0 IP_L17N_0 IP_L17P_0 IP_L20N_0/GCLK9 IP_L20P_0/GCLK8 IP_L23N_0 IP_L23P_0 IP_L26N_0 IP_L26P_0 IP_L31N_0 IP_L31P_0 IP_L34N_0 IP_L34P_0 IP_L37N_0 IP_L37P_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 IO_L01N_1/A15 IO_L01P_1/A16 IO_L02N_1/A13 IO_L02P_1/A14 IO_L03N_1/VREF_1 IO_L03P_1 IO_L04N_1 IO_L04P_1 IO_L05N_1 FG484 Ball C4 B19 E6 D17 D18 C17 B17 E15 D15 D13 C13 A12 A13 H11 H12 F10 F11 G9 G10 C8 D8 C7 C6 A3 A2 B5 B10 B14 B18 E8 F14 G11 Y22 AA22 W21 Y21 W20 V20 U19 V19 V22
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Pinout Descriptions Table 153: FG484 Package Pinout (Continued)
Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 XC3S1600E Pin Name IO_L23N_1/A0 IO_L23P_1 IO_L24N_1 IO_L24P_1 IO_L25N_1 IO_L25P_1 IO_L26N_1 IO_L26P_1 IO_L27N_1 IO_L27P_1 IO_L28N_1/VREF_1 IO_L28P_1 IO_L29N_1 IO_L29P_1 IO_L30N_1 IO_L30P_1 IO_L31N_1 IO_L31P_1 IO_L32N_1 IO_L32P_1 IO_L33N_1 IO_L33P_1 IO_L34N_1 IO_L34P_1 IO_L35N_1 IO_L35P_1 IO_L36N_1 IO_L36P_1 IO_L37N_1/LDC0 IO_L37P_1/HDC IO_L38N_1/LDC2 IO_L38P_1/LDC1 IP IP IP IP IP IP IP IP IP FG484 Ball K17 K16 K19 K18 K15 J15 J20 J21 J17 J18 H21 H22 H20 H19 H17 G17 F22 G22 F20 G20 G18 G19 D22 E22 F19 F18 E20 E19 C21 C22 B21 B22 D20 F21 G16 H16 J16 J22 K20 L15 M18 Type DUAL I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O DUAL DUAL DUAL DUAL INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT
R
Table 153: FG484 Package Pinout (Continued)
Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 IP IP IP IP IP IP IP IP/VREF_1 IP/VREF_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 IO IO IO IO IO IO IO IO IO/D5 IO/M1 IO/VREF_2 IO/VREF_2 IO_L01N_2/INIT_B IO_L01P_2/CSO_B IO_L03N_2/MOSI/CSI_B IO_L03P_2/DOUT/BUSY IO_L04N_2 IO_L04P_2 IO_L06N_2 IO_L06P_2 IO_L07N_2 IO_L07P_2 IO_L09N_2/VREF_2 IO_L09P_2 IO_L10N_2 XC3S1600E Pin Name FG484 Ball N15 N21 P20 R15 T17 T20 U18 D21 L17 E21 H18 K21 L16 P21 R17 V21 Y8 Y9 AA10 AB5 AB13 AB14 AB16 AB18 AB11 AA12 AB4 AB21 AB3 AA3 Y5 W5 W6 V6 W7 Y7 U7 V7 V8 W8 T8 Type INPUT INPUT INPUT INPUT INPUT INPUT INPUT VREF VREF VCCO VCCO VCCO VCCO VCCO VCCO VCCO I/O I/O I/O I/O I/O I/O I/O I/O DUAL DUAL VREF VREF DUAL DUAL DUAL DUAL I/O I/O I/O I/O I/O I/O VREF I/O I/O
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Pinout Descriptions Table 153: FG484 Package Pinout (Continued)
Type I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O DUAL/ GCLK DUAL/ GCLK DUAL/ GCLK DUAL/ GCLK DUAL/ GCLK DUAL/ GCLK DUAL DUAL I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 XC3S1600E Pin Name IO_L35N_2/A22 IO_L35P_2/A23 IO_L36N_2 IO_L36P_2 IO_L38N_2/A20 IO_L38P_2/A21 IO_L39N_2/VS1/A18 IO_L39P_2/VS2/A19 IO_L40N_2/CCLK IO_L40P_2/VS0/A17 IP IP IP_L02N_2 IP_L02P_2 IP_L05N_2 IP_L05P_2 IP_L08N_2 IP_L08P_2 IP_L15N_2 IP_L15P_2 IP_L18N_2/VREF_2 IP_L18P_2 IP_L21N_2/M2/GCLK1 IP_L21P_2/RDWR_B/ GCLK0 IP_L24N_2 IP_L24P_2 IP_L31N_2/VREF_2 IP_L31P_2 IP_L34N_2 IP_L34P_2 IP_L37N_2 IP_L37P_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 IO_L01N_3 FG484 Ball AB17 AA17 W17 Y17 Y18 W18 AA20 AB20 W19 Y19 V17 AB2 AA4 Y4 Y6 AA6 AB7 AB6 Y10 W10 AA11 Y11 P12 R12 R13 T13 T15 U15 Y16 W16 AA19 AB19 T12 U9 V15 AA5 AA9 AA13 AA18 C1 Type DUAL DUAL I/O I/O DUAL DUAL DUAL DUAL DUAL DUAL INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT VREF INPUT DUAL/ GCLK DUAL/ GCLK INPUT INPUT VREF INPUT INPUT INPUT INPUT INPUT VCCO VCCO VCCO VCCO VCCO VCCO VCCO I/O
Table 153: FG484 Package Pinout (Continued)
Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 XC3S1600E Pin Name IO_L10P_2 IO_L11N_2 IO_L11P_2 IO_L12N_2 IO_L12P_2 IO_L13N_2/VREF_2 IO_L13P_2 IO_L14N_2 IO_L14P_2 IO_L16N_2 IO_L16P_2 IO_L17N_2 IO_L17P_2 IO_L19N_2/D6/GCLK13 IO_L19P_2/D7/GCLK12 IO_L20N_2/D3/GCLK15 IO_L20P_2/D4/GCLK14 IO_L22N_2/D1/GCLK3 IO_L22P_2/D2/GCLK2 IO_L23N_2/DIN/D0 IO_L23P_2/M0 IO_L25N_2 IO_L25P_2 IO_L26N_2/VREF_2 IO_L26P_2 IO_L27N_2 IO_L27P_2 IO_L28N_2 IO_L28P_2 IO_L29N_2 IO_L29P_2 IO_L30N_2 IO_L30P_2 IO_L32N_2 IO_L32P_2 IO_L33N_2 IO_L33P_2 FG484 Ball U8 AB8 AA8 W9 V9 R9 T9 AB9 AB10 U10 T10 R10 P10 U11 V11 T11 R11 W12 Y12 U12 V12 Y13 W13 U14 U13 T14 R14 Y14 AA14 W14 V14 AB15 AA15 W15 Y15 U16 V16
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Pinout Descriptions Table 153: FG484 Package Pinout (Continued)
Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 XC3S1600E Pin Name IO_L01P_3 IO_L02N_3/VREF_3 IO_L02P_3 IO_L03N_3 IO_L03P_3 IO_L04N_3 IO_L04P_3 IO_L05N_3 IO_L05P_3 IO_L06N_3 IO_L06P_3 IO_L07N_3 IO_L07P_3 IO_L08N_3/VREF_3 IO_L08P_3 IO_L09N_3 IO_L09P_3 IO_L10N_3 IO_L10P_3 IO_L11N_3 IO_L11P_3 IO_L12N_3 IO_L12P_3 IO_L13N_3/VREF_3 IO_L13P_3 IO_L14N_3 IO_L14P_3 IO_L15N_3 IO_L15P_3 IO_L16N_3 IO_L16P_3 IO_L17N_3 IO_L17P_3 IO_L18N_3/LHCLK1 IO_L18P_3/LHCLK0 IO_L19N_3/LHCLK3/IRDY2 IO_L19P_3/LHCLK2 IO_L20N_3/LHCLK5 IO_L20P_3/LHCLK4/TRDY2 IO_L21N_3/LHCLK7 IO_L21P_3/LHCLK6 FG484 Ball C2 D2 D3 E3 E4 E1 D1 F4 F3 G5 G4 F1 G1 G6 G7 H4 H5 H2 H3 H1 J1 J6 J5 J3 K3 J8 K8 K4 K5 K1 L1 L7 K7 L5 M5 M8 L8 N1 M1 M4 M3 Type I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK LHCLK
R
Table 153: FG484 Package Pinout (Continued)
Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 XC3S1600E Pin Name IO_L22N_3 IO_L22P_3 IO_L23N_3 IO_L23P_3 IO_L24N_3/VREF_3 IO_L24P_3 IO_L25N_3 IO_L25P_3 IO_L26N_3 IO_L26P_3 IO_L27N_3 IO_L27P_3 IO_L28N_3 IO_L28P_3 IO_L29N_3 IO_L29P_3 IO_L30N_3 IO_L30P_3 IO_L31N_3 IO_L31P_3 IO_L32N_3 IO_L32P_3 IO_L33N_3 IO_L33P_3 IO_L34N_3 IO_L34P_3 IO_L35N_3 IO_L35P_3 IO_L36N_3/VREF_3 IO_L36P_3 IO_L37N_3 IO_L37P_3 IO_L38N_3 IO_L38P_3 IP IP IP IP IP IP IP FG484 Ball N6 N7 P8 N8 N4 N5 P2 P1 R7 P7 P6 P5 R2 R1 R3 R4 T6 R6 U2 U1 T4 T5 W1 V1 U4 U3 V4 V3 W3 W2 Y2 Y1 AA1 AA2 F2 F5 G3 H7 J7 K2 K6 Type I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O VREF I/O I/O I/O I/O I/O INPUT INPUT INPUT INPUT INPUT INPUT INPUT
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Pinout Descriptions Table 153: FG484 Package Pinout (Continued)
Type INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT VREF VREF VCCO VCCO VCCO VCCO VCCO VCCO VCCO GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Bank GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND XC3S1600E Pin Name FG484 Ball L13 M10 M14 M17 M21 N11 N13 P4 P9 P11 P14 P19 T2 T21 U6 U17 V10 V13 Y3 Y20 AA7 AA16 AB1 AB12 AB22 AA21 B1 E17 B2 B20 D19 D12 E5 E18 K14 L4 M19 N9 V5 V18 W11 Type GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND CONFIG CONFIG JTAG JTAG JTAG JTAG VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX
Table 153: FG484 Package Pinout (Continued)
Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND IP IP IP IP IP IP IP IP IP IP/VREF_3 IP/VREF_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND XC3S1600E Pin Name FG484 Ball M2 M6 N3 P3 R8 T1 T7 U5 W4 L3 T3 E2 H6 J2 M7 N2 R5 V2 A1 A11 A22 B7 B16 C3 C20 E10 E13 F6 F17 G2 G21 J4 J9 J12 J14 J19 K10 K12 L2 L6 L9
VCCAUX DONE VCCAUX PROG_B VCCAUX TCK VCCAUX TDI VCCAUX TDO VCCAUX TMS VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX
DS312-4 (v3.4) November 9, 2006 Product Specification
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227
Pinout Descriptions Table 153: FG484 Package Pinout (Continued)
Bank VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S1600E Pin Name FG484 Ball J10 K9 K11 K13 L10 L11 L12 L14 M9 Type VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
R
Table 153: FG484 Package Pinout (Continued)
Bank VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT XC3S1600E Pin Name FG484 Ball M11 M12 M13 N10 N12 N14 P13 Type VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
User I/Os by Bank
Table 154 indicates how the 304 available user-I/O pins are distributed between the four I/O banks on the FG484 package. Table 154: User I/Os Per Bank for the XC3S1600E in the FG484 Package Package Edge Top Right Bottom Left TOTAL
Notes:
1. The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
I/O Bank 0 1 2 3
Maximum I/O 94 94 94 94 376
All Possible I/O Pins by Type I/O 56 50 45 63 214 INPUT 22 16 18 16 72 DUAL 1 21 24 0 46 VREF 7 7 7 7 28 CLK 8 0(1) 0(1) 8 16
Footprint Migration Differences
The XC3S1600E FPGA is the only Spartan-3E device offered in the FG484 package.
228
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DS312-4 (v3.4) November 9, 2006 Product Specification
R
Pinout Descriptions
FG484 Footprint
Left Half of Package (top view)
1 A
GND
Bank 0
2
INPUT
L37P_0
3
INPUT
L37N_0
4
I/O
L35N_0
5
I/O
L35P_0
6
I/O
L33N_0
7
I/O
L33P_0
8
I/O
L30P_0
9
I/O
L24N_0
10
I/O
L24P_0
11
GND I/O
B
PROG_B
TDI
I/O
L39P_0
I/O
L39N_0
VCCO_0
I/O
GND
I/O
L30N_0
I/O
L28P_0
VCCO_0
L21N_0 GCLK11
214 general-purpose user I/O
INPUT: User I/O or
I/O: Unrestricted,
C
I/O
L01N_3
I/O
L01P_3
GND
I/O
L40P_0
I/O
INPUT
L34P_0
INPUT
L34N_0
INPUT
L31N_0
I/O
L28N_0
I/O
L25P_0
I/O
L21P_0 GCLK10
72 reference resistor input for
bank DUAL: Configuration pin,
D
I/O
L04P_3
I/O
L02N_3 VREF_3
I/O
L02P_3
I/O
L40N_0 HSWAP
I/O
L38P_0
I/O
L38N_0 VREF_0
I/O
L36P_0
INPUT
L31P_0
I/O
L29P_0
I/O
L25N_0 VREF_0
I/O
L22N_0
46 then possible user I/O 28 16 2
E
I/O
L04N_3
VCCO_3
I/O
L03N_3
I/O
L03P_3
VCCAUX
INPUT
I/O
L36N_0
VCCO_0
I/O
L29N_0
GND
I/O
L22P_0
VREF: User I/O or input voltage reference for bank CLK: User I/O, input, or clock buffer input
F
I/O
L07N_3
INPUT
I/O
L05P_3
I/O
L05N_3
I/O INPUT GND I/O
L08N_3 VREF_3 L32N_0 VREF_0
I/O
L32P_0
I/O
INPUT
L23N_0
INPUT
L23P_0
G
I/O
L07P_3
GND
INPUT
I/O
L06P_3
I/O
L06N_3
I/O
L08P_3
I/O
INPUT
L26N_0
INPUT
L26P_0
VCCO_0
H
I/O
L11N_3
I/O
L10N_3
I/O
L10P_3
I/O
L09N_3
I/O
L09P_3
VCCO_3
INPUT
I/O
L27N_0
I/O
L27P_0
INPUT I/O
L20N_0 GCLK9
CONFIG: Dedicated configuration pins JTAG: Dedicated JTAG
J
I/O
L11P_3
I/O
VCCO_3 L13N_3 VREF_3
GND
I/O
L12P_3
I/O
L12N_3
INPUT
I/O
L14N_3
GND
VCCINT
I/O
4 port pins 48
K
I/O
L16N_3
INPUT
I/O
L13P_3
I/O
L15N_3
I/O
L15P_3
INPUT
I/O
L17P_3
I/O
L14P_3
VCCINT
GND
VCCINT
GND: Ground
Bank 3
L
I/O
L16P_3
GND
INPUT
VREF_3
I/O
VCCAUX L18N_3 LHCLK1
GND
I/O
L17N_3
I/O
L19P_3 LHCLK2
GND
VCCINT VCCINT
28 supply for bank
VCCO: Output voltage
I/O
I/O INPUT
L21P_3 LHCLK6
I/O
L21N_3 LHCLK7
I/O
L18P_3 LHCLK0
I/O INPUT
VCCO_3 L19N_3 LHCLK3 IRDY2
M
L20P_3 LHCLK4 TRDY2
VCCINT
GND
VCCINT
16 supply voltage (+1.2V) 10 voltage (+2.5V) 0
VCCAUX: Auxiliary supply
VCCINT: Internal core
I/O
I/O
VCCO_3
N
L20N_3 LHCLK5
INPUT
L24N_3 VREF_3
I/O
L24P_3
I/O
L22N_3
I/O
L22P_3
I/O
L23P_3
VCCAUX
VCCINT
GND
P
I/O
L25P_3
I/O
L25N_3
INPUT
GND
I/O
L27P_3
I/O
L27N_3
I/O
L26P_3
I/O
L23N_3
GND I/O
I/O
L17P_2
GND I/O
L20P_2 D4 GCLK14
N.C.: Not connected
R
I/O
L28P_3
I/O
L28N_3
I/O
L29N_3
I/O
L29P_3
VCCO_3
I/O
L30P_3
I/O
L26N_3
INPUT
L13N_2 VREF_2
I/O
L17N_2
T
INPUT
GND
INPUT
VREF_3
I/O
L32N_3
I/O
L32P_3
I/O
L30N_3
INPUT
I/O
L10N_2
I/O
L13P_2
I/O
L16P_2
I/O
L20N_2 D3 GCLK15
U
I/O
L31P_3
I/O
L31N_3
I/O
L34P_3
I/O
L34N_3
INPUT
GND
I/O
L07N_2
I/O
L10P_2
VCCO_2
I/O
L16N_2
I/O
L19N_2 D6 GCLK13
V
I/O
L33P_3
VCCO_3
I/O
L35P_3
I/O
L35N_3
VCCAUX
I/O
L04P_2
I/O
L07P_2
I/O
L09N_2 VREF_2
I/O
L12P_2
I/O GND
L19P_2 D7 GCLK12 VCCAUX
W
I/O
L33N_3
I/O
L36P_3
I/O
L36N_3 VREF_3
I/O INPUT
L03P_2 DOUT BUSY
I/O
L04N_2
I/O
L06N_2
I/O
L09P_2
I/O
L12N_2
INPUT
L15P_2
Y A A A B
I/O
L37P_3
I/O
L37N_3
GND I/O
L01P_2 CSO_B
INPUT
L02P_2
I/O
L03N_2 MOSI CSI_B VCCO_2
INPUT
L05N_2
I/O
L06P_2
I/O
I/O
INPUT
L15N_2
INPUT
L18P_2
I/O
L38N_3
I/O
L38P_3
INPUT
L02N_2
INPUT
L05P_2
GND
I/O
L11P_2
INPUT
VCCO_2
I/O
L18N_2 VREF_2
I/O GND INPUT
L01N_2 INIT_B
I/O
VREF_2
I/O
INPUT
L08P_2
INPUT
L08N_2
I/O
L11N_2
I/O
L14N_2
I/O
L14P_2
I/O
D5
Bank 2
DS312_10_101905
Figure 89: FG484 Package Footprint (top view)
DS312-4 (v3.4) November 9, 2006 Product Specification
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229
Pinout Descriptions
R
Bank 0
12
INPUT
L17N_0
13
INPUT
L17P_0
14
I/O
L12N_0 VREF_0
15
I/O
L12P_0
16
I/O
L07N_0
17
I/O
L07P_0
18
I/O
L04P_0
19
I/O
L04N_0
20
I/O
L03N_0 VREF_0
21
I/O
L03P_0
22
GND I/O
L38P_1 LDC1
A
Right Half of Package (top view)
I/O
L19P_0 GCLK6
I/O I/O
VCCO_0 L09N_0 VREF_0
GND
INPUT
L05P_0
I/O
VCCO_0
INPUT
TDO
L38N_1 LDC2
B
I/O
L19N_0 GCLK7
INPUT
L14P_0
I/O
I/O
L09P_0
I/O
L06N_0
INPUT
L05N_0
I/O
L01N_0
I/O
L01P_0
I/O GND
L37N_1 LDC0
I/O
L37P_1 HDC
C
VCCAUX
INPUT
L14N_0
I/O
L11N_0
INPUT
L08P_0
I/O
L06P_0
INPUT
L02N_0
INPUT
L02P_0
TMS
INPUT
INPUT
VREF_1
I/O
L34N_1
D
I/O
L18N_0 GCLK5
GND
I/O
L11P_0
INPUT
L08N_0
I/O
TCK
VCCAUX
I/O
L36P_1
I/O
L36N_1
VCCO_1
I/O
L34P_1
E
I/O
L18P_0 GCLK4
I/O
L15P_0
VCCO_0
I/O
L10P_0
I/O
GND
I/O
L35P_1
I/O
L35N_1
I/O
L32N_1
INPUT
I/O
L31N_1
F
I/O
VREF_0
I/O
L15N_0
I/O
L13P_0
I/O
L10N_0
INPUT
I/O
L30P_1
I/O
L33N_1
I/O
L33P_1
I/O
L32P_1
GND I/O
L28N_1 VREF_1
I/O
L31P_1
G
INPUT
L20P_0 GCLK8
I/O
L16P_0
I/O
L13N_0
I/O
INPUT
I/O
L30N_1
VCCO_1
I/O
L29P_1
I/O
L29N_1
I/O
L28P_1
H
GND
I/O
L16N_0
GND
I/O
L25P_1
INPUT
I/O
L27N_1
I/O
L27P_1
GND
I/O
L26N_1
I/O
L26P_1
INPUT I/O
J
GND
VCCINT VCCAUX
I/O
L25N_1
I/O
L23P_1
I/O
L23N_1 A0
I/O
L24P_1
I/O
L24N_1
INPUT I/O
VCCO_1
L22N_1 A1
K
VCCINT
GND
VCCINT INPUT I/O
VCCO_1
VREF_1
L22P_1 A2
VCCINT VCCINT
GND
L19P_1 A8 RHCLK2
L19N_1 A7 RHCLK3 TRDY1
I/O
I/O GND I/O
L16P_1 A12
I/O GND
L18N_1 A9 RHCLK1
INPUT
VCCAUX
L17N_1 VREF_1
M
I/O VCCINT INPUT
L21N_2 M2 GCLK1
GND
VCCINT INPUT
L16N_1 A11
I/O
L15N_1
I/O
L15P_1
I/O
L17P_1
I/O INPUT
L18P_1 A10 RHCLK0
N
VCCINT
GND
I/O
L14N_1
I/O
L14P_1
I/O
L12P_1
I/O
L12N_1 VREF_1
GND
INPUT
VCCO_1
I/O
L13N_1
P
INPUT
L21P_2 RDWR_B GCLK0 VCCO_2
INPUT
L24N_2
I/O
L27P_2
INPUT INPUT
L31N_2 VREF_2
I/O
L10N_1
VCCO_1
I/O
L09P_1
I/O
L09N_1
I/O
L11P_1
I/O
L11N_1
I/O
L13P_1
R
INPUT
L24P_2
I/O
L27N_2
I/O
L10P_1
INPUT
I/O
L06P_1
I/O
L06N_1
INPUT I/O
L07N_1 VREF_1
GND
I/O
L08N_1
T
I/O
L23N_2 DIN D0
I/O
L26P_2
I/O
L26N_2 VREF_2
INPUT
L31P_2
I/O
L33N_2
GND
INPUT
I/O
L04N_1
I/O
L07P_1
I/O
L08P_1
U
I/O
L23P_2 M0
GND
I/O
L29P_2
VCCO_2
I/O
L33P_2
INPUT
VCCAUX
I/O
L04P_1
I/O
L03P_1
VCCO_1
I/O
L05N_1
V
I/O
L22N_2 D1 GCLK3
I/O
L25P_2
I/O
L29N_2
I/O
L32N_2
INPUT
L34P_2
I/O
L36N_2
I/O
L38P_2 A21
I/O
L40N_2 CCLK
I/O
L03N_1 VREF_1
I/O
L02N_1 A13
I/O
L05P_1
W
I/O
L22P_2 D2 GCLK2
I/O
L25N_2
I/O
L28N_2
I/O
L32P_2
INPUT
L34N_2
I/O
L36P_2
I/O
L38N_2 A20
I/O
L40P_2 VS0 A17
I/O GND I/O
L39N_2 VS1 A18 L02P_1 A14
I/O
L01N_1 A15
Y A A A B
I/O
M1
VCCO_2
I/O
L28P_2
I/O
L30P_2
I/O GND
L35P_2 A23 VCCO_2
INPUT
L37N_2
I/O DONE
L01P_1 A16
GND
I/O
I/O
I/O
L30N_2
I/O I/O
L35N_2 A22
I/O
INPUT
L37P_2
I/O
L39P_2 VS2 A19
I/O
VREF_2
GND
Bank 2
DS312_11_101905
230
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Bank 1
INPUT
I/O
L21P_1 A4 RHCLK6
I/O
L21N_1 A3 RHCLK7
L20P_1 A6 RHCLK4 IRDY1
I/O
L20N_1 A5 RHCLK5
I/O
L
DS312-4 (v3.4) November 9, 2006 Product Specification
R
Pinout Descriptions
Revision History
The following table shows the revision history for this document. Date 03/01/05 03/21/05 Version 1.0 1.1 Initial Xilinx release. Added XC3S250E in the CP132 package to Table 128. Corrected number of differential I/O pairs on CP132. Added pinout and footprint information for the CP132, FG400, and FG484 packages. Removed IRDY and TRDY pins from the VQ100, TQ144, and PQ208 packages. Corrected title of Table 152. Updated differential pair numbering for some pins in Bank 0 of the FG400 package, affecting Table 151 and Figure 88. Pin functionality and ball assignment were not affected. Added Package Thermal Characteristics section. Added package mass values to Table 124. Included I/O pins, not just input-only pins under the VREF description in Table 123. Clarified that some global clock inputs are Input-only pins in Table 123. Added information on the XC3S100E in the CP132 package, affecting Table 128, Table 129, Table 132, Table 133, Table 135, and Figure 82. Ball A12 on the XC3S1600E in the FG320 package a full I/O pin, not an Input-only pin. Corrected the I/O counts for the XC3S1600E in the FG320 package, affecting Table 128, Table 149, Table 150, and Figure 87. Corrected pin type for XC3S1600E balls N14 and N15 in Table 147. Minor text edits. Added package thermal data for the XC3S100E in the CP132 package to Table 129. Corrected pin migration arrows for balls E17 and F4 between the XC3S500E and XC3S1600E in Table 150. Promoted Module 4 to Production status. Synchronized all modules to v3.4. Revision
11/23/05
2.0
03/22/06
3.0
05/19/06 11/09/06
3.1 3.4
DS312-4 (v3.4) November 9, 2006 Product Specification
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